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Shenzhen International Electronic Circuit ExhibitionCatalog consultation

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Fair basics
Shenzhen International Electronic Circuit ExhibitionPast exhibitors
- Printed Circuit Board Manufacturers and Electronic Assembly Companies: Zhizhuo Feigao, Shenzhen Pulin Circuit, Jinfubao, Tiancheng Industry & Trade, YingSu, Texin, Zhisheng, Tianjun, Yuanzhuo Micronano, Global, Bangzheng, Dongwei, Baode, Beijia, Kaima, Dacheng Low-Carbon, Dongfang Yuzhiguang, Jinlong, Jiuchuan, Yuzhou, Mude, Jiejun, Yingyan, Guanghua Technology, Anmet, Zhengtianwei, Hafu, Wangping Precision, Lixuan, WKK, Asia Electroplating, Jiantao, Xundede, Weijia, Qunyi, Xinqi Micro-Assembly, Haochuangsheng, Baofengtang, Sijie, Mingda, Yinghua, XACT, Carl Zeiss, Amiba, YueNiu, Jinjing Electronics
- New Exhibitors for 2025: Dingtai High-Tech, Rixiang, Mingyu, Yingjiecang, JinCun, Dushen, Jiujun Transmission, Senquan, Handing, Qiaosixin, Innotek, Zhongyao, Yongshengxin, Hongflu, Zaili Technology, Xinpeng, Maiwude, Jinshuntiancheng, WeiYi, BoKa, Shuiqing, Aoma, Houya, Jixiang, Datian, Baofang, Kangjun, SuYingshi, Hechuan, Zhengzhi, Wuyang, Shandong Guoci
- Equipment Suppliers: Dazhu, Ketian International, Wangshi Gangjian, Siwo, Zhengye, Xinwu, Masilan, Juchen Circuit
- Environmental Protection and Cleanliness Zone: Qinhua Environment, Qixin Environmental Protection
- International Exhibitors: Kyocera, XACT, WKK, Carl Zeiss, and others
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Industry scope
Applications of Printed Circuit Boards: Automotive, telecommunications products, computer-related products, consumer electronics, military/aerospace, industrial/medical/application software, and others
Printed Circuit Boards: Connector PCBs, high-density interconnect printed circuit boards, IC packaging substrates (BGA/CSP/bump‑on‑chip, etc.), rigid single‑sided boards, rigid double‑sided and multilayer boards, rigid‑flex boards, flexible printed circuit boards, and others
Printed Circuit Boards/Smart Automation Equipment: PCB CAD/CAM systems, pre‑production preparation processes, inner and outer layer imaging and circuit design processes, lamination processes, CNC mechanical drilling processes, CNC high‑density laser drilling processes, electroplating and chemical plating processes, automated operations and robotic systems, contour machining, AOI/AVI and other board‑related inspection processes, surface treatment and post‑processing procedures, solder mask printing processes, and others
Eco‑Friendly Cleanroom Technologies and Equipment: Eco‑friendly cleanroom production technologies and equipment, water treatment and recycling technologies and equipment, cleanroom technologies and equipment, waste‑recycling and regeneration systems, cleaning systems and equipment, fume control and emission management systems (Copyright of this content belongs to Juzhan; unauthorized forwarding is prohibited)
PCB Raw Materials/Chemicals: Thin‑film circuit design and related chemicals, resin systems and prepreg laminates, glass fiber cloth, fabrics, carbon fiber, copper foil, CNC drill bits, dry film and photoresist liquids, as well as related chemical supplies, electroplating agents for copper, tin, gold, and other metals, surface‑treatment chemicals, screen‑printing inks and photosensitive solder masks, inks, and others
Electronic Assembly Processes: Design, consulting, and testing services, contract manufacturing services, REACH/RoHS compliance services, CAD/CAE/CAM systems, components, connectors and fasteners, stencil‑printing equipment, component‑preparation and placement equipment, assembly equipment, dispensing equipment, reflow‑soldering equipment, cleaning equipment, manual soldering processes and associated chemicals and equipment, soldering‑related chemicals and equipment, wire‑bonding equipment, testing, measurement, and inspection equipment, rework and repair equipment, drilling, routing, and machining equipment, and others

