Shenzhen International Electronic Circuit Exhibition Tickets

The Shenzhen International Electronic Circuit Exhibition (HKPCA Show), under the theme “Digital + AI = Connecting the World,” is leading the industry in leveraging innovative technologies to achieve sustainable development in the digital era. The event offers a one-stop platform to showcase cutting-edge products and technological solutions across the printed circuit board and electronic assembly supply chain, including groundbreaking innovations driven by digitalization. This year’s edition has

The Exhibition Value of the Shenzhen International Electronic Circuit Exhibition (HKPCA Show)

• One of the Most Influential Leading Trade Shows in the Global PCB and Electronic Assembly Industries: The Hong Kong Printed Circuit Association (HKPCA) organizes the International Electronic Circuit (Shenzhen) Exhibition (HKPCA Show), which has been successfully held for more than twenty editions since its inception in 2002. It is one of the largest and most influential specialized exhibitions in the global PCB and electronic assembly sectors. Anchored in Shenzhen and reaching out worldwide, the event is widely recognized by the industry as a barometer of global electronic circuit industry development and a core platform for collaborative innovation across the value chain.
• A One-Stop Showcase Covering the Entire Industry Chain: The exhibition features nine thematic zones, including PCB manufacturers, equipment suppliers, raw material providers, an electronics assembly area, a smart manufacturing zone, an environmental protection and clean‑tech section, a packaging and testing technology pavilion, a precision components and parts area, and a Japan–Korea zone. Spanning from upstream raw materials and midstream manufacturing to downstream assembly and packaging/testing, the show comprehensively presents the “materials–manufacturing–assembly–packaging/testing” full‑chain structure, enabling exhibitors to seamlessly connect with customers through technical demonstrations, brand exposure, and business negotiations.
• Precise Access to Global Key Buyers and Industry‑Chain Resources: The event brings together PCB and PCBA manufacturers, EMS/ODM/OEM players, and professional buyers from automotive electronics, consumer electronics, telecommunications, semiconductor packaging and testing, among other fields, serving over 70 countries and regions worldwide. In 2025, the exhibition attracted international buyers from nearly 70 countries and regions, including South Korea, Japan, the United States, Germany, the United Kingdom, Brazil, Southeast Asia, and others—among them top 50 global electronics manufacturing service providers, Asia‑Pacific procurement headquarters of Fortune 500 technology companies, and internationally renowned automotive and mobile phone manufacturers. Exhibitors can directly engage with some of the world’s most powerful purchasing audiences.
• Unique Value for Chinese and International Enterprises—A Strategic Engine Connecting Global Business Opportunities: The HKPCA Show serves not only as a central platform for global PCB companies to showcase technologies and connect with customers but also as a vital gateway for overseas buyers to access China’s cutting‑edge PCB technologies and benchmark products. The exhibition builds an efficient commercial bridge between international buyers and exhibitors, with frequent on‑site equipment signings and order negotiations; many companies secured orders ranging from hundreds of thousands to millions of yuan during the event.
• A Vanguard for Technological Innovation and Industry Trends: The exhibition focuses on two key themes—AI and high‑frequency/high‑speed technologies—highlighting breakthrough innovations across the entire value chain, from upstream materials and core equipment to midstream manufacturing and downstream applications. Hot topics include advanced HDI, glass‑substrate fabrication, high‑frequency/high‑speed materials, AI‑driven smart production, lithography and inspection equipment, and state‑of‑the‑art packaging and testing technologies. A newly launched dedicated packaging and testing zone aims to break down technical barriers between PCB manufacturing and final packaging, helping the industry address the complex challenges of high‑end production.
• In‑Depth Linkages Between High‑End Forums and Industry Resources: Concurrent with the exhibition, international technical conferences and the “Smart Manufacturing of PCBs: AI Trends and Innovative Technologies” conference are held, featuring experts from authoritative institutions such as Prismark, five research institutes under the Ministry of Industry and Information Technology, ZTE, TTM, and senior executives from leading enterprises. These events delve into hot topics like AI‑driven smart manufacturing, advanced packaging, IC substrates, and high‑speed interconnects, offering nearly 40 high‑quality presentations that provide exhibitors with cutting‑edge technological insights and strategic decision‑making guidance.