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China (Beijing) International Semiconductor ExpoCatalog consultation

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Fair basics
China (Beijing) International Semiconductor ExpoPast exhibitors
- Chinese Semiconductor Equipment Companies: NAURA, AMEC, Shengmei Semiconductor, Shanghai Micro Electronics, Kexi Tong, Zhongke Feice, RuiLi Scientific Instruments, Huahai Qingke, Tuojing Technology, Xinyuan Micro, Zhi Chun Technology, Wanye Enterprise
- Wafer Fabrication and IDM Companies: HuaHong Group, CR Microelectronics, ChangXin Memory, Wuhan Xinxin, Silan Micro, Wingtech Technology, Yangtze Memory, JCET, BYD Semiconductor
- Packaging and Testing Companies: ChangElec, Tongfu Microelectronics, Huatian Technology, Weice Technology, Liyang Chip, Qipai Technology
- IC Design and EDA/IP Companies: Huawei HiSilicon, HuaDa Jiutian, Loongson China, Unisoc, GigaDevice, Fudan Microelectronics, National Chip Technology, VeriSilicon, Gailun Electronics, Guangli Micro, SiRuiPu, NaCore, Sanbang Shares
- Compound Semiconductors and Power Devices: Sanan Optoelectronics, Wingtech Technology (onsemi), CR Microelectronics, Silan Micro, Yangjie Technology, JieJie Microelectronics, Xinjieneng, Dongwei Semiconductor
- Materials Companies: Shanghai Silicon Industry, Zhonghuan Shares, LiangMicro, Jiangfeng Electronics, Anji Technology, Huater Gas, Jingrui Electronic Materials, Nanda Optoelectronics, Dinglong Shares, Youyan New Materials, ShenGong Shares
- International Giants: Applied Materials, Kewa International Trading, DISCO Technology, Tokyo Seimitsu, Samsung Semiconductor, SK Hynix, Micron Semiconductor, Thermo Fisher Scientific, Keysight Technologies, Weidmüller, KEYENCE
- Regional Industry Exhibition Groups: Shaanxi Semiconductor Association Exhibition Group (including Xi’an Ziguang Guoxin, Longteng Semiconductor, Pairui Shares, Borui Jixin, etc.), Shandong Semiconductor Business Association Exhibition Group, Jiangsu Exhibition Group, Zhejiang Exhibition Group
- Research Institutes and Universities: CETC, Institute of Microelectronics, Chinese Academy of Sciences, Institute of Semiconductors, Chinese Academy of Sciences, Beijing University of Science and Technology, Tsinghua University, Peking University, Fudan University, Xi’an University of Electronic Science and Technology
Industry scope
Semiconductor Equipment Pavilion: Showcases key chip-manufacturing equipment such as lithography machines, etching tools, electron-beam lithography systems, and thin-film deposition units, while highlighting their technical principles, performance specifications, and the latest R&D breakthroughs.
Semiconductor Materials Pavilion: Displays a wide range of materials essential for chip fabrication, including silicon wafers, photoresists, photomasks, and specialty electronic gases.
Semiconductor Ecosystem Services Pavilion: Highlights green and smart manufacturing solutions, facility construction, warehousing and logistics, testing, cleanroom technologies, pumps and valves, industrial investment, legal support, and other ancillary services, fostering industry collaboration and integrated resource coordination.
Specialty Process Pavilion: Covers specialized manufacturing processes such as RF chip fabrication, power semiconductor production, and MEMS device development, along with applications of these advanced technologies in 5G communications, new-energy vehicles, sensor manufacturing, and other fields.
Logic and Memory: Demonstrates the production workflows for logic and memory chips, featuring equipment and technologies used in critical steps such as lithography, etching, and ion implantation.
Compound Semiconductor Pavilion: Introduces major compound semiconductor materials, including gallium arsenide, indium phosphide, gallium nitride, silicon carbide, diamond, and gallium oxide.
Semiconductor Components Pavilion: Focuses on showcasing innovative applications of semiconductors across automotive, energy storage, smart terminals, and other sectors.
Semiconductor Industry Chain Pavilion: Divided into five thematic zones—semiconductor materials, electronic components, design, equipment, manufacturing, and packaging & testing—it provides a comprehensive overview of cutting-edge products and state-of-the-art technologies spanning the entire semiconductor value chain.

