China (Beijing) International Semiconductor Expo

The 22nd China International Semiconductor Exhibition (IC China 2025) was successfully held from November 23 to 25 at the Beijing National Convention Center. Co-organized by the China Semiconductor Industry Association and the China Academy of Information and Communications Technology, the event was themed “Converging Chips, Uniting Forces—Driving the Future,” making it the semiconductor industry’s most significant annual platform for technological exchange and business matchmaking.

Exhibition Space and Exhibitor Numbers Reach New Highs. This year’s show spanned 40,000 square meters, attracting more than 600 exhibitors from around the globe, covering every link in the semiconductor value chain—from materials and equipment to design, manufacturing, and packaging & testing. The opening ceremony was attended by Gao Dongsheng, Chief Economist of the Ministry of Industry and Information Technology; Su Bo, Deputy Director of the National Strategic Advisory Committee on Building a Manufacturing Powerhouse; Academician Zhang Yue of the Chinese Academy of Sciences; and Ko Jong-wan, Deputy Secretary-General of the Korea Semiconductor Industry Association, among others. The exhibition welcomed over 26,000 professional visitors, with both exhibitor numbers and visitor attendance hitting record highs.

International and Leading‑Edge Presence Among Exhibitors. Domestic industry leaders such as North Huachuang, AMEC, Shengmei Semiconductor, HuaDa Jiutian, ChangXin Memory, HuaHong Group, JCET, and Tongfu Microelectronics were all present. Global giants—including Lam Research, Samsung Electronics, DISCO Corporation, KOTI International, and Tokyo Seimitsu—showcased their latest technologies. Local trade associations like the Shaanxi Semiconductor Association and the Shandong Semiconductor Chamber of Commerce organized regional pavilions, highlighting distinctive regional industrial strengths. Additionally, national-level institutions such as the China Electronic Engineering Design Institute and Beijing Electronic Measurement Equipment also made prominent appearances.

Seven Thematic Zones for Comprehensive Coverage of the Entire Value Chain. The exhibition featured seven major zones: the Industrial Chain Zone, the Innovative Applications Zone, the Collaborative Services Zone, the Components Zone, the Regional Highlights Zone, the Overseas Zone, and the Industry–Education Integration Zone. The Innovative Applications Zone emerged as a standout area, encompassing hot topics such as the AI “Chip” Era and Intelligent Computing Power, the “Optical” Age, Vehicle‑Chip Connectivity, Embodied Intelligence and Robotics, Commercial Aerospace/Low‑Altitude Operations, and Next‑Generation Energy Storage, creating immersive interactive experiences. Meanwhile, the Industry–Education Integration Zone collaborated with domestic and international universities to showcase talent‑development achievements and host on-site recruitment events, supplying the industry with high‑caliber professionals.

A Rich Calendar of Concurrent Conferences and Events. With a “4+2+3+N” framework as its guiding principle, the event hosted major forums including the 7th Global IC Entrepreneurs Conference, the 8th China Microelectronics Talent Summit, and the 23rd Annual Conference on Semiconductor Packaging and Testing Technologies and Markets. Thematic forums focused on cutting-edge areas such as AI and large‑model chips, innovations and applications in semiconductor equipment, and collaborative innovation across the silicon material supply chain, directly addressing critical challenges related to computing power ecosystems, equipment reliability, and new material development. Concurrent sessions also included investment and financing forums, as well as international dialogues such as the Brazil–Southeast Asia Semiconductor Industry Cooperation Forum.

Frontier Technologies Take Center Stage. At the opening ceremony, Academician Zhang Yue of the Chinese Academy of Sciences delivered a keynote address titled “The Future of ‘Chips’ in the Post‑Moore Era,” systematically outlining a roadmap for the development of two-dimensional semiconductor materials and devices, emphasizing the importance of seizing the historic opportunity presented by the transition to advanced process nodes. The exhibition showcased groundbreaking advancements in AI chips, advanced packaging, wide‑bandgap semiconductors, Chiplets, and other frontier technologies, with numerous companies unveiling new products.

Strong Response from Exhibitors and the Industry. North Huachuang highlighted its 12‑inch etching equipment and process solutions; Shengmei Semiconductor demonstrated its single‑wafer cleaning systems and TEBO megasonic cleaning technology; and Kaishitong unveiled its iStella‑500 series of low‑energy, high‑current ion implanters. Phoenix Contact, participating for the first time, presented its latest applications in comprehensive connectivity, reliable power supply, and signal conversion, earning widespread acclaim from industry peers. Overall, exhibitors reported that the event attracted high‑quality professional buyers and fostered a vibrant atmosphere for technical exchanges.

Attendees agreed that IC China, as the semiconductor industry’s most influential annual trade show in China, has become a strategic platform for companies to showcase cutting-edge technologies, connect with customers, gain insights into emerging trends, and expand their market reach. Held at a pivotal moment marking the beginning of the 15th Five-Year Plan, the exhibition aligns closely with national strategies aimed at strengthening scientific and technological innovation, building a modern industrial system, and ensuring the security and stability of industrial and supply chains. The next edition of IC China is scheduled to take place again at the Beijing National Convention Center in 2026.