
China (Beijing) International Semiconductor ExpoIC China
China (Beijing) International Semiconductor Expo Profile
China Beijing International Semiconductor Exhibition (IC China) cordially invites semiconductor industry players from home and abroad to gather in Beijing, connect with industry resources, explore technological trends, and seize opportunities presented by the next wave of development.
From advanced process technologies to cutting-edge packaging, from computing chips to third-generation semiconductors, collaborative innovation across the entire value chain is accelerating. Integrated circuits have become a critical foundation for future industrial growth. As the global industrial landscape undergoes reshaping and domestic innovation capabilities continue to strengthen, how to achieve technological breakthroughs, foster resource synergy, and expand market reach has become the industry’s central focus.
This year’s exhibition is planned to span 50,000 square meters, bringing together over 800 high-quality domestic and international companies and attracting more than 100,000 professional visitors for on-site networking and exchanges. The event will cover core segments of the semiconductor industry chain, including integrated circuit design, semiconductor materials, manufacturing equipment, wafer fabrication, packaging and testing, power devices, third-generation semiconductors, AI computing chips,automotive‑grade chips, sensors, and end‑application solutions.
The China Beijing International Semiconductor Exhibition (IC China) places equal emphasis on both scale and quality. It will bring together government authorities, industry associations, research institutes, end‑use manufacturers, industrial parks, investment firms, and key enterprises spanning the upstream and downstream segments of the supply chain, creating a more targeted environment for business collaboration.
Compared with traditional exhibitions that aim for broad audience coverage, IC China focuses more sharply on core industry resources, offering companies more precise customer matchmaking, more efficient business negotiations, and greater opportunities for cross‑industry partnerships—helping them further enhance brand visibility and strengthen market competitiveness.
At present, the global semiconductor industry is entering a new phase of development, while China’s integrated circuit sector stands at a pivotal juncture marked by independent innovation and high‑quality growth. For businesses, IC China is not only a major industry event but also an essential platform for showcasing technological prowess, expanding strategic collaborations, and seizing market opportunities.
China Beijing International Semiconductor Exhibition (IC China)will host an Entrepreneurship Summit, inviting leaders from the Ministry of Industry and Information Technology and the Shanghai Municipal Government, as well as chairpersons or CEOs of international giants such as Intel, Qualcomm, Arm, Samsung, Micron, NXP, and Renesas, alongside leading Chinese executives from SMIC, Tsinghua Unigroup, Huawei, Shanghai HuaHong Group, and ChangElec. Together, they will discuss pressing topics including global IC industry trends, cross‑border supply chain collaboration, and pathways for China’s IC sector development.
Exhibitor List
China (Beijing) International Semiconductor Expo Product Range
Semiconductor Equipment Pavilion: Showcases key chip-manufacturing equipment such as lithography machines, etching tools, electron-beam lithography systems, and thin-film deposition units, while highlighting their technical principles, performance specifications, and the latest R&D breakthroughs.
Semiconductor Materials Pavilion: Displays a wide range of materials essential for chip fabrication, including silicon wafers, photoresists, photomasks, and specialty electronic gases.
Semiconductor Ecosystem Services Pavilion: Highlights green and smart manufacturing solutions, facility construction, warehousing and logistics, testing, cleanroom technologies, pumps and valves, industrial investment, legal support, and other ancillary services, fostering industry collaboration and integrated resource coordination.
Specialty Process Pavilion: Covers specialized manufacturing processes such as RF chip fabrication, power semiconductor production, and MEMS device development, along with applications of these advanced technologies in 5G communications, new-energy vehicles, sensor manufacturing, and other fields.
Logic and Memory: Demonstrates the production workflows for logic and memory chips, featuring equipment and technologies used in critical steps such as lithography, etching, and ion implantation.
Compound Semiconductor Pavilion: Introduces major compound semiconductor materials, including gallium arsenide, indium phosphide, gallium nitride, silicon carbide, diamond, and gallium oxide.
Semiconductor Components Pavilion: Focuses on showcasing innovative applications of semiconductors across automotive, energy storage, smart terminals, and other sectors.
Semiconductor Industry Chain Pavilion: Divided into five thematic zones—semiconductor materials, electronic components, design, equipment, manufacturing, and packaging & testing—it provides a comprehensive overview of cutting-edge products and state-of-the-art technologies spanning the entire semiconductor value chain.
China (Beijing) International Semiconductor Expo Booth Sales

China (Beijing) International Semiconductor Expo Ticket Sales


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Standard booth Configuration

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China (Beijing) International Semiconductor Expo Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition


















