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Printed Electronics Exhibition in Munich, GermanyCatalog consultation
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Fair basics
Industry scope
Materials: substrates, conductors, semiconductors, dielectrics, encapsulation materials, resins and adhesives, and other materials
Manufacturing Processes: quality patterning technologies, digital printing, other printing processes, photolithography, laser processing, coating technologies, photo‑induced processing, material‑feeding and mixing techniques, cleanroom technologies, roll‑to‑roll processing, and other manufacturing processes
Electronic Assembly and Packaging, System Integration: electronic assembly and packaging, lamination, electronic assembly and packaging, system integration, and hybrid systems
Equipment: transistors, diodes, passive components, integrated circuits, displays, photovoltaic cells, sensors, storage devices, antennas, battery packs, hybrid system components, and other equipment (All content herein is copyrighted by Juzhan; unauthorized reproduction is prohibited.)
Applications and Services: IT backplanes, displays, loudspeakers, and other applications; consulting services, manufacturing, technical literature, technical publishers, and other services
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