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China (Shanghai) International Semiconductor Equipment Exhibition NEPCON

NEPCON China

Dates
Show Hours:
Venue
shanghai World Expo Exhibition & Center
Highlights
A leading international trade show in the electronics manufacturing sector covering the entire value chain from surface-mount technology and semiconductor packaging & testing to smart factories.
Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

China (Shanghai) International Semiconductor Equipment Exhibition NEPCON Same Period Exhibition

Exhibition Data

1/1
Edition
60000㎡
Exhibition area
800
Exhibitors
45000
Visitors

Shanghai Electronics Expo Details

China (Shanghai) International Semiconductor Equipment Exhibition, NEPCON, serves as a key platform in the electronics manufacturing sector, bringing together more than 20 renowned global manufacturers, including YAMAHA and Hanwha, to showcase cutting-edge technologies in surface mount technology, test and measurement, soldering, dispensing and coating, as well as smart factory automation. The event highlights demonstration lines for PCBA, semiconductor packaging and testing, and advanced packaging processes, addressing the needs of three major device categories: integrated circuits, optical modules, and power modules. In addition, dedicated Vietnam and Thailand National Days are featured to help companies seize new opportunities in the Southeast Asian market.
Industry:
Electronics fairShanghaiElectronics Expo
Organizer:
China Council for the Promotion of International Trade, Electronics Information Industry Branch
City:
Shanghai
Venue:
shanghai World Expo Exhibition & Center
Address:
No. 1099 Guo Zhan Road, Pudong New Area, Shanghai

Profile

The China Shanghai International Electronic Production Equipment & Microelectronics Industry Exhibition (NEPCON China) serves as a leading indicator for the electronics manufacturing sector. Under the new theme “New Business, New Opportunities,” it is meticulously designed to bring together high‑quality, cutting‑edge resources, enhance brand value, and facilitate efficient business development, presenting a series of innovative highlights.

NEPCON China will showcase international top‑tier brands across the entire spectrum of electronic manufacturing, with concentrated displays spanning surface mount technology, test and measurement, soldering, dispensing and coating, smart factory solutions, automation technologies, and semiconductor packaging and testing. It will also feature world‑first demonstrations and advanced solutions covering every stage of the electronics manufacturing process—PCBA, semiconductor packaging and testing, and smart factories—inviting attendees to partake in this grand feast of future‑oriented intelligence.

In addition, NEPCON China has partnered with the IC Packaging Fair to create innovative demonstration lines showcasing encapsulation and testing processes tailored to different device categories. By addressing the specific packaging requirements of integrated circuits, optical modules, and power modules, these customized exhibits help companies unlock new opportunities.

Onsite, a diversified program combining conferences, competitions, innovation showcases, and dedicated matchmaking sessions will bring together industry leaders from electronics manufacturing, semiconductors, automotive, new energy, IoT, AI, and other fields to discuss emerging standards, technologies, and applications, jointly witnessing and driving the thriving evolution of the electronics manufacturing sector.

Amid the global wave of manufacturing efficiency transformation, technological breakthroughs are converging in a remarkable surge. Over 20 renowned global manufacturers—including YAMAHA, Hanwha, BTU, ASYS, Schunk, Universa Robots, Fanuc, Parmi, Viscom, and ViTrox—will make their exclusive debut at NEPCON China, sharing cutting‑edge technologies and real‑world application cases in areas such as pick‑and‑place, soldering, testing, printing, robotics, and panel separation, inspiring limitless creativity and innovation among industry professionals.

To further penetrate the burgeoning Southeast Asian markets, the exhibition has assembled 50 Vietnamese manufacturers and 20 Thai manufacturers, launching flagship national‑day events dedicated to Vietnam and Thailand. Through technical seminars, business‑to‑business matchmaking, and on‑site factory visits, the event will provide an in‑depth analysis of local market needs and investment prospects, exploring new technologies and collaborative opportunities to fuel industry innovation and global growth. The China Shanghai International Electronic Production Equipment & Microelectronics Industry Exhibition (NEPCON China) stands ready to witness the dawn of a new era in electronics manufacturing!

China (Shanghai) International Semiconductor Equipment Exhibition NEPCON tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

Partial exhibitor directory and exhibitor list for China (Shanghai) International Semiconductor Equipment Exhibition NEPCON: 大族激光科技产业集团股份有限公司, 上海世能精密机械有限公司, 埃用仪器(苏州)有限公司, 汕尾市栢林电子封装材料有限公司, 快克智能装备股份有限公司, 宁波亦唐智能科技有限公司, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

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The Exhibition Value of NEPCON China (China International Electronic Production Equipment Exhibition)

  • A Long‑Standing, Widely Influential Professional Event in China’s Electronics Manufacturing Sector: Since its inaugural edition in Shanghai in 1985, NEPCON China has been successfully held for more than thirty sessions, establishing itself as one of the largest and most established trade and procurement platforms in the fields of surface mount technology and electronic manufacturing automation. Co‑organized by the Electronic Information Industry Branch of the China Council for the Promotion of International Trade and Reed Exhibitions, the event is widely recognized within the industry as a leading indicator of China’s electronics manufacturing development and a pivotal gateway for global electronic production equipment entering the Asian market.
  • A One‑Stop Showcase Covering the Entire Industry Chain: The exhibition encompasses the full spectrum of the electronics manufacturing value chain, including SMT surface mounting, soldering and dispensing/coating, testing and measurement, semiconductor packaging and testing, electronic materials, smart factory and automation technologies, and electronic manufacturing services. From printing, component placement, soldering, and inspection to rework, and from traditional electronics manufacturing to cutting‑edge applications such as automotive electronics, semiconductors, new energy, artificial intelligence, and humanoid robotics, exhibitors can seamlessly connect with their target audiences—whether for technology demonstrations, brand exposure, or business negotiations.
  • Precise Access to Global Core Buyers and Decision‑Makers in Electronics Manufacturing: The event attracts professional buyers from 57 countries and regions, including Japan, Germany, Indonesia, Malaysia, Thailand, and beyond. The last edition drew nearly 1,000 overseas buyers, with over 45,000 professional visitors. Attendees span procurement decision‑makers and technical leaders across EMS/OEM/ODM, consumer electronics, automotive electronics, communications electronics, industrial control, medical electronics, and other application areas, as well as key purchasing executives from OSAT companies. Exhibitors gain direct access to the core customer base of the global electronics manufacturing supply chain, enabling efficient business matchmaking and market expansion.
  • Unique Value for Chinese Enterprises: A Strategic Engine for Showcasing Indigenous Technologies and Expanding into Global Markets: As the world’s largest producer of electronic products, China’s electronics manufacturing sector is currently undergoing a critical transition—from “scale expansion” to “intelligent manufacturing.” NEPCON China serves as a central platform for Chinese manufacturers to showcase proprietary technologies, engage with international clients, and enhance brand visibility. The exhibition brings together over 20 globally renowned original equipment manufacturers, including YAMAHA, Hanwha, BTU, ASYS, Schunk, Universal Robots, Fanuc, Parmi, Viscom, and ViTrox, alongside leading domestic players such as Nitto Denko, Kaco, Kaige, Silicore, and Haimu Xing. With international giants and homegrown brands competing side by side, the show vividly highlights both the technological sophistication and competitive dynamics of the electronics manufacturing industry.
  • A Hub for Technological Innovation and Cutting‑Edge Applications: At the exhibition, hot topics include core components of humanoid robots, disassembly of automotive electronics and low‑altitude aerial vehicles, advanced semiconductor packaging, and AI‑driven intelligent manufacturing. For the first time at the 2025 edition, a dedicated “Humanoid Robot Core Component Disassembly Zone” will be established, showcasing Unitree G1, Tianlian T1 Pro, Zhiyuan’s six major humanoid robots, along with more than 35 core components. Meanwhile, the Automotive Electronics & Low‑Altitude Flight Core Component Disassembly Zone will feature three thematic experience areas—smart sensing, low‑altitude flight, and intelligent cockpits—displaying over 20 core components, with Zeekr 007GT making its debut on the show floor. Upgraded semiconductor packaging and testing lines will present state‑of‑the‑art equipment, such as fully automated nano‑silver sintering furnaces, fully automated coarse wire bonding machines, and ultrasonic scanning microscopes. These cutting‑edge displays provide exhibitors with an invaluable window into industry trends and opportunities to seize technological leadership.
  • In‑Depth Connections through High‑Profile Forums and Industry Resources: Concurrent with the exhibition, more than 20 specialized conferences will take place, including the SMTA East China High‑Tech Series, the AI‑Empowered Electronics Manufacturing Technology Summit, the Intelligent Automotive Domain Control and LiDAR Innovation Manufacturing Forum, and the Advanced Semiconductor Packaging Technology and Applications Conference. Prominent speakers from institutions such as the China Academy of Information and Communications Technology, IBM, Lenovo, SAIC Group, and Hesai Technology will offer in‑depth insights into AI trends, automotive electronics applications, and international cooperation opportunities. Exhibitors can promptly access critical information on industry policies, technical standards, and market trends.
  • An International Platform for Southeast Asian Market Expansion: The exhibition features a special “National Day” program, bringing together 50 Vietnamese local manufacturers and 20 Thai local manufacturers. Through technical seminars, business matchmaking, and on‑site factory visits, participants gain deep insights into regional needs and investment opportunities. Over 20 Thai enterprises and industry associations—including the Thai Subcontracting Promotion Association and TKC Progress—will convene during Thailand Day events, providing strategic pathways for exhibitors seeking to expand into the Southeast Asian market.
  • Shanghai’s Geographical and Industrial Advantages: As China’s economic hub and a center of technological innovation, Shanghai boasts the nation’s most comprehensive exhibition infrastructure and a highly convenient global transportation network.
Leveraging Shanghai’s industrial agglomeration advantages in fields such as integrated circuits, new-energy vehicles, and artificial intelligence, NEPCON China offers exhibitors a strategically positioned platform for connecting with both the domestic and global electronics manufacturing markets.
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Range

  • Internationally Renowned Brands: YAMAHA, Hanwha, BTU, ASYS, Schunk, Universal Robots, Fanuc, Parmi, Viscom, ViTrox, SICK, Universal Robots, Fanuc, KIC, Rehm Thermal Systems, Delix, Weishike, PVA, Indium, AIM Solder, SMIC, Huayu Automotive, Hesai Technology, Kulisofa, Osram, PMP, Allwinner AI, Weiyi Intelligent Manufacturing, Qiangnao Technology, Qiongche Intelligence, Zheta Technology
  • Surface Mount and Soldering Equipment: Nitto, Kuaike Intelligent, Kaige, Silikang, Luyuan, Sanjie Machinery, Shifang, Yitang, Rigen, Kangbei'er, Angke, Pumashi, Gureide, Isailente, Zeda, Haimuxing, Xiongke, Heluo, Newlink Technology, Rehm Thermal Systems, Kuaike Xin
  • Semiconductor Packaging and Testing: Hanwha, Zhongke Tongzhi, Shangjin, Weizhu, Hongqixin, Jingtong Technology, Qili Semiconductor, Tiancheng Advanced, Ruijie Micro, Weice, Huanxu Electronics
  • Testing and Measurement: Delix, RiLian Technology, Sanjie, Isailente, Banshi Intelligent, Weishike, Qingting Optoelectronics, Sanying Precision, Lijiafeng, Huayan, Jieliao
  • Smart Factories and Automation: Siemens, Fanuc, Universal Robots, Xiongke, Xingwang Yuanzhi, Sick, Newlink Technology, CSSC Pengli, Lingtu Technology, Anlu Technology, Huiwen Technology, Xianji Semiconductor, Manplus, Xindao, Naxinwei, Huayan Robotics
  • Electronic Materials and ESD Protection: Kaishide, Tengjia, Zhaocai, Kegaojing, Hengsheng, Chenlong, Ceracote
  • Leading Enterprises from Mainland China: Nitto Technology, Kuaike Intelligent, Kaige Precision, Silikang, Haimuxing, Zhongke Tongzhi, Luyuan, Weizhu, Shangjin, Hongqixin, Newlink Technology, Yitang Technology, Xingwang Yuanzhi, Pumashi, Gureide, Isailente, Zeda
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Review

The 33rd NEPCON China—China International Exhibition on Electronic Production Equipment and the Microelectronics Industry—was successfully held from April 22 to 24 at the Shanghai World Expo Exhibition & Convention Center.Co-organized by the Electronics Information Industry Branch of the China Council for the Promotion of International Trade and Reed Exhibitions, this year’s event was themed “New Business Opportunities in Electronic Manufacturing” and stood as Asia’s premier annual forum for technological exchange and business matchmaking in the electronics manufacturing sector.

Spanning 40,000 square meters, the exhibition brought together nearly 800 exhibiting companies. Over 20 globally renowned brands—including YAMAHA, Hanwha, BTU, ASYS, Schunk, Universal Robots, Fanuc, Parmi, Viscom, and ViTrox—made their exclusive debut at NEPCON China, showcasing cutting-edge technologies and application cases in areas such as surface-mount technology, soldering, testing, printing, robotics, and board separation. Nearly 1,000 overseas buyers from 57 countries and regions, including Japan, Germany, Indonesia, Malaysia, and Thailand, attended the show, while the event welcomed more than 45,000 professional visitors.

The disassembly zone for core components of humanoid robots emerged as the highlight of this year’s exhibition.For the first time, the exhibition featured a dedicated area where six full‑scale humanoid robot platforms were showcased, including the Marathon champion “TianGong,” Unitree G1, Tianlian T1 Pro, Guyue OriginMan, the Mars Beauty Robot, and Zhiyuan’s six humanoid models. Additionally, 35 key components—such as Aoyi Technology’s ROHand dexterous hand, Xiangjia Intelligent’s humanoid robot head module, Wuhan Lingtu’s line‑laser sensor, Anlu Technology’s FPGA, Huiwen Technology’s electronic nose, Xianji Semiconductor’s joint servo solution, Manplus joint encoders, CSSC Pengli’s 3D industrial camera, Xindao power devices, and Huayan Robotics’ joint modules—were displayed collectively.

The disassembly zone for automotive electronics and low‑altitude flight core components also drew significant attention.This section featured three thematic experience zones—intelligent sensing, low‑altitude flight, and smart cockpits—showcasing over 20 core components. The Zeekr 007 GT made its public debut at the exhibition. At the NEPCON Forum on Innovative Manufacturing Technologies for Intelligent Vehicle Domain Controllers and LiDAR, technical leaders from SAIC Group, RoboSense, Huayu Automotive, Geely Auto, and other companies shared cutting‑edge insights and real‑world application examples.

Semiconductor packaging and testing lines demonstrated state‑of‑the‑art processes.Hanwha, Zhongke Tongzhi, Shangjin, Weizu, Silikang, Luyuan, Hongqi Xin, Kuaike Xin, and other enterprises jointly presented advanced packaging equipment, including the Sin270 fully automated nano‑silver sintering furnace, the Taurus fully automated coarse‑wire bonding machine, the GRD‑CS3 ultrasonic scanning microscope, the TFV‑300 vacuum formic acid welding system, the CPM‑FS10 multi‑chip hybrid mounting machine, and the HS‑M2 fully automated high‑speed jet ball‑placement machine. The Semiconductor Packaging and Testing Conference invited representatives from Qili Semiconductor, Jingtong Technology, Ruidet Heat, RingX Electronics, Weice, and other companies to share new breakthroughs in advanced packaging technologies.

The S‑Factory Expo intelligent factory and automation technology zone gathered more than 30 Japanese automation‑related suppliers, unveiling world‑first advanced equipment and materials. Leading firms such as SICK, Universal Robots, Ubiquitous, and FANUC showcased their latest innovations in automation. Meanwhile, the China Electrostatic Protection Industry Exhibition featured 60 companies debuting patented products on site, alongside events marking the 20th anniversary of the Shanghai Electrostatic Protection Industry Association and a forum on electrostatic protection supporting smart manufacturing.

The AI‑Empowered Electronic Manufacturing Technology Summit brought together experts from the China Academy of Information and Communications Technology, IBM, Lenovo, and the Fifth Research Institute of the Ministry of Industry and Information Technology to provide an in‑depth analysis of AI trends.The SMTA East China High‑Tech Series Conference invited AIM Solder, ZTE, Indium Tech, Angke, Kuaike Intelligent, Ruidet Heat, and other companies to share global technology trends. Concurrently, the “Kuaike Cup” National Welding Skills Competition for the electronics manufacturing industry and the “ESAMBER Yibo Cup” Board‑Level Fault Analysis and Repair Skills Competition were held.

Thailand Day activities brought together over 20 Thai domestic electronics manufacturers and industry associations, focusing on hot topics such as electronics industry upgrading and supply chain optimization. TD LOGY, MAKIPOS ELECTRONICS, Flextronics, Jabil, Dahua Technology, Luxshare, Bosch, and Zhongda Electronics—along with numerous overseas corporate groups—visited the exhibition. On the day of the event, more than 400 procurement meetings were arranged, helping companies forge new collaborative opportunities.

Exhibiting companies generally reported that the quality of professional buyers was high and their purchasing intentions clear, with many securing significant orders during the show.Attendees noted that, driven by the rapid growth of emerging industries such as artificial intelligence, humanoid robotics, the low‑altitude economy, and new energy, the electronics manufacturing sector is entering a new cycle of technological advancement. As China’s longest‑running and most influential specialized trade fair in the field, NEPCON China has become a strategic platform for companies to showcase cutting‑edge technologies, connect with customers, gain market insights, and expand into global markets.

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NEPCON China Exhibitior List

China (Shanghai) International Semiconductor Equipment Exhibition NEPCON Range

SMT Technology and Equipment:
  • Printing Equipment and Accessories ,
  • Component Feeding Systems ,
  • Conveyor Systems and Accessories ,
  • Chip Carriers ,
  • Adhesives and Coating Materials ,
  • Related Chemicals ,
  • Production Line Tools and Equipment ,
  • PCB Manufacturing and Assembly
Soldering Equipment and Materials:
  • Wave Soldering Equipment ,
  • Reflow Soldering Equipment ,
  • Tin-Plating Equipment ,
  • Solder Pots/Solder Pastes/Solder Wires/Lead Bars/Solder Balls ,
  • Adhesives (Red Adhesive/Yellow Adhesive/Black Adhesive) ,
  • Fluxes ,
  • Hot-Air Soldering Equipment ,
  • Infrared Soldering Equipment ,
  • Laser Soldering Equipment ,
  • Ultrasonic Soldering Equipment ,
  • Vapor-Phase Soldering Equipment ,
  • Soldering Guns ,
  • Solder Joint Inspection Equipment ,
  • Solder Joint Reliability Testing Systems ,
  • Desoldering Systems ,
  • Cleaning Equipment and Materials
Testing and Measurement:
  • 2D/3D Inspection Systems ,
  • Bare PCB Inspection Equipment ,
  • Electronic Component Visual Inspection Equipment ,
  • Film Thickness Measurement Equipment ,
  • ICT Equipment ,
  • AOI Equipment ,
  • Infrared Inspection Equipment ,
  • Chip Frame Inspection Equipment ,
  • Optical Microscopes ,
  • PCB Visual Inspection Equipment ,
  • Solder Joint Visual Inspection Equipment ,
  • Temperature and Humidity Testing/Environmental Testing Equipment ,
  • Viscometers/Oscilloscopes/Thermometers ,
  • X-Ray Equipment ,
  • Functional Testing Equipment
Automation Equipment:
  • Robotic and Motion Control Equipment ,
  • Automation Equipment/Accessories ,
  • Conveying Equipment ,
  • Assembly Equipment and Materials
Anti-Static Purification Equipment:
  • Electrostatic Field Testers ,
  • Surface Resistance Testers ,
  • Wrist Straps/Wrist Strap Testers ,
  • Multi-Function Testers ,
  • Electrostatic Generator Rods ,
  • Anti-Static Work Mats ,
  • Anti-Static Industrial Floor Tiles ,
  • Anti-Static Fabrics ,
  • Static Eliminators ,
  • Cleanroom Paper/Cleanroom Cloths ,
  • Anti-Conductive/Anti-Static Plastics ,
  • Transfer Racks/Transfer Carts ,
  • Ionizing Air Guns/Dust-Proof Testing Equipment ,
  • Walk-In Testing Chambers ,
  • High/Low Temperature/Constant-Temperature Testing Equipment ,
  • Humid Heat Testing Equipment ,
  • Drying (Aging) Testing Equipment ,
  • Impact Testing Equipment ,
  • Centrifugal Testing Equipment ,
  • Exhaust Gas Treatment ,
  • Air Purification ,
  • Cleanrooms ,
  • Water Purification Systems ,
  • Purification Engineering ,
  • Electromagnetic Shielding Elimination Equipment ,
  • Circuit Board Production
Circuit Board Manufacturing:
  • Circuit Board Manufacturing Equipment and Materials ,
  • Poster Printing Equipment and Materials ,
  • Smart Terminal Manufacturers ,
  • Software Service Providers ,
  • Smart Circuit Board Automation Equipment ,
  • New Materials for Circuit Boards ,
  • Label Printing Technology
Labels and Narrow-Width Screen Printing Machinery:
  • Barcode Printing Machinery and Equipment ,
  • RFID Tag Technology Equipment ,
  • Smart Labels ,
  • In-Mold Labels and Materials ,
  • Self-Adhesive Materials, Adhesives, and Hot-Melt Glue Equipment ,
  • Label Anti-Counterfeiting Technologies ,
  • Security Solutions and Applications ,
  • Ink ,
  • Verification Equipment ,
  • Calibration Equipment ,
  • Inspection Equipment and Accessories ,
  • Label Printing Materials

Booth Sales

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3 Years Booth Sales

2027 Shanghai Electronics Ticket Sales

Shanghai Electronics Venue

shanghai World Expo Exhibition & Center
Address: No. 1099 Guo Zhan Road, Pudong New Area, Shanghai
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shanghai World Expo Exhibition & Center实景图
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shanghai World Expo Exhibition & Center实拍图
shanghai World Expo Exhibition & Center实拍图

Shanghai Electronics Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition