Technological Innovations in the Infrastructure Layer (Computing Power, Storage, Networking, and Liquid Cooling)

Computing Power and AI Hardware: CPUs, GPUs, AI accelerator chips, DPUs, AI servers, cluster architectures, and high-speed interconnect technologies (such as optical interconnects like NPO, CPO, and XPO), among others

Storage and SSDs: NVMe SSDs, high-endurance SSDs, AI training storage supporting high bandwidth and low latency, etc.

Networking and Switching: Switches, Optical Modules, High-Density Optical/Copper Interconnects, Open Networking Technologies

Liquid Cooling and Thermal Management: Cold Plate Liquid Cooling, Immersion Liquid Cooling, Spray Liquid Cooling, CDU (Coolant Distribution Unit), Liquid Cooling Working Fluid, Dry Coolers, and Thermal Management Solutions

Power Supply, Distribution, and Energy Innovation

Power Supply and Distribution Systems: 800VDC power architecture, LVDC/HVDC distributed power supply, rear-of-rack power distribution, UPS (Uninterruptible Power Supply), EPS emergency power systems, energy storage systems, fuel cell and hydrogen-based power generation systems, smart power distribution, etc.

Hardware-Software Co-Innovation

Open Platforms and Firmware: Open-source firmware (such as OpenBMC and Open Platform Firmware), open computing standards, and firmware and platform management technologies

Hardware-Software Synergy: AI Super-Node Components, Computing Power and Power Supply Architecture, Intelligent Management Infrastructure Platform, and More

Artificial Intelligence Applications and Computing Power Services

AI and Intelligent Computing Applications: AI Super-Nodes, AI Computing Power Systems, Demonstrations of AI Application Capabilities, and AI Factory Architectures

Computing Power Services: intelligent computing centers, supercomputing centers, cloud computing centers, general-purpose data centers, and related planning, operations & maintenance, and digital twin applications