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Beijing City Datalogo

Beijing OCP Data Center Exhibition Conference

OCP China Day

Dates
Show Hours:
Venue
Beijing International Hotel
Highlights
Asia’s largest annual open computing technology conference an open collaboration platform that connects the upstream and downstream of the data center industry chain.
Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Beijing OCP Data Center Exhibition Conference

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Exhibition Data

1/1
Edition
4500㎡
Exhibition area
95
Exhibitors
2800
Visitors

Beijing City Data Expo Details

The Beijing OCP Data Center Exhibition—Open Compute Technology Conference, as Asia’s largest annual forum on open compute technologies, focuses on the underlying infrastructure of data centers—including computing, storage, networking, and liquid cooling—as well as co-innovation between algorithms and hardware and the acceleration of AI applications. The event brings together global open-source community resources, fosters collaboration across the industry value chain, and promotes the integration of IT supply chains, serving as a cutting-edge platform for technical exchange among data center professionals and developers.
Industry:
Data fairBeijing CityData Expo
Organizer:
OCP Foundation
City:
Beijing
Venue:
Beijing International Hotel
Address:
No. 9, Jianguomennei Avenue, Dongcheng District, Beijing

Profile

The Beijing OCP Data Center Exhibition—Open Compute Project China Day is dedicated to fostering a global open-source alliance based on openness. Serving as a platform, it bridges the upstream and downstream segments of the data center industry chain, enabling developers from diverse countries and regions to participate in open compute projects while strengthening connectivity and collaborative innovation across the entire ecosystem. This initiative drives the innovative integration and evolution of the global supply chain, cultivating a more diversified and inclusive ecosystem.

The summit focused on three key themes: technological innovation in foundational infrastructure—covering computing, storage, networking, and liquid cooling; synergistic advancements at the intersection of algorithms and computational capabilities, as well as between hardware and software; and leveraging open compute technologies to enhance the performance of cutting-edge artificial intelligence applications.

The Beijing OCP Data Center Exhibition—Open Compute Project China Day drew 2,800 attendees, including distinguished academics, technical experts, application developers, and vendor representatives from China Mobile, ByteDance, Alibaba Cloud, Samsung, IEIT SYSTEMS, Tsinghua University, and LUXSHARE ICT.

As Asia’s largest annual gathering for open compute technologies, the Beijing OCP Data Center Exhibition—Open Compute Project China Day showcases pioneering achievements in open innovation, serves as a global platform for integrating and advancing IT supply-chain innovations, and accelerates cross-industry AI transformation through interconnectedness, openness, and collaboration.

OCP is the world’s largest open-hardware community. This event brought together numerous technical experts from the data center sector, along with cutting-edge innovations and applications. For professionals in the data center field and technology enthusiasts alike, the Beijing OCP Data Center Exhibition—Open Compute Project China Day represents a rare and invaluable opportunity to engage with the latest technological developments.



Beijing OCP Data Center Exhibition Conference tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

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Beijing OCP Data Center Exhibition Conference Range

Is my product suitable?

Computing Power and AI Hardware

CPUGPUAI Acceleration ChipsDPUAI ServersCluster ArchitecturesOptical Interconnect NPOsCPOXPO

Storage and SSDs

NVMe SSDHigh-Durability SSDsAI Training Storage

Networking and Switching

SwitchesOptical ModulesHigh-Density Optical/Copper InterconnectsOpen Networking Technologies

Liquid Cooling and Thermal Management

Cold Plate Liquid CoolingImmersion Liquid CoolingSpray Liquid CoolingCDU (Coolant Distribution Unit)Liquid Cooling Working FluidsDry CoolersThermal Management Solutions

Power Supply Systems

800 VDC Power ArchitectureLVDC/HVDC Distributed Power SupplyRear-Rack Power DeliveryUPS (Uninterruptible Power Supplies)EPS Emergency Power SuppliesEnergy Storage SystemsFuel Cell and Hydrogen-Powered Generation SystemsSmart Power Distribution

Open Platforms and Firmware

Open Source Firmware (e.g., OpenBMC, Open Platform Firmware)Open Compute StandardsFirmware and Platform Management Technologies

Hardware-Software Co-Design

AI Super-Node ComponentsComputing Power Supply ArchitectureIntelligent Infrastructure Management Foundation

AI and Intelligent Computing Applications

AI Super-NodesAI Computing SystemsDemonstration of AI Application CapabilitiesAI Factory Architecture

Computing Power Services

Intelligent Computing CentersSupercomputing CentersCloud Computing CentersGeneral-Purpose Data CentersPlanningOperations and MaintenanceDigital Twin Applications

Booth Sales

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Beijing City Data Venue

Beijing International Hotel
Address: No. 9, Jianguomennei Avenue, Dongcheng District, Beijing
Beijing International Hotel实拍图
Beijing International Hotel实景
Beijing International Hotel实拍图
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Beijing International Hotel实拍图
Beijing International Hotel实景
Beijing International Hotel实景

Beijing City Data Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition