
Beijing OCP Data Center Exhibition ConferenceOCP China Day
Beijing OCP Data Center Exhibition Conference Profile
The Beijing OCP Data Center Exhibition—Open Compute Project China Day is dedicated to fostering a global open-source alliance based on openness. Serving as a platform, it bridges the upstream and downstream segments of the data center industry chain, enabling developers from diverse countries and regions to participate in open compute projects while strengthening connectivity and collaborative innovation across the entire ecosystem. This initiative drives the innovative integration and evolution of the global supply chain, cultivating a more diversified and inclusive ecosystem.
The summit focused on three key themes: technological innovation in foundational infrastructure—covering computing, storage, networking, and liquid cooling; synergistic advancements at the intersection of algorithms and computational capabilities, as well as between hardware and software; and leveraging open compute technologies to enhance the performance of cutting-edge artificial intelligence applications.
The Beijing OCP Data Center Exhibition—Open Compute Project China Day drew 2,800 attendees, including distinguished academics, technical experts, application developers, and vendor representatives from China Mobile, ByteDance, Alibaba Cloud, Samsung, IEIT SYSTEMS, Tsinghua University, and LUXSHARE ICT.
As Asia’s largest annual gathering for open compute technologies, the Beijing OCP Data Center Exhibition—Open Compute Project China Day showcases pioneering achievements in open innovation, serves as a global platform for integrating and advancing IT supply-chain innovations, and accelerates cross-industry AI transformation through interconnectedness, openness, and collaboration.
OCP is the world’s largest open-hardware community. This event brought together numerous technical experts from the data center sector, along with cutting-edge innovations and applications. For professionals in the data center field and technology enthusiasts alike, the Beijing OCP Data Center Exhibition—Open Compute Project China Day represents a rare and invaluable opportunity to engage with the latest technological developments.

Exhibitor List
Beijing OCP Data Center Exhibition Conference Product Range
Technological Innovations in the Infrastructure Layer (Computing Power, Storage, Networking, and Liquid Cooling)
Computing Power and AI Hardware: CPUs, GPUs, AI accelerator chips, DPUs, AI servers, cluster architectures, and high-speed interconnect technologies (such as optical interconnects like NPO, CPO, and XPO), among others
Storage and SSDs: NVMe SSDs, high-endurance SSDs, AI training storage supporting high bandwidth and low latency, etc.
Networking and Switching: Switches, Optical Modules, High-Density Optical/Copper Interconnects, Open Networking Technologies
Liquid Cooling and Thermal Management: Cold Plate Liquid Cooling, Immersion Liquid Cooling, Spray Liquid Cooling, CDU (Coolant Distribution Unit), Liquid Cooling Working Fluid, Dry Coolers, and Thermal Management Solutions
Power Supply, Distribution, and Energy Innovation
Power Supply and Distribution Systems: 800VDC power architecture, LVDC/HVDC distributed power supply, rear-of-rack power distribution, UPS (Uninterruptible Power Supply), EPS emergency power systems, energy storage systems, fuel cell and hydrogen-based power generation systems, smart power distribution, etc.
Hardware-Software Co-Innovation
Open Platforms and Firmware: Open-source firmware (such as OpenBMC and Open Platform Firmware), open computing standards, and firmware and platform management technologies
Hardware-Software Synergy: AI Super-Node Components, Computing Power and Power Supply Architecture, Intelligent Management Infrastructure Platform, and More
Artificial Intelligence Applications and Computing Power Services
AI and Intelligent Computing Applications: AI Super-Nodes, AI Computing Power Systems, Demonstrations of AI Application Capabilities, and AI Factory Architectures
Computing Power Services: intelligent computing centers, supercomputing centers, cloud computing centers, general-purpose data centers, and related planning, operations & maintenance, and digital twin applications
Beijing OCP Data Center Exhibition Conference Booth Sales


Beijing OCP Data Center Exhibition Conference Ticket Sales


Beijing OCP Data Center Exhibition Conference Venue
Beijing OCP Data Center Exhibition ConferenceCommunity
Beijing OCP Data Center Exhibition Conference Booth price

Standard booth Configuration

Blank booth Configuration
Beijing OCP Data Center Exhibition Conference Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition





















