
OCP Data Center Exhibition, San Jose, USAOCP Global Summit
OCP Data Center Exhibition, San Jose, USA Profile
The OCP Global Summit in San Jose, USA, is the premier event bringing together the most forward-thinking minds in open‑source IT ecosystem development. The summit provides a unique platform for communities worldwide to share insights, foster partnerships, and showcase the latest advances in open hardware and software.
At the global summit, industry leaders, researchers, and pioneers from the open community engage in dynamic dialogues, enlightening workshops, and interactive engineering sessions. These activities aim to deepen our understanding of the progress made by the project, as well as the challenges and pathways ahead. Attendees will explore emerging trends, address complex challenges, and uncover new opportunities driving global innovation. Through this collaborative spirit, our goal is to accelerate the development of efficient, scalable, and sustainable open computing solutions that will power the future of technology.
The OCP Global Summit, initiated by Meta (formerly Facebook), is the world’s largest open‑source hardware event. It not only sets the technological direction for next‑generation data centers, AI servers, high‑speed cables, and connectors, but also serves as the central stage where global tech giants—including Meta, Google, Microsoft, NVIDIA, Intel, and others—announce their annual procurement needs and technical standards.
The OCP Global Summit in San Jose, USA, focuses on technological innovation and open collaboration in data centers for the AI era. At this year’s summit, the ESUN (Ethernet for Scale-Up Networking) working group was established, comprising twelve leading companies—AMD, Arista, ARM, Broadcom, Cisco, HPE Networking, Marvell, Meta, Microsoft, NVIDIA, OpenAI, and Oracle—dedicated to addressing the fragmentation of the AI cluster high‑speed interconnect ecosystem through open Ethernet standards.
As the official designated agent for this exhibition, Juzhan will continue to lead Chinese enterprises to participate in the OCP Global Summit in the United States, providing high‑quality services to help Chinese companies expand into the Latin American market. The OCP Global Summit in San Jose, USA, offers an opportunity to seize the burgeoning prospects in AI computing power, data center infrastructure, and high‑speed interconnect industries, connect with top-tier global open computing resources, and broaden access to North American market channels.
Exhibitor List
OCP Data Center Exhibition, San Jose, USA Product Range
AI Servers and Cluster Architectures: Showcasing open-hardware solutions ranging from single-node AI servers to full-cabinet‑scale AI clusters, such as MiTAC’s OCP ORv3 liquid‑cooled cabinets and EIA air‑cooled cabinets.
Liquid Cooling and Thermal Management Solutions: SUNON presents three core products: open‑type water‑cooling plates, CDU coolant distribution units, and closed‑loop liquid‑cooling systems; while CoolIT, MiTAC, and others demonstrate 200 kW‑class In‑Rack CDU liquid‑cooling solutions, supporting high‑density GPU deployments.
High‑Power Power Supply and Interconnect Technologies: Exhibiting 800 VDC power architectures (Delta, Lite-On), LVDC/HVDC distributed power supply systems, and rear‑of‑rack power delivery solutions—high‑current approaches; TE Connectivity and Amphenol showcase blind‑mate copper busbar connectors, modular busbar interfaces, and high‑density optical/copper interconnects.
Networking and Switching Technologies: Broadcom unveils the Tomahawk Ultra switch and third‑generation CPO (Co-Packaged Optics) technology, supporting 1.6 Tbps optical transceivers; NVIDIA showcases Spectrum‑X™ Ethernet switches, serving hyperscale AI data centers operated by Meta, Oracle, and others.
Open‑Platform Firmware and Management: MiTAC’s live demo features OpenBMC plus Open Platform Firmware (OPF), enabling open‑source firmware to replace proprietary stacks; discussions also cover Redfish, SBOM, NIST‑compliant safeguards, and other mechanisms for secure, transparent management.
Storage and SSD Innovations: Dapustor and other vendors exhibit NVMe SSDs, designed to support high‑bandwidth, low‑latency AI training workloads; Solidigm and Micron highlight high‑endurance NVMe E1.S/U.2 SSDs, optimized for AI and HPC workloads.
Sustainability and Digital Twins: Exploring applications of PUE optimization, heat recovery, and digital twins in data center operations; several companies share design practices for green AI factories, aligning with the theme “Leading the Future of AI.”
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OCP Data Center Exhibition, San Jose, USA Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition





















