AI Servers and Cluster Architectures: Showcasing open-hardware solutions ranging from single-node AI servers to full-cabinet‑scale AI clusters, such as MiTAC’s OCP ORv3 liquid‑cooled cabinets and EIA air‑cooled cabinets.

Liquid Cooling and Thermal Management Solutions: SUNON presents three core products: open‑type water‑cooling plates, CDU coolant distribution units, and closed‑loop liquid‑cooling systems; while CoolIT, MiTAC, and others demonstrate 200 kW‑class In‑Rack CDU liquid‑cooling solutions, supporting high‑density GPU deployments.

‌High‑Power Power Supply and Interconnect Technologies: Exhibiting 800 VDC power architectures (Delta, Lite-On), LVDC/HVDC distributed power supply systems, and rear‑of‑rack power delivery solutions—high‑current approaches; TE Connectivity and Amphenol showcase blind‑mate copper busbar connectors, modular busbar interfaces, and high‑density optical/copper interconnects.

‌Networking and Switching Technologies: Broadcom unveils the Tomahawk Ultra switch and third‑generation CPO (Co-Packaged Optics) technology, supporting 1.6 Tbps optical transceivers; NVIDIA showcases Spectrum‑X™ Ethernet switches, serving hyperscale AI data centers operated by Meta, Oracle, and others.

‌Open‑Platform Firmware and Management: MiTAC’s live demo features OpenBMC plus Open Platform Firmware (OPF), enabling open‑source firmware to replace proprietary stacks; discussions also cover Redfish, SBOM, NIST‑compliant safeguards, and other mechanisms for secure, transparent management.

Storage and SSD Innovations: Dapustor and other vendors exhibit NVMe SSDs, designed to support high‑bandwidth, low‑latency AI training workloads; Solidigm and Micron highlight high‑endurance NVMe E1.S/U.2 SSDs, optimized for AI and HPC workloads.

Sustainability and Digital Twins: Exploring applications of PUE optimization, heat recovery, and digital twins in data center operations; several companies share design practices for green AI factories, aligning with the theme “Leading the Future of AI.”