
OCP Southeast Asia Tech Day @ DCWA
OCP Southeast Asia Tech Day @ DCWA- 1/1
- Annual
- 10000㎡
- Exhibition area
- 178
- Exhibitors
- 17000
- Visitors
OCP Southeast Asia Tech Day @ DCWASame period exhibition
SingaporeData expo Fair Details
- Industry:
- Data fairSingaporeData fair
- Organizer:
- OCP Foundation
- City:
- Singapore
- Venue:
- Sands Expo & Convention Centre
- Address:
- 10 Bayfront Avenue, Singapore, Singapore
OCP Southeast Asia Tech Day @ DCWAProfile
The OCP Southeast Asia Tech Day @ DCWA is the largest and most influential OCP industry event in the Asia-Pacific region. It directly addresses the infrastructure demand pain points driven by the booming digital economy in Southeast Asia, co-creating a new future for data centers.
The Open Compute Project (OCP) will host the OCP Southeast Asia Tech Day @ DCWA, bringing together hyperscalers, colocation providers, design and construction firms, and technology innovators to explore how open hardware, collaborative engineering, and next-generation infrastructure design can support the rapid growth of Asia's digital infrastructure.
The OCP Tech Day will be held within Data Centre World Asia (DCWA), part of Singapore Tech Week, the Asia-Pacific's leading platform for the construction, operation, and investment of data center, cloud, and connectivity infrastructure. Over 17,000 industry professionals attend annually for conferences, exhibitions, and focused business discussions. Key themes will include AI infrastructure, sustainability, energy resilience, and data center operations.
By hosting the OCP Tech Day in this environment, the OCP Southeast Asia Tech Day @ DCWA connects the OCP community with a broader ecosystem of operators, designers, investors, and technology partners shaping the region's infrastructure landscape.
OCP Southeast Asia Tech Day @ DCWA tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.
OCP Southeast Asia Tech Day @ DCWA Photos
OCP Southeast Asia Tech Day @ DCWA Exhibitor Directory / E-Magazine
OCP Southeast Asia Tech Day @ DCWARange
AI & High-Performance Computing Infrastructure: High-density server and rack designs supporting AI/GPU; AI acceleration modules and systems based on OCP open hardware standards (, OAM, OAI).
Advanced Liquid Cooling & Thermal Management Technologies: Cold plates, Liquid-to-Liquid (L2L) and Liquid-to-Air (L2A) Coolant Distribution Units (CDUs); liquid cooling solutions supporting high-power chips (, >1400W); closed-loop liquid cooling systems suitable for retrofitting existing data centers.
High-Voltage Direct Current (HVDC) Power Architecture: ±400VDC and 800VDC HVDC power systems; high-efficiency power equipment such as Solid-State Transformers (SST), row-level power systems, and EVA cabinets.
AI Networking & Interconnect Technologies: 1.6T Ethernet switches (based on platforms like Tomahawk 6); Co-Packaged Optics (CPO) optical modules and low-latency network solutions; integrated solutions for UALink (Scale-Up Ethernet) and UEC (Scale-Out).
Modular & Edge Data Center Solutions: Pre-modularized IT cabinets, micro data centers; rapid deployment solutions tailored for tropical climates (, fluorine pump + micro-module solutions showcased by Haiwu).
Green & Sustainable Technologies: Energy-saving equipment, renewable energy integration; PUE optimization, utilization of natural cooling sources, water treatment systems, etc.
Booth inquiry for this edition



2026 SingaporeData Ticket inquiry






SingaporeData Venue
SingaporeData Booth Application

Standard booth Configuration

Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
























