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Singapore OCP Southeast Asia Data Center ExhibitionCatalog consultation
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Fair basics
Industry scope
AI and High-Performance Computing Infrastructure:High-density server and rack designs supporting AI/GPU workloads; AI accelerator modules and systems compliant with OCP open hardware standards (, OAM, OAI)
Advanced Liquid Cooling and Thermal Management Technologies:Cold Plate cooling solutions; liquid-to-liquid (L2L) and liquid-to-air (L2A) cooling distribution units (CDUs); liquid cooling solutions for high-power chips (, 1400W+); closed-loop liquid cooling systems suitable for retrofitting existing data centers
High-Voltage Direct Current (HVDC) Power Supply Architectures:±400VDC and 800VDC HVDC power systems; solid-state transformers (SSTs), inter-rack power distribution systems, EVA cabinets, and other high-efficiency power supply equipment
AI Networking and Interconnect Technologies:1.6T Ethernet switches based on platforms like Tomahawk6; CPO (Co-Packaged Optics) optical modules and low-latency networking solutions; UALink (Scale-Up Ethernet) and UEC (Scale-Out) integration schemes
Modular and Edge Data Center Solutions:Pre-modular IT cabinets and micro data centers; rapid deployment solutions tailored for tropical climates (, Haiwu’s fluorine pump + micro-modules)
Green and Sustainable Technologies:Energy-efficient equipment, renewable energy integration, PUE optimization, utilization of natural cooling sources, water treatment systems, and more
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