• Chip and Chip Design Brands: Unisoc, ZTE Microelectronics, Zhaoxin, Beijing Junzheng, Suzhou GigaDevice, HuaDa NineSky, VeriSilicon, Fudan Microelectronics, GigaDevice, Goodix, Cambricon, Horizon Robotics, Synopsys, UNISOC, Biwin Storage, NiuXin Semiconductor
• Wafer Fabrication and Packaging & Testing Brands: HuaHong Semiconductor, Wuhan Xinxin, Tongfu Microelectronics, HuaJin Semiconductor, ChangElec, Huatian Technology, Zengxin Technology, Tianxin Interconnect, CR Microelectronics, YueXin Semiconductor
• Power and Compound Semiconductor Brands: BYD Semiconductor, Ruineng Semiconductor, Tianke Heda, ShuoKe Crystal, Puxing Electronics, Nansha Wafer, Namicro Semiconductor, Innoscience, Basic Semiconductor, Yangjie Technology
• Semiconductor Equipment Brands: NAURA, AMEC, Shengmei Shanghai, Huahai Qingke, Tuojing Technology, Xinyuan Micro, Zhongke Feice, Jingyi Equipment, Jingsheng Machinery & Electrical, Changchuan Technology, Huazhuo Jingke, Yuwei Semiconductor, Rilink Technology, Dazhu Microelectronics
• Semiconductor Materials and Components Brands: Shanghai Silicon Industry, Jiangfeng Electronics, Anji Micro, Shanghai Xinyang, CSSC Special Gas, Nanjing University Optoelectronics, Fuchuang Precision, XinSong Semiconductor, Shangyin Technology, Xinlai Group
• Research Institutes and Industry Alliances: JiHua Laboratory, Demonstration Microelectronics College Industry–Academia–Research Integration Alliance, Integrated Circuit Materials Innovation Consortium, China Automotive Chip Industry Innovation Strategic Alliance, National Third-Generation Semiconductor Technology Innovation Center (Shenzhen)



IC Design/Chips and Applications: IC and related electronic product design, EDA tools, AI computing chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products for the Internet of Things, artificial intelligence, automotive electronics, smart cities, intelligent terminals, and health care.

IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging and testing technologies and products.

Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (including TSV and TGV), fan-out wafer-level packaging, along with related design, materials, testing, and equipment.

Semiconductor Equipment: Wafer dicing and testing equipment, various precision devices required during wafer processing, semiconductor packaging equipment, semiconductor test equipment, IC test instruments, advanced packaging process equipment (such as SiP and 3D packaging), power device equipment, and more.

Semiconductor Materials: Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, polishing slurries, photoresists, photomasks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, and other related materials.

Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC parts, robots, quartz components, filters, RF power supplies, ceramic parts, ESC electrostatic chucks, pressure gauges, pumps, MFC flow meters, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, refrigeration equipment, induction heaters, and more.

Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and their related products, including power devices, RF devices, and upstream equipment and materials.

AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, and more.