Shenzhen International Integrated Circuit Innovation Expo

The Shenzhen International Integrated Circuit Innovation Expo (IICIE), in active response to the national strategy for innovative development of the integrated circuit industry and to accelerate the establishment of a healthy industrial ecosystem, is themed “Cross‑Border Integration · Full‑Chain Collaboration, Co‑Building a Distinctive Chip Ecosystem.” The expo aims to create a high‑end platform for collaborative innovation and exchange across the entire integrated circuit value chain—driven by applications and centered on products—while delivering significant scale effects.

The exhibition showcases a comprehensive, end‑to‑end ecosystem encompassing chips and chip design, wafer fabrication, packaging and testing, core equipment, critical materials, and essential components. Here, you can engage in in-depth discussions with leading companies from key semiconductor segments—including IDM, Fabless, Foundry, and OSAT—and connect directly with a broad audience spanning artificial intelligence, consumer electronics, automotive, communications and computing, display technologies, optoelectronics, and new energy sectors, providing one‑stop, efficient support to downstream application areas.

The Shenzhen International Integrated Circuit Innovation Expo (IICIE) further fosters the integrated development of the integrated circuit industry with related sectors, strengthens the sector’s core competitiveness, and supports the high‑quality growth of China’s integrated circuit industry.

Shenzhen International Integrated Circuit Innovation Expo tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

Partial exhibitor directory and exhibitor list for Shenzhen International Integrated Circuit Innovation Expo: 清能德创电气技术(北京)有限公司, 天津市长芦化工新材料有限公司, 无锡雨露精工有限公司, 广东鑫信智能装备有限公司, 山东纳诺新材料科技有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

The Exhibition Value of the Shenzhen International Semiconductor Exhibition (SEMI-e)

• A core platform for showcasing and exchanging technologies across the entire Chinese integrated circuit industry chain. Hosted by CIOE China Optics Expo and the Integrated Circuit Innovation Alliance, and organized by iJiwei and Shenzhen Zhongxincai Convention & Exhibition Co., Ltd., SEMI-e has evolved over multiple editions into a highly influential professional exhibition platform. For the first time, it is co‑hosted with CIOE China Optics Expo—the global benchmark for the optoelectronics industry—on the same dates and at the same venue. Together, the two exhibitions have surpassed 300,000 square meters in total area, bringing together more than 5,000 high‑quality exhibitors and establishing a “super‑exhibition platform” that spans the two core domains of integrated circuits and optoelectronics. This synergistic ecosystem of “optoelectronics + semiconductors” provides enterprises with a strategic gateway to transcend industry boundaries and achieve cross‑sectoral innovation.
• Comprehensive coverage of the entire industry chain, with in-depth thematic focus on four key areas. The exhibition centers on three major themes—“IC Chips and Design,” “Wafer Fabrication and Packaging & Testing,” and “Compound Semiconductors”—while comprehensively covering the full value chain, including chip design, wafer manufacturing, advanced packaging, power devices, semiconductor equipment and components, and materials. At the 2025 edition, 1,062 premium exhibitors will gather to showcase cutting‑edge innovations such as edge‑side AI chips, third‑generation semiconductors, optoelectronic co‑packaged CPOs, and TGV technology, fully highlighting the latest technological breakthroughs and dynamic innovation within the integrated circuit industry.
• Gathering world‑leading companies to compete and demonstrate groundbreaking technologies. In the chip and design sector, industry leaders such as Unisoc, ZTE Microelectronics, Zhaoxin, Beijing Junzheng, HuaDa Jiutian, and VeriSilicon are among the participants. In wafer fabrication and packaging/testing, key players like HuaHong Group, Wuhan Xinxin, Tongfu Microelectronics, and Huajin Semiconductor take center stage. In the equipment and components segment, domestic giants including North Huachuang, AMEC, Shengmei Shanghai, Huahai Qingke, and Tuojing Technology join forces with component specialists like Fuchuang Precision and Xinlai Group to form a comprehensive “end-to-end” matrix. Meanwhile, in the compound semiconductor field, companies such as Tianke Heda, ShuoKe Crystal, Puxing Electronics, BYD Semiconductor, and Ruineng Semiconductor present their latest advancements in SiC and GaN technologies.
• Precise matchmaking with a vast pool of buyers, driving robust business collaboration. The 2025 edition is expected to attract a cumulative total of 43,986 professional visitors, with over 75,658 visitor entries. Professionals from semiconductor manufacturing, services, and core product sectors account for 60.48% of attendees, spanning critical links such as wafer fabrication, packaging and testing, chip design, and equipment/materials. Industry leaders including SMIC, HuaHong Group, YueXin, BYD Auto, and ams OSRAM have been invited as VIP buyers, providing exhibitors with an efficient channel to connect directly with procurement decision‑makers.
• High‑profile summits and authoritative thought leadership, shaping the future direction of the industry. Alongside the exhibition, 22 conferences and events will be held, featuring 130 distinguished speakers. Topics include edge‑side AI chips, the RISC‑V ecosystem, power semiconductors, advanced packaging, optoelectronic co‑packaged CPOs, and TGV technology. Representatives from companies and experts from institutions such as HuaDa Jiutian, CloudWalk Technology, Suzhou Guoxin, FAW Hongqi, Tsinghua University, and Southern University of Science and Technology will convene to offer critical insights through data‑driven forecasting, trend analysis, and technical discussions, providing valuable guidance for corporate strategic planning.

Notable exhibitors

• Wafer Fabrication, Packaging, and Testing Technologies & Services:Shanghai Huali, Jinghe Integrated Circuit, Jita Semiconductor, BYD Semiconductor, Tongfu Microelectronics, Huatian Technology, Shidai Minxin, HuaJin Semiconductor, Biwin Storage, XinZhi Micro, Aite Micro
• Semiconductor Equipment:Northern Huachuang, AMEC, Shengmei Shanghai, Tuojing Technology, Huahai Qingke, Weichong Semiconductor, Huayu Semiconductor, Longyoude, Jingce Electronics, CETC, Huazhuo Jingke, Zhongke Feice, Maywa Technology, Dongfang Jingyuan, Weijia Technology, Sanfeng Precision, Rongdao Society, Guanli Technology, Guangli Semiconductor, Lichun
• Semiconductor Materials:Husi Industry, Anji Technology, CSSC Special Gases, Shanghai Xinyang, Qingyi Micro, Xilong Science, Fangda Carbon-Carbon
• Core Semiconductor Components and Smart Manufacturing Solutions:Zhongke Instrument, Siasun Semiconductor, Wanrui Refrigeration, Shangyin Technology, Xinlai Group, Canrui Technology, Sibek, Keyence, Guanye Transmission, Oulai New Materials, Sidaquan, Xingqi Semiconductor, Xister