

Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation ExpoIICIE
Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Profile
The Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo (IICIE), formerly known as the “SEMI-e Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo,” has been officially upgraded to the IICIE International Integrated Circuit Innovation Expo. With the theme “Cross‑Industry Integration · Full‑Chain Collaboration, Co‑Building a Distinctive Chip Ecosystem,” the event aims to establish a high‑end platform for collaborative innovation and exchange across the entire integrated circuit value chain—driven by applications and centered on products—while achieving significant scale effects.
The Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo (IICIE) showcases a comprehensive ecosystem spanning chip design, wafer fabrication, packaging and testing, core equipment, critical materials, and essential components.
Here, you can engage in in-depth discussions with leading companies from key semiconductor sectors—including IDM, Fabless, Foundry, and OSAT players—while also connecting directly with a broad audience representing artificial intelligence, consumer electronics, automotive, communications and computing, display, optoelectronics, and new energy industries. This one‑stop platform efficiently empowers downstream application areas, further fostering the integrated development of the integrated circuit industry with related sectors, enhancing the sector’s core competitiveness, and supporting China’s drive toward high‑quality growth in the IC field.
At present, most major industry players—including UNISOC, ZTE, Zhaoxin, GigaDevice, Beijing Junzheng, Aiwei,炬芯, Suzhou National Chip, Unisoc Tongchuang, HuaDa Jiutian, VeriSilicon, SMIC, HuaHong Semiconductor, CR Micro, ChangCun, ChangXin, Wuhan Xinxin, Tongfu Microelectronics, Innoscience, BYD Semiconductor, Risen Semiconductor, North Huachuang, AMEC, Shengmei, HuaHai Qingke, Tuojing, Xinyuan Micro, Zhongke Feice, Suzhou Tianjun, Huazhuo Jingke, Xinshang Weizhuang, Shanghai Yuyue, Silicon Industry Group, Jiangfeng Electronics, Anji Micro, Shanghai Xinyang, CSSC Special Gas, Nanda Optoelectronics, the Materials Innovation Consortium, Fuchuang Precision, Shenyang Scientific Instruments, Estun Robotics, and Jingyi Automation—have confirmed their participation in the exhibition.
Exhibitor List
Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Product Range
IC Design/Chips and Applications: IC and related electronic product design, EDA tools, AI computing chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products for the Internet of Things, artificial intelligence, automotive electronics, smart cities, intelligent terminals, and health care.
IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging and testing technologies and products.
Advanced Packaging: Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (including TSV and TGV), fan-out wafer-level packaging, along with related design, materials, testing, and equipment.
Semiconductor Equipment: Wafer dicing and testing equipment, various precision devices required during wafer processing, semiconductor packaging equipment, semiconductor test equipment, IC test instruments, advanced packaging process equipment (such as SiP and 3D packaging), power device equipment, and more.
Semiconductor Materials: Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, polishing slurries, photoresists, photomasks, sputtering targets, polishing solutions, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, and other related materials.
Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC parts, robots, quartz components, filters, RF power supplies, ceramic parts, ESC electrostatic chucks, pressure gauges, pumps, MFC flow meters, stepper motors, motion control systems, servo motors, linear modules, cleanroom drag chains, packaging molds, refrigeration equipment, induction heaters, and more.
Compound Semiconductors and Power Devices: Compound semiconductor materials (such as GaN, SiC, etc.) and their related products, including power devices, RF devices, and upstream equipment and materials.
AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, and more.
Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Booth Sales

Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Ticket Sales


Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Venue
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Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Booth price

Standard booth Configuration

Blank booth Configuration
Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Cooperation


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