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Shenzhen International Integrated Circuit Innovation Expo
IICIE
- Dates
- Show Hours:
- Highlights
- An international platform for innovation and exchange spanning the entire integrated circuit industry chain.
Shenzhen International Integrated Circuit Innovation Expo Same Period Exhibition
Exhibition Data
- 1/1
- Edition
- 60000㎡
- Exhibition area
- 1100
- Exhibitors
- 60000
- Visitors
Shenzhen Semiconductors Expo Details
- Organizer:
- China International Optoelectronics Expo (CIOE China Optics Expo), Integrated Circuit Innovation Alliance
- Venue:
- SHENZHEN WORLD EXHIBITION&CONVENTION CENTER
- Address:
- No. 1, Exhibition City Road, Peace Community, Fuhai Street, Bao'an District, Shenzhen
Profile
The Shenzhen International Integrated Circuit Innovation Expo (IICIE), in response to the national strategy for integrated circuit innovation and with the aim of accelerating the development of a healthy industrial ecosystem, is themed “Cross‑Industry Integration · Full‑Chain Collaboration, Co‑Building a Distinctive Chip Ecosystem.” It strives to establish a high‑end platform for collaborative innovation and exchange across the entire integrated circuit value chain—characterized by scale, application orientation, and product‑centricity.
The expo showcases a comprehensive, end‑to‑end ecosystem encompassing chips and chip design, wafer fabrication, packaging and testing, core equipment, critical materials, and essential components. Here, you can engage in in-depth dialogue with leading players across key segments—including IDM, Fabless, Fab, and OSAT—and connect directly with a broad audience spanning artificial intelligence, consumer electronics, automotive, communications and computing, display technologies, optoelectronics, and new energy sectors, providing one‑stop, efficient support to downstream industries.
The Shenzhen International Integrated Circuit Innovation Expo (IICIE) further promotes the integrated development of the IC industry with related sectors, helping to strengthen the core competitiveness of China’s IC sector and supporting its high‑quality growth.
Shenzhen International Integrated Circuit Innovation Expo tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for Shenzhen International Integrated Circuit Innovation Expo: 慈溪晋通电子科技有限公司, 广州金升阳科技有限公司, 深圳市泰斯特尔系统科技有限公司, 广东韩研活性炭科技股份有限公司, 深圳市雷赛智能控制股份有限公司, 天津太敬格德自动化技术有限公司, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
The Exhibitor Value of the Shenzhen International Semiconductor Innovation Exhibition (SEMI-e)
- A central platform for showcasing and exchanging technologies across the entire Chinese integrated circuit industry chain. Co-hosted by CIOE China Optics Fair and the Integrated Circuit Innovation Alliance, and organized by iJiwei and Shenzhen Zhongxin Materials Exhibition Co., Ltd., SEMI-e has evolved into a highly influential professional exhibition platform. For the first time, it was jointly held with CIOE China Optics Fair—the global benchmark for the optoelectronics industry—on the same dates and at the same venue. With a combined scale exceeding 300,000 square meters and bringing together over 5,000 premium exhibitors, SEMI-e has established itself as a “super exhibition platform” covering both the integrated circuit and optoelectronics sectors. This synergistic ecosystem of “optoelectronics + semiconductors” provides enterprises with a strategic gateway to transcend industry boundaries and achieve cross-sectoral innovation.
- Comprehensive coverage of the entire industry chain, with in-depth arrangements around four core themes. Focusing on three major themes—“IC Chips and Design,” “Wafer Fabrication and Packaging & Testing,” and “Compound Semiconductors”—the exhibition fully encompasses the entire industrial ecosystem, including chip design, wafer manufacturing, advanced packaging, power devices, semiconductor equipment and components, and materials. At the 2025 edition, 1,062 high-quality exhibitors gathered to showcase cutting-edge advancements such as edge AI chips, third-generation semiconductors, optoelectronic co-packaging (CPO), and TGV technology, offering a complete picture of the latest technological breakthroughs and innovative vitality within the integrated circuit industry.
- Gathering world-class enterprises to compete on the same stage and demonstrate hard-core technologies. In the chip and design sector, leading companies such as Unisoc, ZTE Microelectronics, Zhaoxin, Beijing Junzheng, HuaDa NineSky, and VeriSilicon convened. In wafer fabrication and packaging/testing, key players like HuaHong Group, Wuhan Xinxin, Tongfu Microelectronics, and Huajin Semiconductor took center stage. In the equipment and components segment, domestic giants including North Huachuang, AMEC, Shengmei Shanghai, and Huahai Qingke partnered with specialized firms like Fuchuang Precision and Xinlai Group to form a comprehensive “end-to-end” matrix. In the compound semiconductor field, companies such as Tianke Heda, ShuoKe Crystal, Puxing Electronics, BYD Semiconductor, and Ruineng Semiconductor presented their latest SiC/GaN achievements.
- Precise alignment with vast buyer resources, deeply empowering commercial collaboration. The 2025 exhibition attracted a cumulative total of 43,986 professional visitors, with overall attendance surpassing 75,658 entries. Among them, 60.48% were professionals from semiconductor manufacturing, services, and core product sectors, spanning key areas such as wafer fabrication, packaging/testing, chip design, and equipment/materials. Leading enterprises including SMIC, HuaHong Group, YueXin, BYD Auto, and ams OSRAM attended as VIP invited buyers, providing exhibitors with efficient channels to connect directly with purchasing decision-makers.
- High‑level summits and authoritative insights guiding the future direction of the industry. Concurrent with the exhibition, 22 conferences and events were held, featuring speeches by 130 distinguished guests. Topics covered included edge AI chips, the RISC‑V ecosystem, power semiconductors, advanced packaging, optoelectronic co‑packaging (CPO), and TGV technology—addressing many pressing issues of the day. Representatives from HuaDa NineSky, CloudWalk, Suzhou Guoxin, FAW Hongqi, Tsinghua University, Southern University of Science and Technology, along with experts and scholars, gathered to offer critical strategic guidance through data‑driven forecasting, trend analysis, and technical discussions.
Range
- Wafer Fabrication and Packaging/Testing Technologies and Services:Shanghai Huali, Jinghe Integration, Jita Semiconductor, BYD Semiconductor, Tongfu Microelectronics, Huatian Technology, Shidai Minxin, Huajin Semiconductor, Biwei Storage, XinZhi Micro, Aite Micro
- Semiconductor Equipment:North Huachuang, AMEC, Shengmei Shanghai, Tuojing Technology, Huahai Qingke, Weichong Semiconductor, Huayu Semiconductor, Longyoude, Jingce Electronics, CETC, Huazhuo Jingke, Zhongke Feice, Maiwei Technology, Dongfang Jingyuan, Weijia Technology, Sanfeng Precision, Rongdao Society, Guanli Technology, Guangli Semiconductor, Lichun
- Semiconductor Materials:Husi Industry, Anji Technology, Zhongchuan Special Gas, Shanghai Xinyang, Qingyi Micro, Xilong Science, Fangda Carbon
- Core Semiconductor Components and Smart Manufacturing Solutions:Zhongke Yi, XinSong Semiconductor, Wanrui Cold Electricity, Shangyin Technology, Xinlai Group, Canrui Technology, Sibek, Keyence, Guanye Transmission, Oulai New Material, Sida Quan, Xingqi Semiconductor, Xister
Review
From September 10 to 12, 2025, SEMI-e Shenzhen International Semiconductor Exhibition and the 2025 Integrated Circuit Industry Innovation Exhibition were successfully held at the Shenzhen International Convention & Exhibition Center (Bao’an New Hall). This edition marked the first-ever joint organization of the two events with the 26th China International Optoelectronics Expo (CIOE), taking place simultaneously on the same site. Together, the exhibitions spanned over 300,000 square meters and brought together more than 5,000 high-quality exhibitors. SEMI-e alone hosted 1,062 exhibitors, attracting 43,986 professional visitors and recording a total of 75,658 visitor entries.
A deep integration of the twin exhibitions presents a comprehensive view of the entire industry chain. SEMI-e focused on three major themes—“IC Chips and Design,” “Wafer Fabrication and Packaging & Testing,” and “Compound Semiconductors”—complementing CIOE’s coverage of optoelectronic chips, optical modules, sensors, and other related fields. By transcending the boundaries of individual industries, the two exhibitions fostered deep coupling across the full value chain of optoelectronics and semiconductors, from R&D and supply-chain development to market applications. At the venue, advanced manufacturing processes and optoelectronic device fabrication were seamlessly integrated, providing a critical collaborative platform for performance breakthroughs in the post-Moore era.
An unprecedentedly strong exhibitor lineup, with leading companies all in attendance. In the chip design sector, industry leaders such as Unisoc, ZTE Microelectronics, Zhaoxin, HuaDa NineSky, and VeriSilicon gathered; in wafer fabrication and packaging/testing, key players like HuaHong Group, Wuhan Xinxin, Tongfu Microelectronics, and Huajin Semiconductor participated; in equipment and components, domestic giants including North Huachuang, AMEC, Shengmei Shanghai, and Huahai Qingke joined forces with specialized firms like Fuchuang Precision and Xinlai Group, forming an end-to-end supply-chain matrix. In the compound semiconductor field, Tianke Heda, ShuoKe Crystal, BYD Semiconductor, and Ruineng Semiconductor showcased their latest SiC/GaN innovations.
A rich array of concurrent conferences and in-depth industry exchanges. During the exhibition, 22 high-profile conferences and events were held, featuring speeches by 130 distinguished guests. At the opening ceremony, former Vice Minister of Science and Technology Cao Jianlin, Chinese Academy of Sciences Academician Gu Ying, and Chief Engineer of National Project 02 Ye Tianchun, among other authorities, delivered remarks emphasizing that the synergy between the two exhibitions aligns with the trend toward optoelectronic convergence and will unleash a “1+1 greater than 2” aggregation effect. Conference topics ranged from edge AI chips and the RISC-V ecosystem to power semiconductors, advanced packaging, optoelectronic co-packaging (CPO), and TGV technology—covering many hot issues of the day.
Precise buyer‑seller matchmaking and enthusiastic industry response. Among the professional attendees, 60.48% came from semiconductor manufacturing, services, and core product sectors. Leading enterprises such as SMIC, HuaHong Group, YueXin, BYD Auto, and ams OSRAM attended as VIP invited buyers, resulting in multiple cooperation agreements on-site. The successful staging of this event has further solidified SEMI-e’s position as a central platform for showcasing and exchanging technologies across the entire integrated circuit industry chain in China. The next edition is scheduled to take place from September 9 to 11, 2026, once again at the Shenzhen International Convention & Exhibition Center.
IICIE 2027 Venue Map
IICIE Exhibitior List
Shenzhen International Integrated Circuit Innovation Expo Range
- AI chip ,
- Communication chip ,
- Memory chip ,
- CPU chip ,
- Sensor chip ,
- Analog chip ,
- Digital chip ,
- Power management and power chip ,
- RF chip ,
- Driver chip
- IP ,
- EDA—Electronic Design Automation ,
- Fabless semiconductor company ,
- Wafer fabrication foundry ,
- OSAT—Outsourced Semiconductor Assembly and Test ,
- Testing services
- Manufacturing equipment ,
- Packaging equipment ,
- Inspection and testing equipment ,
- Assembly equipment ,
- Environmental treatment equipment ,
- Factory automation ,
- Robots
- Substrate materials ,
- Manufacturing materials ,
- Packaging materials
- Sealing rings ,
- Precision bearings ,
- Metal components ,
- Quartz parts ,
- Silicon parts ,
- SiC parts ,
- Ceramic parts ,
- RF power supplies ,
- DC power supplies ,
- Plasma power supplies ,
- Stepper motors ,
- Motion control systems ,
- Servo motors ,
- Pumps ,
- Semiconductor valves ,
- Pressure control devices ,
- Electrostatic chucks ,
- Flow meters ,
- Machine vision systems ,
- Sensors ,
- Linear motors
- Silicon carbide (SiC) ,
- Gallium nitride (GaN) ,
- Diamond ,
- Gallium oxide (Ga₂O₃) ,
- Cubic boron nitride (c-BN) ,
- Aluminum nitride (AlN) ,
- Graphite and carbon materials ,
- Power devices
Booth Sales
Mr. WuGold-Medal PM
3 Years Booth Sales
2027 Shenzhen Semiconductors Ticket Sales
Mr. HanGold-Medal PM
3 Years Booth Sales
Ms. LiuGold-Medal PM
3 Years Booth Sales
Shenzhen Semiconductors Venue
Shenzhen Semiconductors Booth Price
Process
- 1.Submit the business license of the company
- 2.Submit product picture and name
- 3.Receive exhibition presentation documents and booth drawings
- 4.Submit booth application form/Sign booth contract
- 5.Pay the contract booth deposit
- 6.Prepare for exhibition