Shenzhen International Semiconductor Exhibition & Integrated Circuit Industry Innovation Expo Tickets

The IICIE International Integrated Circuit Innovation Expo (formerly the Shenzhen International Semiconductor Exhibition) has officially been upgraded. With the theme “Cross‑Industry Integration and Full‑Chain Collaboration to Build a Distinctive Chip Ecosystem,” the event is shaping a application‑driven, product‑centric platform for collaborative innovation across the entire semiconductor value chain. The exhibition spans the full spectrum—from chip design and manufacturing to packaging, testin

The Exhibition Value of the Shenzhen International Semiconductor Exhibition (SEMI-e)

• A core platform for showcasing and exchanging technologies across the entire Chinese integrated circuit industry chain.Hosted by CIOE China Optics Expo and the Integrated Circuit Innovation Alliance, and organized by iJiwei and Shenzhen Zhongxincai Convention & Exhibition Co., Ltd., SEMI-e has evolved over multiple editions into a highly influential professional exhibition platform. For the first time, it is co-located with CIOE China Optics Expo—the global benchmark for the optoelectronics industry—resulting in a combined exhibition footprint exceeding 300,000 square meters. With more than 5,000 premium exhibitors, SEMI-e has established a “super showcase” spanning the two core domains of integrated circuits and optoelectronics. This synergistic ecosystem of “optoelectronics + semiconductors” provides enterprises with a strategic gateway to transcend traditional industry boundaries and drive cross-sectoral innovation.
• Comprehensive coverage of the entire industry value chain, with in-depth thematic focus on four key pillars.The exhibition centers on three major themes—“IC Chips and Design,” “Wafer Fabrication and Packaging & Testing,” and “Compound Semiconductors”—while comprehensively encompassing the full industrial ecosystem, including chip design, wafer manufacturing, advanced packaging, power devices, semiconductor equipment and components, and materials. At the 2025 edition, 1,062 distinguished exhibitors will gather to highlight cutting-edge advancements such as edge‑AI chips, third‑generation semiconductors, optoelectronic co-packaged CPOs, and TGV technology, fully demonstrating the latest technological breakthroughs and innovative vitality of the integrated circuit industry.
• Bringing together world‑class companies to showcase groundbreaking technologies on a single stage.In the chip and design sector, leading firms such as UNISOC, ZTE Microelectronics, Zhaoxin, Beijing Junzheng, HuaDa Jiutian, and VeriSilicon are expected to participate. In wafer fabrication and packaging/testing, key players like HuaHong Group, Wuhan Xinxin, Tongfu Microelectronics, and Huajin Semiconductor will be present. In the equipment and components segment, domestic giants including North Huachuang, AMEC, Shengmei Shanghai, Huahai Qingke, and Tuojing Technology, alongside component specialists like Fuchuang Precision and Xinlai Group, will collectively form a core matrix covering the entire supply chain. Meanwhile, in the compound semiconductor field, companies such as Tianke Heda, ShuoKe Crystal, Puxing Electronics, BYD Semiconductor, and Ruineng Semiconductor will unveil their latest SiC/GaN innovations.
• Precise matchmaking with a vast pool of buyers, fostering robust business collaboration.The 2025 event is anticipated to attract a cumulative total of 43,986 professional visitors, with over 75,658 visitor entries. Professionals from semiconductor manufacturing, services, and core product sectors account for 60.48% of attendees, spanning critical areas such as wafer fabrication, packaging and testing, chip design, and equipment/materials. Industry leaders—including SMIC, HuaHong Group, Yuexin, BYD Auto, and ams OSRAM—will attend as VIP invited buyers, providing exhibitors with an efficient channel to connect directly with procurement decision-makers.
• High‑level summits and authoritative thought leadership, shaping the future direction of the industry.Alongside the exhibition, 22 conferences and events will be held, featuring 130 speakers addressing hot topics such as edge‑AI chips, the RISC‑V ecosystem, power semiconductors, advanced packaging, optoelectronic co‑packaged CPOs, and TGV technology. Representatives from HuaDa Jiutian, CloudWalk Technology, Suzhou Guoxin, FAW Hongqi, Tsinghua University, Southern University of Science and Technology, and other institutions, together with renowned experts, will convene to offer critical insights through data‑driven forecasting, trend analysis, and technical discussions, providing valuable guidance for corporate strategic planning.