Shenzhen International Integrated Circuit Innovation Expo Tickets

The Shenzhen International Semiconductor Exhibition has officially been upgraded to the IICIE International Integrated Circuit Innovation Expo. With the theme “Cross‑Industry Integration and Full‑Chain Collaboration: Co‑Building a Distinctive Chip Ecosystem,” the event comprehensively covers the entire semiconductor value chain, including chip design, manufacturing, packaging and testing, as well as equipment and materials. Grounded in application‑driven principles, the platform facilitates prec

The Exhibition Value of the Shenzhen International Semiconductor Exhibition (SEMI-e)

• A core platform for showcasing and exchanging technologies across the entire Chinese integrated circuit industry chain. Hosted by CIOE China Optics Expo and the Integrated Circuit Innovation Alliance, and organized by iJiwei and Shenzhen Zhongxincai Convention & Exhibition Co., Ltd., SEMI-e has evolved over multiple editions into a highly influential professional exhibition platform. For the first time, it is co‑hosted with CIOE China Optics Expo—the global benchmark for the optoelectronics industry—on the same dates and at the same venue. Together, the two exhibitions have surpassed 300,000 square meters in total area, bringing together more than 5,000 high‑quality exhibitors and establishing a “super‑exhibition platform” that spans the two core domains of integrated circuits and optoelectronics. This synergistic ecosystem of “optoelectronics + semiconductors” provides enterprises with a strategic gateway to transcend industry boundaries and achieve cross‑sectoral innovation.
• Comprehensive coverage of the entire industry chain, with in-depth thematic focus on four key areas. The exhibition centers on three major themes—“IC Chips and Design,” “Wafer Fabrication and Packaging & Testing,” and “Compound Semiconductors”—while comprehensively covering the full value chain, including chip design, wafer manufacturing, advanced packaging, power devices, semiconductor equipment and components, and materials. At the 2025 edition, 1,062 premium exhibitors will gather to showcase cutting‑edge innovations such as edge‑side AI chips, third‑generation semiconductors, optoelectronic co‑packaged CPOs, and TGV technology, fully highlighting the latest technological breakthroughs and dynamic innovation within the integrated circuit industry.
• Gathering world‑leading companies to compete and demonstrate groundbreaking technologies. In the chip and design sector, industry leaders such as Unisoc, ZTE Microelectronics, Zhaoxin, Beijing Junzheng, HuaDa Jiutian, and VeriSilicon are among the participants. In wafer fabrication and packaging/testing, key players like HuaHong Group, Wuhan Xinxin, Tongfu Microelectronics, and Huajin Semiconductor take center stage. In the equipment and components segment, domestic giants including North Huachuang, AMEC, Shengmei Shanghai, Huahai Qingke, and Tuojing Technology join forces with component specialists like Fuchuang Precision and Xinlai Group to form a comprehensive “end-to-end” matrix. Meanwhile, in the compound semiconductor field, companies such as Tianke Heda, ShuoKe Crystal, Puxing Electronics, BYD Semiconductor, and Ruineng Semiconductor present their latest advancements in SiC and GaN technologies.
• Precise matchmaking with a vast pool of buyers, driving robust business collaboration. The 2025 edition is expected to attract a cumulative total of 43,986 professional visitors, with over 75,658 visitor entries. Professionals from semiconductor manufacturing, services, and core product sectors account for 60.48% of attendees, spanning critical links such as wafer fabrication, packaging and testing, chip design, and equipment/materials. Industry leaders including SMIC, HuaHong Group, YueXin, BYD Auto, and ams OSRAM have been invited as VIP buyers, providing exhibitors with an efficient channel to connect directly with procurement decision‑makers.
• High‑profile summits and authoritative thought leadership, shaping the future direction of the industry. Alongside the exhibition, 22 conferences and events will be held, featuring 130 distinguished speakers. Topics include edge‑side AI chips, the RISC‑V ecosystem, power semiconductors, advanced packaging, optoelectronic co‑packaged CPOs, and TGV technology. Representatives from companies and experts from institutions such as HuaDa Jiutian, CloudWalk Technology, Suzhou Guoxin, FAW Hongqi, Tsinghua University, and Southern University of Science and Technology will convene to offer critical insights through data‑driven forecasting, trend analysis, and technical discussions, providing valuable guidance for corporate strategic planning.