• Leading International Equipment and Materials Brands: ASML, Applied Materials (AMAT), Lam Research, KLA, Tokyo Electron (TEL), DISCO, Nikon, Canon, Hitachi, DNS, Germany’s Merck and Zeiss, Britain’s Edwards, Hungary’s SEMILAB, Korea’s 3M, JUSUNG Engineering, Sumitomo Chemical, KE, FerroTec, Thermo Fisher, EBARA, Keysight, SHIBAURA
• China’s Leading Equipment and Materials Brands: Northern Huacheng, XinKailai, Tuojing Technology, Shengmei Semiconductor, Shanghai Microelectronics, HuaHai Qingke, Xinyuan Micro, Zhongwei Company, Zhi Chun Technology, Jiangfeng Electronics, Ya Ke Technology, Hu Si Industry, Hua Zhuo Jingke, Shuo Ke Zhong Ke Xin, Da Zu Semiconductor, Xin San Dai, Kuai Ke Xin, Xian Wei Technology, Si Rui Intelligent, CETC Fenghua, Zhi Cheng Semiconductor, Tian Ke He Da, Tian Yue Advanced, Shuo Ke Crystal, Tian Yu Semiconductor, Coherent Gao Yi
• Chip Design and Manufacturing Brands: CR Microelectronics, Fang Zheng Microelectronics, Xin Yue Neng, InnoSecco, HiSilicon Semiconductor, ZTE Microelectronics, Peng Jin High Tech, Shanghai Huali Microelectronics, Hua Hong Hongli, Yangtze Storage, Chang Xin Storage
• Packaging and Testing Brands: Hua Tian Technology, Sheng He Jing Wei, Chang Dian Technology, Tong Fu Microelectronics
• EDA and Design Services Brands: Qi Yun Fang Technology, Hua Da Jiu Tian, Gai Lun Electronics, Guang Li Wei
• Cloud Services and AI Chip Brands: Intel, Alibaba’s DAMO Academy, Tencent Cloud, Lenovo, China Telecom, China Mobile, China Unicom, Hai Guang Information, Lan Xin Computing Power
• Testing and Measurement Instrument Brands: Wanliyan Technology, Keysight
• Compound Semiconductors and Power Device Brands: National Third-Generation Semiconductor Technology Innovation Center (Shenzhen), Shenzhen Pinghu Laboratory, Jiufengshan Laboratory, Jingzhan Semiconductor, Gallium Future, Nitrogen Silicon Technology, Xin Wei Semiconductor, Hai Mu Xin Wei, Tian Ke He Da, Tian Yue Advanced, Shuo Ke Crystal, Tian Yu Semiconductor, Tong Guang Semiconductor, Zhejiang Jing Rui, Titan Future, Tian Cheng Semiconductor, Xin Ju Neng, San An Semiconductor, An Hai Semiconductor, De Ke Microelectronics, He Sheng New Materials, Jing Hang Special Carbon, Heng Pu Technology, Ao Yi Da New Materials, Chuang Rui Spectrum, West Lake Instruments, Ke You Semiconductor, Jiu Yu Semiconductor, Guo Yang Electronics, Zhan Xin Electronics, Ling Rui Semiconductor, Zhong Dian Compound, Xin Gan Technology, Yi Bian Electrical, Dong Ni Electronics, Sigma, Ming Yang Semiconductor, Rui Fei Optics, Li Guan Micro, Gree Electronics, Xin Yan Ke
• Materials and Components Brands: Hangzhou Zhong Xin Wafer, Anhui Bo Xin Micro, Ningxia Dun Yuan Ju Xin, Xin Feng Precision, Shenzhen Wei He Technology

Wafer Fabrication Zone: Wafer fabrication and IDM companies, wafer manufacturing equipment, metrology tools, advanced materials, components and indirect consumables, green facility systems, and supporting infrastructure

Compound Semiconductor Zone: Silicon carbide (SiC), gallium nitride (GaN), gallium arsenide (GaAs), gallium oxide (Ga₂O₃), diamond; wafer manufacturing equipment, metrology tools, substrates, epitaxy, components and indirect consumables; RF, high-power semiconductors, and next-generation power devices

IC Design Zone: Electronic design automation (EDA) software and services, chip design IP and related services, memory chips, AI chips, and other design services

Advanced Packaging Zone: Packaging and testing companies, packaging and testing equipment, packaging materials, glass substrates, and associated processes