Verified: updated on

3th
Shenzhen Bay Chip Expo
WESEMIBAY SEMICONDUCTOR ECOSYSTEM EXPO
- Dates
- Show Hours:
- Highlights
- An international specialized trade show for the semiconductor industry chain


Exhibition Data
- 1/1
- Edition
- 70000㎡
- Exhibition area
- 1000
- Exhibitors
- 70000
- Visitors
Shenzhen Semiconductors Expo Details
- Organizer:
- Shenzhen Semiconductor and Integrated Circuit Industry Alliance SICA, Shenzhen Major Industry Investment Group Co., Ltd.
- Venue:
- Shenzhen Convention & Exhibition Center
- Address:
- Shenzhen Convention and Exhibition Center, No. 3 Fuhua Road, Futian District, Shenzhen
Profile
The Bay Area Semiconductor Industry Ecosystem Expo (shortened to “Bay Chip Expo”) covers an exhibition area of over 70,000 square meters, bringing together more than 1,000 leading semiconductor companies. It features four core thematic zones—wafer fabrication, compound semiconductors, advanced packaging, and IC design/AI infrastructure. Concurrently, the Bay Area Semiconductor Conference will be held, accompanied by over 40 high‑level, cutting‑edge forums, expected to attract more than 70,000 professional visitors and showcase the latest technological breakthroughs and solutions across the entire semiconductor value chain.
This edition of the Bay Chip Expo focuses on key segments including wafer fabrication, compound semiconductors, advanced packaging, and IC design/AI infrastructure, while integrating resources spanning equipment, materials, critical components, testing and metrology, software platforms, investment and financing, as well as end‑use applications, further strengthening the closed-loop industrial ecosystem from chip design through manufacturing and packaging to system integration.
The event invites companies from over 20 countries and regions, including China, the United States, Japan, the Netherlands, Germany, South Korea, Hungary, Singapore, the United Kingdom, Switzerland, and others. Leading enterprises such as ASML, Applied Materials, Lam Research, TEL, KLA, North Huachuang, ASM, Zhongwei Company, SCREEN, DISCO, Shengmei Semiconductor, Merck, Changfei Advanced, Tuojing Technology, KE, Huahai Qingke, VAT, FerroTec, Yitang Shares, CET Equipment, Weidu Nano, Yisiwei, Zhongke Feice, SEMILAB, Edwards, Jingzhida, Shanghai Microelectronics, Shanghai Jingce, Zhonghuan Leading, SHIBAURA, Kebait, Inovance Technology, Jiangfeng Electronics, Fuchuang Precision, Yak Technology, and many others—totaling over 1,000 industry leaders—are expected to participate, facilitating domestic firms’ access to international supply chains and expanding opportunities for global collaboration.
The venue brings together chip designers, smart terminal manufacturers, telecommunications providers, automotive electronics firms, AI developers, data center operators, and other stakeholders, all with robust demands for technology selection, supply chain procurement, and product integration. By convening industry players, buyers, end‑users, research institutes, investment entities, and industry platforms under one roof, the Bay Chip Expo aims to advance exhibit‑driven connections toward direct supply‑demand matching and project‑based collaborations.
Concurrent Events

Shenzhen Bay Chip Expo tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for Shenzhen Bay Chip Expo: 上海凌恒工业自动化有限公司, 海普瑞(常州)洁净系统科技有限公司, 钰镍(上海)半导体科技有限公司, 深圳市凯尔迪光电科技有限公司, 吉姆西半导体科技(无锡)股份有限公司, 德瑞精工(深圳)有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
The Value of Exhibiting at the Shenzhen BayCore Expo
- The Shenzhen BayCore Expo (SEMiBAY) is one of China’s largest and most influential specialized exhibitions for the semiconductor and integrated circuit industries. Strategically supported by the Shenzhen Municipal Government and organized by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance, it serves as a core exhibition platform within Shenzhen’s “Six Ones” working mechanism. Since its inception in 2024, the expo has evolved into a vital forum for deep integration among domestic and international semiconductor industry chains, supply chains, and value chains, earning recognition as China’s premier showcase for indigenous semiconductor brands.
- The core value of participating lies in its role as a precision-matching platform connecting the semiconductor industry clusters of the Greater Bay Area. In 2024, Shenzhen’s semiconductor and integrated circuit industry reached a scale of RMB 256.4 billion, growing by 26.8% year-on-year. In the first half of 2025, the sector continued to expand rapidly at a rate of 16.9%, with over 700 companies active across the entire value chain. The expo acts as a central link within the Guangdong–Hong Kong–Macao Greater Bay Area’s semiconductor ecosystem, enabling exhibitors to directly engage with key investment entities and leading corporate buyers—including BYD, Foxconn, DJI, Yangtze Memory, and HuaHong Group—thus sharing opportunities in the region’s largest domestic and international semiconductor growth markets.
- The expo provides a one-stop commercial platform covering the entire semiconductor value chain. It features four core exhibition zones—wafer fabrication, advanced packaging, compound semiconductors, and chip design—as well as three distinctive thematic areas focusing on AI chips and edge computing ecosystems, RISC‑V ecosystems, and Chiplet and advanced packaging ecosystems. At the second edition in 2025, the exhibition spanned over 60,000 square meters, attracting more than 600 exhibitors from over 20 countries and regions worldwide. The number of international exhibitors grew by more than 50% compared to the previous year, encompassing global TOP30 firms such as U.S.-based Applied Materials, Lam Research, and KLA, Japan’s Tokyo Electron, DISCO, and Nikon, Germany’s Merck and Zeiss, alongside domestic leaders like Northern Huacheng, XinKailai, Tuojing Technology, CR Microelectronics, and Shanghai Microelectronics.
- The expo aligns with industry trends toward technological breakthroughs and ecosystem building, establishing itself as a cutting-edge hub for deep integration among academia, industry, research institutes, and end-users. Concurrent with the expo, the 2025 Chip Conference, the 9th International Symposium on Advanced Lithography Technologies, and over 30 other specialized forums were held, inviting academicians such as Mao Junfa and Gu Min, along with thousands of industry leaders, to engage in in-depth discussions on core technology R&D and ecosystem collaboration. During the event, the 2025 “BayCore Awards” were announced, with over 100 enterprises receiving distinguished honors, and the “Top Ten Advances in Chinese Chip Science 2024” were unveiled.
- For Chinese enterprises, the expo serves as a strategic gateway for showcasing independent innovation, accessing international resources, and expanding overseas branding. The 2025 expo drew exhibitors from over 20 countries and regions spanning Europe, the Americas, Japan, Korea, Southeast Asia, and beyond, hosting an international supply-and-demand matchmaking event for Made-in-China exports to help Chinese companies penetrate global markets. The expo also innovatively upgraded its year-round, omni-channel resource-matching service model—combining online, on-site, and offline components—to facilitate the convergence of technology, products, markets, information, capital, and policies. During the expo, the inaugural Shenzhen Semiconductor and Integrated Circuit Industry Investment Fund (Semi Industry Fund), with an initial scale of RMB 5 billion, was officially launched, injecting fresh financial vitality into the sector’s development.
Range
- Leading International Equipment and Materials Brands: ASML, Applied Materials (AMAT), Lam Research, KLA, Tokyo Electron (TEL), DISCO, Nikon, Canon, Hitachi, DNS, Germany’s Merck and Zeiss, Britain’s Edwards, Hungary’s SEMILAB, Korea’s 3M, JUSUNG Engineering, Sumitomo Chemical, KE, FerroTec, Thermo Fisher, EBARA, Keysight, SHIBAURA
- China’s Leading Equipment and Materials Brands: Northern Huacheng, XinKailai, Tuojing Technology, Shengmei Semiconductor, Shanghai Microelectronics, HuaHai Qingke, Xinyuan Micro, Zhongwei Company, Zhi Chun Technology, Jiangfeng Electronics, Ya Ke Technology, Hu Si Industry, Hua Zhuo Jingke, Shuo Ke Zhong Ke Xin, Da Zu Semiconductor, Xin San Dai, Kuai Ke Xin, Xian Wei Technology, Si Rui Intelligent, CETC Fenghua, Zhi Cheng Semiconductor, Tian Ke He Da, Tian Yue Advanced, Shuo Ke Crystal, Tian Yu Semiconductor, Coherent Gao Yi
- Chip Design and Manufacturing Brands: CR Microelectronics, Fang Zheng Microelectronics, Xin Yue Neng, InnoSecco, HiSilicon Semiconductor, ZTE Microelectronics, Peng Jin High Tech, Shanghai Huali Microelectronics, Hua Hong Hongli, Yangtze Storage, Chang Xin Storage
- Packaging and Testing Brands: Hua Tian Technology, Sheng He Jing Wei, Chang Dian Technology, Tong Fu Microelectronics
- EDA and Design Services Brands: Qi Yun Fang Technology, Hua Da Jiu Tian, Gai Lun Electronics, Guang Li Wei
- Cloud Services and AI Chip Brands: Intel, Alibaba’s DAMO Academy, Tencent Cloud, Lenovo, China Telecom, China Mobile, China Unicom, Hai Guang Information, Lan Xin Computing Power
- Testing and Measurement Instrument Brands: Wanliyan Technology, Keysight
- Compound Semiconductors and Power Device Brands: National Third-Generation Semiconductor Technology Innovation Center (Shenzhen), Shenzhen Pinghu Laboratory, Jiufengshan Laboratory, Jingzhan Semiconductor, Gallium Future, Nitrogen Silicon Technology, Xin Wei Semiconductor, Hai Mu Xin Wei, Tian Ke He Da, Tian Yue Advanced, Shuo Ke Crystal, Tian Yu Semiconductor, Tong Guang Semiconductor, Zhejiang Jing Rui, Titan Future, Tian Cheng Semiconductor, Xin Ju Neng, San An Semiconductor, An Hai Semiconductor, De Ke Microelectronics, He Sheng New Materials, Jing Hang Special Carbon, Heng Pu Technology, Ao Yi Da New Materials, Chuang Rui Spectrum, West Lake Instruments, Ke You Semiconductor, Jiu Yu Semiconductor, Guo Yang Electronics, Zhan Xin Electronics, Ling Rui Semiconductor, Zhong Dian Compound, Xin Gan Technology, Yi Bian Electrical, Dong Ni Electronics, Sigma, Ming Yang Semiconductor, Rui Fei Optics, Li Guan Micro, Gree Electronics, Xin Yan Ke
- Materials and Components Brands: Hangzhou Zhong Xin Wafer, Anhui Bo Xin Micro, Ningxia Dun Yuan Ju Xin, Xin Feng Precision, Shenzhen Wei He Technology
Review
The 2nd Bay Area Semiconductor Industry Ecosystem Expo (BayCore Expo) 2025 was successfully held from October 15 to 17, 2025, at the Shenzhen Convention & Exhibition Center (Futian). With the theme “Chips Power the Future, Intelligence Creates the Ecosystem,” this year’s event was organized by the Shenzhen Semiconductor and Integrated Circuit Industry Alliance and has become an annual highlight for the semiconductor industry in the Guangdong–Hong Kong–Macao Greater Bay Area.
In terms of scale, the exhibition covered over 60,000 square meters, bringing together more than 600 exhibiting companies from over 20 countries and regions worldwide. The total number of professional visitors reached 112,300, with over 48,300 attendees on the first day. Exhibiting companies unveiled approximately 2,500 new products, while the number of international exhibitors increased by more than 50% compared to the previous edition. All of the world’s top 30 semiconductor and integrated circuit companies were present.
This year’s expo featured numerous highlights, including a series of groundbreaking achievements that have broken foreign monopolies. Shenzhen XinKailai Industrial Machinery Co., Ltd. showcased 16 products across two major categories—process equipment and metrology instruments—making it the most-visited booth at the show. Its subsidiary Wanliyan Technology unveiled the world’s first ultra-high-speed intelligent oscilloscope and China’s first 90 GHz ultra-high-speed real-time oscilloscope, both delivering performance improvements of up to 500% over existing domestic benchmarks, marking a significant breakthrough in China’s high-end electronic measurement instrumentation sector. Qiyunfang Technology introduced fully domestically-developed EDA design software covering schematic and PCB design, filling a critical gap in China’s high-end electronic design industrial software ecosystem.
A rich array of concurrent events created a premier platform for industry dialogue. During the expo, more than 30 specialized forums were held, including the 2025 Chip Conference and the 9th International Symposium on Advanced Lithography Technologies. Academicians such as Mao Junfa, Gu Min, and Yu Dapeng, along with thousands of industry leaders, engaged in in-depth discussions on core technology R&D and ecosystem collaboration. At the opening ceremony, the Shenzhen Advanced Manufacturing Supply Chain Innovation Service Platform and the first phase of the Shenzhen Semiconductor and Integrated Circuit Fund (Semi Industry Fund), with an initial scale of RMB 5 billion, were officially launched.
A strong contingent of professional buyers ensured effective market-oriented matchmaking. The expo facilitated precise connections between major industrial project clusters in the Greater Bay Area and approximately 5,000 leading corporate buyers—including SMIC, Samsung, BYD, Foxconn, and DJI—and exhibiting companies. Concurrently, the 2025 “BayCore Awards” were announced, with over 378,280 professional votes and expert panel evaluations resulting in more than 100 enterprises receiving prestigious honors such as the Outstanding Enterprise Award and the Technological Innovation Award.
The expo yielded remarkable results and received enthusiastic industry acclaim. Exhibiting companies widely reported that this year’s event attracted high-quality professional audiences with clear purchasing intentions, and that its internationalization level had achieved a significant leap forward. Li Xiaopeng, SEMILAB’s South China Regional Manager, noted that Shenzhen’s innovative DNA continues to draw companies eager to deepen their presence here. Liu Sang, CEO of Wanliyan, emphasized that participation helps enhance supply chain resilience and competitiveness from an ecosystem perspective.
Attendees agreed that BayCore Expo is not only an excellent platform for brand exposure and business matchmaking but also a crucial hub for gaining insights into industry trends and exploring pathways toward independent innovation in semiconductors. To date, over 600 companies have secured exhibition spaces for BayCore Expo 2026, with 95% of the three main pavilions already booked. International giants such as Applied Materials, KLA, Tokyo Electron, as well as domestic leaders like Northern Huacheng, Tuojing, and Shengmei Semiconductor, have all renewed their participation as scheduled.
WESEMIBAY SEMICONDUCTOR ECOSYSTEM EXPO 2026 Venue Map

WESEMIBAY SEMICONDUCTOR ECOSYSTEM EXPO Exhibitior List
Shenzhen Bay Chip Expo Range
- IDM Manufacturers ,
- Wafer Fabrication Equipment ,
- Metrology Equipment ,
- Advanced Materials ,
- Components and Indirect Consumables ,
- Green Facility Operations and Supporting Infrastructure
- Silicon Carbide (SiC) ,
- Gallium Nitride (GaN) ,
- Gallium Arsenide (GaAs) ,
- Gallium Oxide (Ga2O3) ,
- Diamond ,
- Substrates ,
- Epitaxy ,
- RF, High-Power Semiconductors, and New-Energy Power Devices
- Electronic Design Automation (EDA) Software and Services ,
- Chip Design IP and Services ,
- Memory Chips ,
- AI Chips
- Packaging and Testing Companies ,
- Packaging and Testing Equipment ,
- Packaging Materials ,
- Glass Substrates and Related Processes
Booth Sales

Mr. WuGold-Medal PM
3 Years Booth Sales
2026 Shenzhen Semiconductors Ticket Sales

Mr. HanGold-Medal PM
3 Years Booth Sales

Ms. LiuGold-Medal PM
3 Years Booth Sales
Shenzhen Semiconductors Venue
Shenzhen Semiconductors Booth Price


Process
- 1.Submit the business license of the company
- 2.Submit product picture and name
- 3.Receive exhibition presentation documents and booth drawings
- 4.Submit booth application form/Sign booth contract
- 5.Pay the contract booth deposit
- 6.Prepare for exhibition





