AI Servers & Cluster Architecture: Showcases open hardware solutions ranging from single-node AI servers to full-rack AI clusters, such as MiTAC's OCP ORv3 liquid-cooled racks and EIA air-cooled racks.

Liquid Cooling & Thermal Management Solutions: SUNON exhibits three core products: open cold plates, CDU (Coolant Distribution Unit) liquid distribution devices, and closed-loop liquid cooling systems. CoolIT, MiTAC, and others showcase 200kW In-Rack CDU liquid cooling solutions supporting high-density GPU deployments.

High-Power Power Delivery & Interconnect Technologies: Features high-current solutions such as 800VDC power architectures (Delta, Lite-On), LVDC/HVDC distributed power delivery, and rear-door rack power distribution. TE Connectivity and Amphenol exhibit blind-mate busbar connectors, modular bus interfaces, and high-density optical/copper interconnects.

Networking & Switching Technologies: Broadcom unveils the Tomahawk Ultra switch and 3rd-generation CPO (Co-Packaged Optics) technology, supporting 1.6T optical transceivers. NVIDIA showcases Spectrum-X™ Ethernet Switches, supporting hyperscale AI data centers for Meta, Oracle, and others.

Open Platform Firmware & Management: MiTAC Live Demo showcases OpenBMC + Open Platform Firmware (OPF) to replace proprietary stacks with open-source firmware. Discussions cover security and transparent management mechanisms such as Redfish, SBOM, and NIST compliance.

Storage & SSD Innovations: Manufacturers like Dapustor exhibit NVMe SSDs supporting high-bandwidth, low-latency AI training scenarios. Solidigm and Micron showcase high-endurance NVMe E1.S/U.2 SSDs tailored for AI/HPC workloads.

Sustainability & Digital Twins: Explores the application of PUE optimization, heat recovery, and digital twins in data center operations. Multiple enterprises share design practices for "Green AI Factories," aligning with the theme "Leading the Future of AI".