IC Design/Chip Zone: EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, artificial intelligence chips, power management chips, IoT chips, 5G communication chips, automotive electronics chips, security control chips, analog-digital hybrid RF chips, memory chips, display driver chips, and more

Integrated Circuit Manufacturing Zone: Wafer fabrication plants, foundries, and manufacturers of analog, digital, and mixed-signal ICs

Materials Zone: Silicon wafers, silicon ingots, single-crystal silicon, silicon slices, photoresists, chemical reagents, electronic gases, polishing materials, resist materials, metal targets, compound semiconductor materials, and more

Third-Generation Semiconductor Zone: Silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond, and related materials and application technologies

Equipment Zone: Semiconductor wafer processing equipment, semiconductor packaging equipment, semiconductor testing equipment, IC test instruments, and more

Packaging, Testing, and Measurement: Complete packaging and testing facilities, companies specializing in packaging and testing process lines, probe stations, test machines, sorters, packaging equipment, packaging substrates, lead frames, bonding wires, electronic and communication instruments, electrical measuring instruments, environmental testing instruments and equipment, analytical instruments, certification and inspection services, automated instrumentation, and more

Electronic Components Zone: Resistors, capacitors, potentiometers, vacuum tubes, heat sinks, electromechanical components, connectors, discrete semiconductor devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro‑special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various types of circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, substrate materials for printed circuits, specialized materials for electronic functional processes, electronic adhesives (tapes), electronic chemical materials and parts, microwave components, complete microwave communication systems, microwave RF testing instruments, dedicated software, and more

New Display Technologies and Smart Terminals: OLED, AMOLED, Mini/MicroLED displays, automotive displays, medical displays, educational displays, wearable displays, VR displays, smart transportation displays, as well as terminal‑side displays, flexible displays, and related materials and equipment

Big Data and Artificial Intelligence: Big data and AI, big data and intelligent manufacturing, big data and smart cities, big data and healthcare, big data and financial innovation, big data and e‑commerce, and more

Smart Electronic Manufacturing: SMT technologies and equipment, assembly equipment for automotive and consumer electronics, laser equipment, soldering and dispensing technologies, special‑shaped component insertion technologies, AOI/ATE inspection, programming equipment, ESD protection and purification systems, and more

Smart Factories: Factory automation and robotics, AGVs and smart warehousing, 3D printing, drive technologies, comprehensive solutions, precision components and supporting products for automation and robotics, software and development, and more

PCB and Circuit Carrier Manufacturing: Various types of circuit boards, automated circuit board processing equipment, copper strips, copper foils, and more

Connector and Wire Harness Processing: Various connectors, plugs, sockets, switches, wire harnesses, cables, and associated processing equipment

Electronic and Chemical Materials: Substrates and auxiliary materials for PCBs, fine electronic chemicals, optoelectronic materials, specialized metallic materials for electronics, and more