China (Hefei) International Semiconductor and Integrated Circuit Industry ExhibitionCICE
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Profile
The China Hefei International Semiconductor and Integrated Circuit Industry Exhibition (CICE) will be held under the theme “Winning the Chip Era, Co‑Creating the Chip Future,” offering exhibitors a global platform for business exchange.
The CICE has once again raised the bar in both scale and quality, with 30,000 square meters of exhibition space divided into 11 core zones that comprehensively cover key segments including IC design/chips, wafer fabrication, third‑generation semiconductors, semiconductor materials, equipment manufacturing, packaging and testing, as well as AI‑plus‑5G applications. From upstream core materials such as EDA tools and photoresists to high‑end manufacturing equipment like lithography machines and etching systems, and down to end‑use products ranging from automotive electronic chips and AI computing chips to SiC/GaN-based third‑generation semiconductor devices, cutting‑edge technologies and innovative breakthroughs will be showcased, providing a holistic view of the industry’s technological evolution and innovation trajectory.
In addition, the exhibition introduces an innovative full‑cycle service model—“pre‑show matching, on‑site matchmaking, and post‑show follow‑up”—featuring one‑on‑one business meetings, new‑product launch events, and technical seminars. This approach breaks down traditional trade fair barriers, facilitates efficient connections between supply and demand, and unlocks collaboration opportunities worth tens of billions of yuan.
At present, the global digital transformation is propelling the semiconductor and integrated circuit industry to become a central engine of growth. The development of 5G, artificial intelligence, new‑energy vehicles, and other sectors all relies heavily on semiconductor chips. While the global market continues to expand, it also brings with it new opportunities and challenges. As a strategic national industry, the semiconductor sector enjoys robust policy support; both the “Made in China 2025” initiative and the 14th Five‑Year Plan designate it as a priority area. Semiconductors and integrated circuits serve as the “heart” of the digital age, driving innovation and transformation across diverse fields. In recent years, the global semiconductor market has grown steadily, and emerging technologies have continued to emerge, presenting both fresh opportunities and pressing challenges for industry development.
Semiconductor technology is reshaping the world, with Anhui leading a new wave of industry advancement. The China Hefei International Semiconductor and Integrated Circuit Industry Exhibition (CICE) invites stakeholders to join this grand industry event where the brilliance of “chips” converges, using technology as a bridge and innovation as wings to jointly write a new chapter of high‑quality development for the semiconductor sector!
Exhibitor List
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Product Range
IC Design/Chip Zone: EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, artificial intelligence chips, power management chips, IoT chips, 5G communication chips, automotive electronics chips, security control chips, analog-digital hybrid RF chips, memory chips, display driver chips, and more
Integrated Circuit Manufacturing Zone: Wafer fabrication plants, foundries, and manufacturers of analog, digital, and mixed-signal ICs
Materials Zone: Silicon wafers, silicon ingots, single-crystal silicon, silicon slices, photoresists, chemical reagents, electronic gases, polishing materials, resist materials, metal targets, compound semiconductor materials, and more
Third-Generation Semiconductor Zone: Silicon carbide (SiC), gallium nitride (GaN), zinc oxide (ZnO), diamond, and related materials and application technologies
Equipment Zone: Semiconductor wafer processing equipment, semiconductor packaging equipment, semiconductor testing equipment, IC test instruments, and more
Packaging, Testing, and Measurement: Complete packaging and testing facilities, companies specializing in packaging and testing process lines, probe stations, test machines, sorters, packaging equipment, packaging substrates, lead frames, bonding wires, electronic and communication instruments, electrical measuring instruments, environmental testing instruments and equipment, analytical instruments, certification and inspection services, automated instrumentation, and more
Electronic Components Zone: Resistors, capacitors, potentiometers, vacuum tubes, heat sinks, electromechanical components, connectors, discrete semiconductor devices, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro‑special motors, electronic transformers, relays, printed circuit boards, integrated circuits, various types of circuits, piezoelectric, crystal, quartz, ceramic magnetic materials, substrate materials for printed circuits, specialized materials for electronic functional processes, electronic adhesives (tapes), electronic chemical materials and parts, microwave components, complete microwave communication systems, microwave RF testing instruments, dedicated software, and more
New Display Technologies and Smart Terminals: OLED, AMOLED, Mini/MicroLED displays, automotive displays, medical displays, educational displays, wearable displays, VR displays, smart transportation displays, as well as terminal‑side displays, flexible displays, and related materials and equipment
Big Data and Artificial Intelligence: Big data and AI, big data and intelligent manufacturing, big data and smart cities, big data and healthcare, big data and financial innovation, big data and e‑commerce, and more
Smart Electronic Manufacturing: SMT technologies and equipment, assembly equipment for automotive and consumer electronics, laser equipment, soldering and dispensing technologies, special‑shaped component insertion technologies, AOI/ATE inspection, programming equipment, ESD protection and purification systems, and more
Smart Factories: Factory automation and robotics, AGVs and smart warehousing, 3D printing, drive technologies, comprehensive solutions, precision components and supporting products for automation and robotics, software and development, and more
PCB and Circuit Carrier Manufacturing: Various types of circuit boards, automated circuit board processing equipment, copper strips, copper foils, and more
Connector and Wire Harness Processing: Various connectors, plugs, sockets, switches, wire harnesses, cables, and associated processing equipment
Electronic and Chemical Materials: Substrates and auxiliary materials for PCBs, fine electronic chemicals, optoelectronic materials, specialized metallic materials for electronics, and more
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Booth Sales
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Ticket Sales
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Venue
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Booth price
Standard booth Configuration
Blank booth Configuration
China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Semiconductors Fair
OnlineBooth: 0571-88535771
Spectator: 0571-89099107
Online
门票咨询
Mr. Han
金牌项目经理
OnlineTel 13336023729
Mobile phone 15397162655
门票咨询
铜牌项目经理
OnlineTel 18067909721
Mobile phone 18067909721
展位咨询
Mr. Wu
金牌项目经理
OnlineTel 13867062165
Mobile phone 13867062165
Work time:Monday to Friday09:00-18:00
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