

China Beijing Semiconductor Expo Expo Profile
China Beijing Semiconductor Expo (CIOE EXPO) was founded in 2005. It is jointly hosted by the China Equipment Management Association, the China Mechanical and Electrical Products Distribution Association, and Zhonggongzhi Technology Co., Ltd. It has witnessed the improvement of China's semiconductor industry level, promoted the exchange and integrated development of domestic and international semiconductor industry technology, and boosted the prosperity of the domestic and international semiconductor technology equipment market. (The content of this article belongs exclusively to Juzhan and may not be forwarded without permission.)
The Beijing International Semiconductor Exhibition CIOE EXPO is a grand event for the Chinese semiconductor industry. It is an important platform that is held once a year to concentrate on displaying new products and technologies, and it is also an important window for the world's semiconductor technology equipment industry to communicate. It has become a grand feast for domestic and foreign semiconductor technology equipment manufacturers and related service providers.
The rise of China's intelligent manufacturing industry and the transformation of the global semiconductor electronics industry from a vertical structure to a horizontal structure, with the increasing specialization of the value chain division, China is becoming one of the main production bases for global semiconductor manufacturing, which has promoted the rapid growth of China's semiconductor industry. To further enhance the development of the semiconductor industry, fully demonstrate the cutting-edge equipment technology of the semiconductor industry, actively promote the interaction between the semiconductor industry, strengthen the awareness of communication and cooperation in the semiconductor industry, and achieve mutual promotion and common development. The Beijing International Semiconductor Exhibition CIOE EXPO provides a comprehensive platform for the display and exchange of the semiconductor industry.
Exhibitor List
China Beijing Semiconductor Expo Range
Semiconductor design, packaging, testing, and manufacturing producers (The content of this article belongs exclusively to Juzhan and may not be forwarded without permission)
Raw Materials: Silicon wafers, photoresist, photo masks, electronic gases and special chemical gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging materials
Production Equipment: Single crystal furnace, oxidation furnace, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machine, etching machine, polishing machine, chamfering machine, coating/developing machine, front-end test equipment, wet process equipment, thermal processing, coating equipment, single wafer deposition system, cleaning equipment
Packaging Process and Equipment: Wafer thinning machine, dicing machine, die bonder, wire bonding machine, encapsulation machine, bending equipment, sorting machine, testing machine, robot automation, machine vision, other materials and electronic special equipment, etc.
Testing and Packaging Supporting Products: Probe card, wire bonding, burn-in testing, automated testing, laser cutting and others, grinding fluid, dicing fluid, sealing film (adhesive), high temperature tape, laminated substrate, solder paste, feeder board, wire, flow control, quartz graphite, silicon carbide, etc.
China Beijing Semiconductor Expo Booth Sales

China Beijing Semiconductor Expo Ticket Sales

China Beijing Semiconductor Expo Venue
China Beijing Semiconductor Expo Booth price

Standard booth Configuration

Blank booth Configuration
China Beijing Semiconductor Expo Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
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