China International Semiconductor Packaging Exhibition (ICPF)IC Packaging Show in Show

The IC Packaging Show in Show is presented concurrently with NEPCON China, featuring a dynamic combination of “Semiconductor Packaging and Testing Equipment Showcase,” “Semiconductor Packaging Conference,” and an “OSAT Buyer Delegation.”

The IC Packaging Show in Show will partner with leading industry associations, prominent media outlets, and renowned consulting firms to host a Semiconductor Packaging Conference. The event is expected to include more than 20 thematic presentations, covering trends, process challenges, technological roadmaps, and commercialization progress across SiP, advanced packaging, and third-generation semiconductor device packaging. Over 600 attendees—representing packaging and testing facilities, IC design companies, EMS providers exploring cutting-edge packaging technologies, as well as suppliers of semiconductor packaging equipment and materials—are anticipated to participate in exchanges and knowledge sharing.

At the exhibition site, leading equipment vendors from across the value chain will be invited to set up SiP system-level packaging production lines. Each piece of equipment will be demonstrated on-site, accompanied by visualized production demonstrations, offering visitors an immersive experience of line layouts and manufacturing processes. A dedicated technical team will guide attendees through the exhibits, providing in-depth explanations and showcasing innovative solutions for the entire industry chain.