China(Shanghai)Semiconductor Packaging Expo (IC Packaging Show in Show) is presented at the NEPCON China exhibition with the form of "Semiconductor Packaging Equipment Display" + "Semiconductor Packaging Conference" + "OSAT Buyer Group" during the same period.

The China Semiconductor Packaging Exhibition (IC Packaging Show in Show) will host a semiconductor packaging conference in collaboration with industry authority associations, renowned media, and consulting institutions. The conference is expected to feature over 20 thematic presentations, covering trends, process issues, technical routes, and commercialization progress in the SiP and advanced packaging & third-generation semiconductor device packaging industry. It is expected that over 600 attendees from packaging and testing factories, IC design companies, EMS factories exploring advanced packaging processes, semiconductor packaging equipment and material suppliers, etc., will attend to exchange and learn. (The content of this article belongs exclusively to Expodirekt, and unauthorized forwarding is prohibited.)

At the China Semiconductor Packaging Exhibition (IC Packaging Show in Show), leading equipment suppliers in each link will be invited to set up a SiP system-level packaging production line on site, explaining the equipment situation one by one and combining it with visual production demonstrations. The audience will be brought an immersive production line layout and process, and there will be a professional technical team guiding and explaining throughout the visit for the benefit of the industrial chain.