
Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE)SICE
Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Profile
Standing on the industrial highland of the Yangtze River Delta, the Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) creates a global IC industry matchmaking platform integrating exhibition, trading, and communication. With the core theme of "Linking the Chip Ecosystem, Creating New Opportunities through Smart Manufacturing," the exhibition covers a total area of 30,000 square meters, comprehensively spanning the upstream and downstream of the semiconductor industry chain.
The semiconductor and integrated circuit industry is a crucial blue-ocean sector that serves as an engine, foundation, and landmark for the future. As global digital transformation accelerates, the significance of this industry becomes increasingly prominent. Zhejiang Province has now established a complete industrial chain covering design, materials, equipment, manufacturing, and packaging & testing. It has formed a distinctive industrial cluster for analog chips and power devices around Hangzhou Bay, centered on Hangzhou, Shaoxing, Ningbo, and Jiaxing, as well as a supporting industrial cluster for semiconductor materials centered on Huzhou, Jinhua, Quzhou, and Lishui.
As "China's Premier Digital Economy City," Hangzhou is home to tech giants such as Alibaba, Hikvision, and H3C, boasting a massive chip application market in cloud computing, AI, security, and communications. Meanwhile, top-tier universities like Zhejiang University continuously supply high-end R&D talent to the industry.
SICE will form complementary linkages with industrial events across the Yangtze River Delta, centrally showcasing China's latest technological breakthroughs across the entire semiconductor chain, including equipment, materials, design, and manufacturing. The exhibition focuses on cutting-edge hotspots such as third-generation semiconductors, advanced packaging, Chiplet, EDA tools, and AI chips. It strives to build a secure, stable, and resilient domestic supply chain system, assisting the Yangtze River Delta in developing a world-class integrated circuit industry cluster.
SICE will present a grand feast of technologies and products across the entire IC industry chain to the global community. It provides an excellent showcase for domestic equipment and materials, as well as promising IC design enterprises, attracting top global talent to Hangzhou and strongly driving industrial synergy in the Yangtze River Delta.
Exhibitor List
Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Product Range
IC Design / Chips & Applications:IC and related electronic product design, EDA, AI computing chips, memory chips, automotive chips, smart home appliance chips, AI chips, and products for IoT, AI, automotive electronics, smart cities, smart terminals, healthcare, etc.
IC Manufacturing:Semiconductor wafer manufacturing, semiconductor packaging & testing technologies and products.
Advanced Packaging:Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV & TGV), fan-out wafer-level packaging, and related design, materials, testing, and equipment.
Wafer Equipment / Packaging & Testing Equipment:Various precision equipment required for wafer processing, semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging process equipment (, SiP, 3D packaging), power device equipment, etc.
Compound Semiconductors & Power Devices:Compound semiconductor materials (, GaN, SiC) and related products, including power devices, RF devices, and upstream equipment & materials.
Semiconductor Materials:Monocrystalline silicon, silicon wafers & silicon-based materials, polishing pads, photomasks, sputtering targets, CMP slurry, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.
Core Semiconductor Components:Machine vision, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC parts, robots, quartz components, filters, RF power supplies, ceramic parts, electrostatic chucks (ESC), pressure gauges, pumps, mass flow controllers (MFC), motion control, servo motors, linear modules, cleanroom cable carriers, packaging molds, cooling equipment, induction heaters, etc.
AI Computing Power:AI chips, servers, switches, power supplies, liquid cooling & thermal management systems, etc.
Supporting Facilities & Services:Support products/cleanrooms, general business services/consulting, sales & services, standards & others.
Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Booth Sales

Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Ticket Sales


Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Venue
Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Booth price

Standard booth Configuration

Blank booth Configuration
Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE) Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition



















