Shanghai International Semiconductor Technology Conference and ExhibitionSIA

Semiconductor Equipment: packaging equipment, diffusion equipment, soldering equipment, cleaning equipment, testing equipment, refrigeration equipment, oxidation equipment, thinning machines, dicing machines, pick-and-place machines, single-crystal furnaces, oxidation furnaces, grinding machines, heat-treatment equipment, lithography machines, etching machines, polishing machines, chamfering machines, ion-implantation equipment, CVD/PVD systems, photoresist coating and development machines, front-end test equipment, wet-process equipment, thermal processing equipment, coating equipment, single-wafer deposition systems, die attach machines, plasma-cleaning equipment, dicing saws, wafer mounters, wire bonders, wire bonding machines, molding machines, reflow ovens, wave-soldering machines, test stations, bending equipment, sorters, robotic automation systems, machine vision systems, as well as other specialized materials and electronic equipment, coupling devices, tape‑forming machines, inspection equipment, temperature‑and‑humidity chambers, sensors, packaging molds, test fixtures, precision slides, stepper motors, valves, probe stations, cleanroom equipment, water‑treatment systems, and more.

IC Design: IC and related electronic product design, IC products and application technologies, IC testing methods and instrumentation, IC design and design tools, IC manufacturing and packaging, EDA tools, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, IDM models, fabless companies, and more.

Wafer Fabrication and Packaging: wafer fabrication, SiP advanced packaging, OSATs, EMS providers, OEMs, IDM manufacturers, silicon wafers and IC packaging substrates, printed circuit boards, packaging substrates, associated equipment, assembly and testing processes, packaging design, testing, manufacturing and packaging‑testing equipment, EDA tools, MCUs, printed circuit boards, packaging substrates, semiconductor materials and related equipment, and more.

Integrated Circuit Manufacturing: wafer fabrication facilities, foundries, analog ICs, digital ICs, mixed-signal ICs, and end‑product ICs, among others.

Packaging and Testing Support Systems: probe stations, probe cards, test machines, sorters, packaging equipment, packaging substrates, lead frames, bonding wires, wire bonding, burn-in testing, automated testing, laser cutting and other processes, grinding fluids, dicing fluids, sealing films (adhesives), high‑temperature tapes, laminated substrates, mounting adhesives, material feeders, wire‑bonding flow control, quartz, graphite, silicon carbide, and more.

Third‑Generation Semiconductors: third‑generation semiconductors such as silicon carbide (SiC) and gallium nitride (GaN), including wafers, substrates, packaging, testing, optoelectronic devices (LEDs, lasers, UV detectors), power electronics (diodes, MOSFETs, JFETs, BJTs, IGBTs, GTOs, ETOs, SBDs, HEMTs, etc.), microwave and RF devices (HEMTs, MMICs), and more.

Semiconductor Materials: silicon wafers and silicon‑based materials, silicon wafers, silicon chips, monocrystalline silicon, germanium‑silicon composites, SOI materials, silicon materials for solar cells, compound semiconductor materials, quartz products, graphite products, antistatic materials, encapsulating materials, ceramic substrates, chip‑bonding adhesives, photoresist materials, wet electronic chemicals, sputtering targets, packaging‑testing materials, slicing, grinding, polishing, thin‑film processing, and more.

Electronic Components: resistors, capacitors, potentiometers, vacuum tubes, heat sinks, electromechanical components, connectors, discrete semiconductor devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro‑motors, electronic transformers, relays, printed circuit boards, integrated circuits, various types of circuits, piezoelectric, crystal, quartz, specialized materials for electronic functional processes, adhesive (tape) products, core 5G components, special electronic parts, power management devices, memory modules, connectors, cables, plug‑in components, crystal oscillators, resistors, potentiometers, magnetic components, filtering elements, PCBs, motor fans, electroacoustic devices, display devices, diodes, triodes, filtering components, switches, and related component materials and equipment.