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China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO)Catalog consultation
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Fair basics
Industry scope
Chip Design / Wafer Fabrication: IC design & chips, EDA, MCU, wafer fabrication equipment & components, etc.
Advanced Packaging: Chiplet, SiP packaging, Wafer-Level Packaging (WLP), 3D packaging, Panel-Level Packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, IC substrates, semiconductor packaging materials & equipment, etc.
Semiconductor Dedicated Equipment / Components: Thinning machines, single crystal furnaces, polishing machines, thermal processing equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, cleaning equipment, dicing machines, die bonders & wire bonders, testers, handlers, probe stations & components, etc.
Advanced Materials / Carbon Materials / Diamond Semiconductors: Silicon wafers & silicon-based materials, photomask blanks, electronic gases, photoresists & ancillary chemicals, CMP polishing materials, sputtering targets, packaging substrates, lead frames, bonding wires, ceramic substrates, die attach materials, carbon-based materials, diamond semiconductors, graphite materials, superhard materials, etc.
Compound & Third-Generation Semiconductors: Gallium Nitride (GaN) & Silicon Carbide (SiC), Zinc Oxide (ZnO), diamond, wafers, substrates & epitaxial wafers, power devices, IGBT packaging materials, RF devices & processing equipment, etc.
Power Devices / Automotive Semiconductors: Automotive-grade main control / computing chips, power semiconductors (IGBT & MOSFET), automotive-grade SiC modules, power management ICs, automotive electronic micro-assembly & power devices, packaging & testing equipment, automation equipment, etc.
Computing Power, Storage, AI, CPO (Co-Packaged Optics): AI chips & solutions, computing chips & solutions, algorithm solutions, data storage, co-packaged optical modules, technologies & equipment, etc.
Semiconductor-Enabled Hot Applications & Solutions: Automotive electronics, specialized electronics, 5G, AI, IoT scenario applications, industrial IoT, motor drives, industrial control, etc.
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