

China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO)IC EXPO
China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Profile
The China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) aims to further strengthen communication and cooperation within the semiconductor industry, accelerate breakthroughs in key core technologies, and effectively promote the coordinated development of the semiconductor industrial chain. Organized by the host of the China Electronics Fair, which dates back to 1964, and leveraging its extensive industry resources, the IC EXPO is proudly launched.
The semiconductor industry has become a strategic high ground for global competition among major nations. The China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) facilitates efficient industry-academia-research collaboration and helps strengthen, supplement, and extend the semiconductor industrial chain in the Yangtze River Delta region.
As China's development in high-tech fields increasingly reflects national strategic will, the future chip industry will see greater driving force from state-led initiatives. To decisively win the battle for key core technologies, China's semiconductor industry must continue to strengthen original and leading-edge research, and maintain collaborative efforts to overcome bottlenecks in critical areas.
With China's substantial investments in 5G, AI, IoT, cloud computing, and big data, "new infrastructure" initiatives such as 5G networks and industrial/Internet of Things will drive rapid growth in the semiconductor industry. Supported by national policies and driven by downstream market demands in IoT, smart driving, new energy vehicles, smart terminal manufacturing, and next-generation mobile communications, the market size of China's semiconductor industry has seen significant growth.
Exhibitor List
China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Product Range
Chip Design / Wafer Fabrication: IC design & chips, EDA, MCU, wafer fabrication equipment & components, etc.
Advanced Packaging: Chiplet, SiP packaging, Wafer-Level Packaging (WLP), 3D packaging, Panel-Level Packaging (PLP), TSV/TGV packaging, organic/silicon/glass substrates, packaging substrates, IC substrates, semiconductor packaging materials & equipment, etc.
Semiconductor Dedicated Equipment / Components: Thinning machines, single crystal furnaces, polishing machines, thermal processing equipment, lithography machines, etching machines, ion implantation equipment, CVD/PVD equipment, cleaning equipment, dicing machines, die bonders & wire bonders, testers, handlers, probe stations & components, etc.
Advanced Materials / Carbon Materials / Diamond Semiconductors: Silicon wafers & silicon-based materials, photomask blanks, electronic gases, photoresists & ancillary chemicals, CMP polishing materials, sputtering targets, packaging substrates, lead frames, bonding wires, ceramic substrates, die attach materials, carbon-based materials, diamond semiconductors, graphite materials, superhard materials, etc.
Compound & Third-Generation Semiconductors: Gallium Nitride (GaN) & Silicon Carbide (SiC), Zinc Oxide (ZnO), diamond, wafers, substrates & epitaxial wafers, power devices, IGBT packaging materials, RF devices & processing equipment, etc.
Power Devices / Automotive Semiconductors: Automotive-grade main control / computing chips, power semiconductors (IGBT & MOSFET), automotive-grade SiC modules, power management ICs, automotive electronic micro-assembly & power devices, packaging & testing equipment, automation equipment, etc.
Computing Power, Storage, AI, CPO (Co-Packaged Optics): AI chips & solutions, computing chips & solutions, algorithm solutions, data storage, co-packaged optical modules, technologies & equipment, etc.
Semiconductor-Enabled Hot Applications & Solutions: Automotive electronics, specialized electronics, 5G, AI, IoT scenario applications, industrial IoT, motor drives, industrial control, etc.
China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Booth Sales

China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Ticket Sales


China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Venue
China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO)Community
China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Booth price

Standard booth Configuration

Blank booth Configuration
China (Shanghai) Semiconductor Industry & Application Expo (IC EXPO) Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
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