China Beijing Semiconductor Expo展商名录/电子会刊
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展会基本信息
展商行业
Semiconductor design, packaging, testing, and manufacturing producers (The content of this article belongs exclusively to Juzhan and may not be forwarded without permission)
Raw Materials: Silicon wafers, photoresist, photo masks, electronic gases and special chemical gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging materials
Production Equipment: Single crystal furnace, oxidation furnace, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machine, etching machine, polishing machine, chamfering machine, coating/developing machine, front-end test equipment, wet process equipment, thermal processing, coating equipment, single wafer deposition system, cleaning equipment
Packaging Process and Equipment: Wafer thinning machine, dicing machine, die bonder, wire bonding machine, encapsulation machine, bending equipment, sorting machine, testing machine, robot automation, machine vision, other materials and electronic special equipment, etc.
Testing and Packaging Supporting Products: Probe card, wire bonding, burn-in testing, automated testing, laser cutting and others, grinding fluid, dicing fluid, sealing film (adhesive), high temperature tape, laminated substrate, solder paste, feeder board, wire, flow control, quartz graphite, silicon carbide, etc.
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