Beijing International Semiconductor Exhibition
Exhibitor Directory / E-Catalog

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2021 Beijing International Semiconductor Exhibition
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Beijing International Semiconductor ExhibitionCatalog consultation

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1. The exhibitor directory / e-catalog will be delivered within 1–2 business days by email to the applicant's inbox . Please check your mail (including spam). If you still do not receive it, contact 0571-88535771.

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Fair basics

Name
Beijing International Semiconductor Exhibition
Venue
No.6, East Section of North Third Ring Road, Chaoyang District, Beijing
Short name
CIOE EXPO
Dates
2026.05.14-05.16
Organizer
China Equipment Management Association, China Association of Circulation of Electromechanical Products
Hall
China International Exhibition Center Jingan
Visitors
80000
Exhibitors
360

Industry scope

Semiconductor design, packaging & testing, and manufacturing companies (Copyright belongs to Juzhan. Reproduction without permission is prohibited.)

Semiconductor Raw Materials: Silicon wafers, silicon chips, photoresist, photomasks, electronic & specialty gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging & testing materials

Semiconductor Production Equipment: Single crystal furnaces, oxidation furnaces, diffusion equipment, ion implanters, PVD, CVD, lithography machines, etching machines, polishing machines, edge grinders, coater/developers, front-end metrology & inspection equipment, wet processing equipment, thermal processing equipment, coating equipment, single wafer deposition systems, cleaning equipment

Semiconductor Packaging Processes & Equipment: Wafer thinning machines, dicing saws, die bonders, wire bonders, molding machines, lead forming equipment, handlers, testers, robotic automation, machine vision, other materials and specialized electronic equipment, etc.

Semiconductor Testing & Packaging Supporting Products: Probe cards, wire bonding, burn-in testing, automated testing, laser cutting & others, grinding slurry, dicing liquid, dicing tape/high-temperature tape, laminated substrates, die attach adhesive, loading boards, bonding wires, flow control, quartz & graphite, silicon carbide, etc.

Photos

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Beijing International Semiconductor Exhibition
Date
2026.05.14-05.16
Venue
China International Exhibition Center Jingan

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Directories and e-catalogs are digital goods and cannot be refunded or exchanged.
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You can request an e-invoice from the order page; it will be emailed within about 1–5 business days.