Hangzhou International Semiconductor & Integrated Circuit Industry Innovation Exhibition - Hangzhou Changxin Exhibition (SICE)Catalog consultation
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Fair basics
Industry scope
IC Design / Chips & Applications:IC and related electronic product design, EDA, AI computing chips, memory chips, automotive chips, smart home appliance chips, AI chips, and products for IoT, AI, automotive electronics, smart cities, smart terminals, healthcare, etc.
IC Manufacturing:Semiconductor wafer manufacturing, semiconductor packaging & testing technologies and products.
Advanced Packaging:Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV & TGV), fan-out wafer-level packaging, and related design, materials, testing, and equipment.
Wafer Equipment / Packaging & Testing Equipment:Various precision equipment required for wafer processing, semiconductor packaging equipment, semiconductor testing equipment, IC testing instruments, advanced packaging process equipment (, SiP, 3D packaging), power device equipment, etc.
Compound Semiconductors & Power Devices:Compound semiconductor materials (, GaN, SiC) and related products, including power devices, RF devices, and upstream equipment & materials.
Semiconductor Materials:Monocrystalline silicon, silicon wafers & silicon-based materials, polishing pads, photomasks, sputtering targets, CMP slurry, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.
Core Semiconductor Components:Machine vision, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC parts, robots, quartz components, filters, RF power supplies, ceramic parts, electrostatic chucks (ESC), pressure gauges, pumps, mass flow controllers (MFC), motion control, servo motors, linear modules, cleanroom cable carriers, packaging molds, cooling equipment, induction heaters, etc.
AI Computing Power:AI chips, servers, switches, power supplies, liquid cooling & thermal management systems, etc.
Supporting Facilities & Services:Support products/cleanrooms, general business services/consulting, sales & services, standards & others.
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