China International Semiconductor Packaging Exhibition (ICPF) Tickets

The IC Packaging Show in China is held concurrently with NEPCON China, showcasing the latest technologies and products in the semiconductor packaging and testing industry through exhibits such as “Semiconductor Packaging and Testing Equipment,” the “Semiconductor Packaging Conference,” and an “OSAT Buyer Delegation.” The event will bring together leading industry associations, prominent media outlets, and consulting firms to host a series of seminars, with more than 20 thematic presentations cov

The Exhibition Value of the China International Semiconductor Packaging Fair (ICPF)

• One of the largest and most specialized annual events in China’s semiconductor packaging and testing sector. Co-hosted by the International Economic and Technological Cooperation Center of the Ministry of Industry and Information Technology and Reed Exhibitions, the China International Semiconductor Packaging Fair (IC Packaging Fair, or ICPF) is a core component of NEPCON China, the China Electronics Manufacturing Equipment and Microelectronics Industry Exhibition. Against the backdrop of advanced packaging emerging as a key driver in the post-Moore era and surging demand for power semiconductors, ICPF is widely recognized within the industry as a leading indicator of trends in China’s semiconductor packaging and testing sector, as well as a central platform for companies seeking to expand their access to end-to-end supply chain resources.
• A one-stop exhibition platform covering the entire value chain. The fair encompasses four core segments: SiP and advanced packaging, third-generation semiconductor device packaging, power semiconductor packaging and testing, and optoelectronic semiconductor packaging and testing. From essential equipment such as die attach and pick-and-place machines, wire bonders, molding machines, etching tools, and lithography systems, to peripheral devices like dicing saws, sort‑and‑tape machines, AOI inspection systems, and pull‑force testers, as well as critical materials including silver pastes, heat‑dissipation components, ceramic substrates, bonding wires, and photoresists, the exhibition provides comprehensive coverage of the entire packaging and testing process. Exhibitors can seamlessly connect with partners across the full spectrum—ranging from technology showcases and equipment selection to material procurement and business negotiations.
• Precise matchmaking with core buyers and end‑use applications across the packaging and testing value chain. Leveraging NEPCON China’s robust buyer network, ICPF brings together professional attendees from a wide array of packaging and testing facilities, IC design houses, EMS manufacturers, and end‑application enterprises—including Ampleon, CR Micro, Silan Micro, STMicroelectronics, BYD Semiconductor, Huawei, Xiaomi, CATL, BYD Auto, GAC, SAIC, and many others. Exhibitors gain direct access to purchasing decision‑makers and technical leaders at OSAT packaging plants, IDM‑owned test lines, wafer fabs, IC design firms, and end‑user sectors such as automotive electronics, consumer electronics, and medical electronics, enabling highly effective business connections and market expansion.
• A three‑in‑one format featuring a “Process Demonstration Zone + High‑End Summit + Business Networking”. ICPF uniquely introduces a SiP system‑level packaging production demonstration line, inviting leading equipment suppliers to set up complete SiP packaging lines. Expert technical teams guide visitors through the entire process, explaining equipment principles and workflow. This immersive production‑line experience allows attendees to gain an intuitive understanding of the full packaging process, significantly deepening technical exchanges and enhancing the efficiency of business matchmaking.
• The Unique Value for Chinese Enterprises—A Strategic Engine to Capture Opportunities in Advanced Packaging and Power Semiconductors. Rapid growth in hot applications such as AI chips, data centers, new-energy vehicles, and 5G communications is injecting fresh momentum into the packaging and testing industry, with the market size projected to reach RMB 324.84 billion by 2026. Concurrently, ICPF will host the “Semiconductor Technology and Application Innovation Conference,” featuring three thematic tracks—SiP and advanced packaging, innovative applications of power semiconductors, and packaging and testing processes for optoelectronic devices—and inviting leading companies like Huatian Technology, Tongfu Microelectronics, and ASE, along with industry luminaries, to deliver cutting-edge presentations. Exhibitors will gain timely insights into key industry topics, including trends in advanced packaging technologies, advances in power semiconductor materials, and automotive-grade chip packaging and testing requirements, enabling them to seize a competitive edge in the evolving packaging and testing landscape.