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Electronics, Electrical, Opto, LightSemiconductorsAsiaJapan2027-02
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HomeInternational Fair2027-02 Japan Semiconductors Fair
IC & SENSOR PACKAGING TECHNOLOGY EXPO exhibition logo

IC & SENSOR PACKAGING TECHNOLOGY EXPO

Japan Tokyo IC and Sensor Packaging Technology Exhibition
2027.02.17-02.19
Ticket Booth Exhibitor
9627 ViewsDays to Open: 332 days
1
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ICP: Zhe ICP 18015679policeZhejiang public network Record 33011002013432
Booth:0571-88535771
Audience:0571-89099107
Monday to Sunday 9:00-18:00