

Embedded Systems Expo Spring (Tokyo)Embedded Systems Expo Spring
Embedded Systems Expo Spring (Tokyo) Profile
Embedded Systems Expo Spring (Tokyo) (abbreviated as: ESEC Spring) is Japan's most authoritative exhibition dedicated to embedded systems. It provides attendees with an opportunity to explore EDA tools, co-design tools, co-verification tools, software components, embedded Linux, embedded databases, usability-related solutions, embedded fonts, other software IPs, and more.
Juzhan has successfully organized numerous high-quality enterprises to participate multiple times! The previous edition of Embedded Systems Expo Spring (ESEC Spring) covered a total area of 20,000 square meters, featuring 418 exhibitors from China, South Korea, Hong Kong (China), Dubai, Italy, Brazil, Russia, the United States, India, and other regions, with an attendance of 23,000 visitors. (Copyright of this content belongs to Juzhan. Reproduction without permission is prohibited.)
At Embedded Systems Expo Spring (ESEC Spring), numerous system architects and developers from manufacturers in automotive & transportation equipment, FA (Factory Automation) equipment, precision & medical devices, communications & mobile devices, home appliances & audio/video, and other sectors will attend and engage in intensive business negotiations with exhibitors.
Exhibitor List
Embedded Systems Expo Spring (Tokyo) Product Range
Microprocessors, DSPs & Hardware:MPU/MCU, DSP, ASSP/ASIC, FPGA/PLD, media processors, embedded platforms, etc.
Software:Real-time operating systems (RTOS), middleware, device drivers, software components, embedded Linux, embedded databases, usability-related solutions, embedded fonts, other software IPs, etc.
EDA Design Tools & Systems:EDA tools, co-design tools, co-verification tools, etc.
Development Support Tools:ICE (In-Circuit Emulators), emulators, debuggers, microcomputer chassis, system design tools, oscilloscopes, LSI design/verification tools, etc.
Others:Related products/services (Copyright of this content belongs to Juzhan. Reproduction without permission is prohibited.)
Embedded Systems Expo Spring (Tokyo) Booth Sales

Embedded Systems Expo Spring (Tokyo) Ticket Sales


Embedded Systems Expo Spring (Tokyo) Venue
Embedded Systems Expo Spring (Tokyo) Booth price

Standard booth Configuration

Blank booth Configuration
Embedded Systems Expo Spring (Tokyo) Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Cooperation


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