

Embedded Systems Expo Osaka (ESEC Osaka)Embedded Systems Expo Osaka
Embedded Systems Expo Osaka (ESEC Osaka) Profile
The Embedded Systems Expo Osaka (abbreviated as ESEC Osaka) is the most authoritative embedded systems exhibition in Western Japan. It serves as the premier venue to showcase everything required for embedded systems, ranging from software and components to system integration and development platforms.
The previous edition of ESEC Osaka covered a total exhibition area of 16,000 square meters, featuring 325 exhibiting companies from China, Hong Kong (China), South Korea, Russia, Spain, Italy, Dubai, India, Malaysia, Australia, and other regions, attracting 19,870 visitors.
ESEC Osakaattracts a large number of system, hardware, and software designers, developers, and engineers seeking to introduce new solutions to their businesses. Numerous system architects and developers from manufacturers in the automotive & transportation equipment, factory automation (FA) equipment, precision & medical equipment, communications & mobile devices, and home appliances & audio/video sectors will attend to engage in active business negotiations with exhibitors.
Exhibitor List
Embedded Systems Expo Osaka (ESEC Osaka) Product Range
Microprocessors, DSPs & Hardware:MPU/MCU, DSP, ASSP/ASIC, FPGA/PLD, Media Processors, Embedded Platforms, etc.
Software:Real-Time Operating Systems (RTOS), Middleware, Device Drivers, Software Components, Embedded Linux, Embedded Databases, Usability Solutions, Built-in Fonts, Other Software IP, etc.
EDA Design Tools & Systems:EDA Tools, Co-design Tools, Co-verification Tools, etc.
Development Support Tools:ICE (In-Circuit Emulators), Emulators, Debuggers, Microcomputer Chassis, System Design Tools, Oscilloscopes, LSI Design/Verification Tools, etc.
Others:Related Products & Services (Copyright of this content belongs to JZhan. Reproduction without permission is prohibited.)
Embedded Systems Expo Osaka (ESEC Osaka) Booth Sales

Embedded Systems Expo Osaka (ESEC Osaka) Ticket Sales


Embedded Systems Expo Osaka (ESEC Osaka) Venue
Embedded Systems Expo Osaka (ESEC Osaka) Booth price

Standard booth Configuration

Blank booth Configuration
Embedded Systems Expo Osaka (ESEC Osaka) Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Cooperation


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