

Tokyo Electronics Manufacturing Equipment Expo Expo Profile
The Japan Tokyo Electronics Manufacturing Equipment Exhibition (NEPCON JAPAN) is one of the largest electronics design, research and development, and manufacturing technology exhibitions in Asia. Since its inception in 1972, it has grown alongside the development of the Japanese electronics industry. Every year, the exhibition showcases numerous innovative achievements in the electronics manufacturing industry.
The Japan Tokyo Electronics Manufacturing Equipment Exhibition (NEPCON JAPAN) covers areas including SMT, IC packaging, PCB/PWB, measurement/analysis, electronic components/materials, precision processing. In 2000, it added exhibition sections for IC packaging technology, printed circuit boards, and electronic components, further enhancing the value of the exhibition, making it an "international comprehensive exhibition for electronics R&D, design, and manufacturing". (The content of this article belongs to Juzhan.com exclusively. Unauthorized forwarding is prohibited.)
The Japan Tokyo Electronics Manufacturing Equipment Exhibition (NEPCON JAPAN) had a total exhibition area of 89,100 square meters at the last exhibition, with 2,250 companies participating from China, Hong Kong, South Korea, Singapore, Dubai, Germany, the United States, Australia, Russia, Brazil, etc., and a total of 110,234 people attended the exhibition. It is highly regarded as the best place to understand the latest technologies of the "future electronics industry" by the industry.
Exhibitor List
Tokyo Electronics Manufacturing Equipment Expo Range
Main exhibition areas: SMT machines, solder paste printers, dispensing equipment, carriers, feeders, identification systems/inkjet printers, ERP/SCM, stamping machines, sealing machines, rinsing machines, electromechanical parts, tools, software, rework/repair machines, masks, tape winding machines, carrier forming equipment, laser processors, precision welding machines, factory control and regulation systems, PCB separators, nylon ties, testing/test/measurement equipment, electronic materials, other related products
EMS/Electronic Contract Manufacturing Area: EMS (Professional Electronic Manufacturing Services), talent dispatch services (engineers), factory contracting/solutions, consulting services, various outsourcing services
Welding & Zone: Welding machines, reflow ovens, desoldering machines, soldering irons, solder pots, solder applicators, solder materials/welding agents
Material Handling Equipment Area: Feeding machines, unloading machines, conveyors, automatic classification systems, palletizing robots, depalletizing machines, sorting machines, vertical transportation systems, automated guided vehicles, forklifts, shelving, mobile shelving, pallets, cabinets, other storage facilities
Dust-Free/Static Protection Area: Clean rooms, laminar flow hoods, air showers, particle counters, ion generators, anti-static products, clean room supplies (dust-proof clothing/gloves/masks), clean cloths, vacuum cleaners, other related products
Factory/Facility Equipment Area: Environmental protection/circular utilization products, facility equipment, environmental protection measures, storage containers, various tools (The content of this article belongs to exclusively. Unauthorized forwarding is prohibited.)
Cleaning Equipment&Cleaners Area: Wet-type cleaning equipment, dry-type cleaning equipment, cleaning agents, peripheral products and related devices
Tokyo Electronics Manufacturing Equipment Expo Booth Sales

Tokyo Electronics Manufacturing Equipment Expo Ticket Sales

Tokyo Electronics Manufacturing Equipment Expo Venue
Tokyo Electronics Manufacturing Equipment Expo Booth price

Standard booth Configuration

Blank booth Configuration
Tokyo Electronics Manufacturing Equipment Expo Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Cooperation


INTERNEPCON JAPAN

ELECTROTEST JAPAN

IC & SENSOR PACKAGING TECHNOLOGY EXPO

ELECTRONIC COMPONENTS & MATERIALS EXPO

PWB EXPO

FINE PROCESS TECHNOLOGY EXPO

LED & LASER DIODE TECHNOLOGY EXPO

SMART FACTORY EXPO TOKYO
