China (Suzhou) International Nanotechnology Industry ExpoCHInano

Main Nanotechnology Exhibition Area:Nano-new materials, nanospheres, nano-coatings, nanocomposites, production equipment, dispersion technologies, analytical and testing instruments, novel energy technologies, PM2.5 prevention devices and consumables, etc.

China International Micro‑Nano Manufacturing and Sensors Exhibition:MEMS processing equipment, nanoimprint lithography, microfabrication technologies, analytical testing, MEMS devices, MEMS devices and applications, MEMS fusion bonding technologies, next-generation lithography technologies 

Third-Generation Semiconductor and Applications Exhibition:Gallium nitride (GaN), silicon carbide (SiC), gallium oxide, aluminum nitride, diamond, and other third-generation semiconductor substrates, epitaxial materials, photoresists, photomasks, CMP polishing materials, resist materials, wet electronic chemicals, and other semiconductor materials; as well as semiconductor manufacturing and packaging equipment, specialized electronic devices, compound semiconductor RF components, power devices, LED lighting and display technologies, and related upstream and downstream industrial chains and innovative applications 

Precision Measurement and Analysis Exhibition:Atomic force microscopes, backscatter detectors, metallographic microscopes, polarizing microscopes, fluorescence microscopes, electron microscopes, mass spectrometers, Raman microscopes, biological microscopes, transmission electron microscopes, multiphoton imaging microscopes, desktop scanning electron microscopes, scanning electrochemical microscopes, materials characterization, intelligent fluorescence microscopy systems, electron microscopy analysis, blue-light 3D scanners, and more

MEMS Manufacturing Zone:MEMS wafer fabrication verification—pilot-scale, pilot production, and mass production; MEMS packaging and testing; specialized MEMS processes; failure analysis; production-line equipment, and more

Embodied Perception Zone:Micro-sensors, controllers, actuators, high-performance motors, drives, communication modules, robotic joints, power transmission systems, bio-inspired skin materials, voice pickup/processing, haptic feedback, gesture recognition, LiDAR, and robots for diverse application scenarios including agriculture, logistics, industry, healthcare, defense, and environmental monitoring.

Advanced Electronic Materials Zone:Semiconductor materials such as silicon and germanium, rare-metal materials, compound semiconductor materials, dielectric materials, piezoelectric and ferroelectric materials, conductive metals and their alloys, magnetic materials, optoelectronic materials, electromagnetic shielding materials, electronic ceramics, polymeric materials, insulating dielectric materials, piezoelectric crystal materials, advanced electronic fine-chemicals, electronic textiles, soldering materials, PCB manufacturing materials, and other electronic materials.

Materials Preparation Zone:Tube furnaces, box furnaces, vacuum sintering furnaces, induction furnaces; chemical vapor deposition (CVD), physical vapor deposition (PVD), magnetron sputtering, electron-beam evaporation; ball mills/high-energy ball mills and other nanomilling equipment (dry/wet methods, horizontal mills, three-roll mills, etc.), electrospinning, spray dryers; 3D printing, metal/ceramic/polymer additive manufacturing, hot presses, precision molding of polymeric materials; vacuum systems, centrifuges, molecular pumps, mechanical pumps; glove boxes, supercritical drying equipment, plasma processing equipment, dispersion equipment, and more

Yangtze River Delta Optoelectronics Industry Zone:Optical communication chips, laser diode chips, detector chips, optical switches, infrared sensing chips, MEMS-based optical sensing chips, semiconductor lasers, Mini/Micro LED chips for display applications, OLED light-emitting devices, silicon photonics integration, silicon photonic chips, silicon photonic modules, silicon photonic packaging, optical sensing applications, automotive LiDAR, and more

Photoresist and Consumables Zone:G-line, I-line, KrF, ArF (dry/immersion), EUV photoresists; positive/negative resists; nanoimprint lithography materials; lift-off materials; specialty photoresists; photomasks; anti-reflective coatings; resist coating and development process solutions; resins, polymers, monomers, organic solvents, high-purity reagents, electronic-grade gases, and more 

Finalist Corporate Pavilion:The finalist companies of the NAC Innovation Competition include enterprises engaged in the design, manufacturing, packaging and testing, and application of semiconductor raw material preparation, MEMS devices, power RF devices, sensor devices, discrete devices, optoelectronic devices, and more.

National Third-Generation Semiconductor Technology Innovation Pavilion:Led by the National Third-Generation Semiconductor Innovation Center, this pavilion brings together companies spanning third-generation semiconductor materials—including gallium nitride, silicon carbide (SiC), and sapphire—as well as those involved in design, device development, manufacturing, and end-use applications.