NEPCON JAPAN
Tokyo Electronics Manufacturing Equipment Expo
2026.01.21-01.23
日本东京IC与传感器封装技术展览会
IC & SENSOR PACKAGING TECHNOLOGY EXPO
3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
Annual
1 / 1
Area
1.6万㎡
Exhibitor
375
Attendee
18k
Exhibitor List ¥280 Ticket ¥300
0
Days to Open: 34days
Photos
9006 Views
Industry:传感器
Organizer:
励展集团
日本东京IC与传感器封装技术展览会 Expo Profile
日本东京IC与传感器封装技术展览会（IC & SENSOR PACKAGING TECHNOLOGY EXPO）是日本领先的专业封装技术展览会。是一个专门展示半导体/传感器及其他电子设备封装技术的展会。
日本东京IC与传感器封装技术展IC & SENSOR PACKAGING TECHNOLOGY EXPO是与半导体、传感器、电子设备、汽车等行业半导体、传感器行业的工程师进行商务洽谈的好地方。
日本东京IC与传感器封装技术展IC & SENSOR PACKAGING TECHNOLOGY EXPO上届展会总面积16000平方米，参展企业375家均来自中国、韩国、中国台湾、印度、泰国、马来西亚、新加坡、土耳其、德国等，参展人数达18240人。该展会专业性强，贸易效果好，吸引了众多的高新技术设备爱好者、使用者及业界观众。（本文内容版权归属聚展所有，未经同意，禁止转发）
Exhibitor List
2023 日本东京IC与传感器封装技术展览会在线展商名录
Exhibitor: 1363
$280
KH
Kawasaki Heavy Industries, Ltd.
Booth No： 54-26 Region: 日本
BI
Brother Industries, Ltd.
Booth No： 56-20 Region: 日本
EE
Emerson Electric Co.
Booth No： 34-8 Region: 美国
TI
TORAY INDUSTRIES, INC.
Booth No： 27-36 Region: 日本
NC
NIKON CORPORATION
Booth No： 14-7 Region: 日本
日本东京IC与传感器封装技术展览会 Range
装备设备、包装材料/组件、IC封装分析/模拟软件、半导体器件/检测设备
SATS/契约设计服务、电镀/蚀刻材料及设备、MEMS设备/封装设备
日本传感器 Related exhibition
exhibitionDetail.boothMap
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日本东京IC与传感器封装技术展览会 Booth Sales
Mr. Wu
日本东京IC与传感器封装技术展览会 Ticket Sales
Mr. Han
日本东京IC与传感器封装技术展览会 Venue
Tokyo Big Sight International Exhibition Center
日本东京IC与传感器封装技术展览会 Booth price
Standard booth Configuration
Carpet
A desk
2~3 chair
A wastebasket
Company board
2~3 spotlight
Two (three) face wall panels
Standard booth Price:View price
For reference only, the actual booth configuration shall prevail
Blank booth Configuration
No facilities included
Comply with pavilion restrictions
Minimum size required
Blank booth Price:View price
For reference only, the actual booth configuration shall prevail
日本东京IC与传感器封装技术展览会 Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Expo Profile
Application
Get Ticket
Exhibitor
Warm
There is a certain risk of change in the exhibition time and location. Please refer to the electronic ticket voucher received. The exhibition will also provide phone and SMS notifications for users who book tickets to avoid travel losses.
Notification
Check for changes in show hours and transportation information at your fingertips.
Public account
Mini program
Cooperation
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7332 Views
Days to Open: 34 days
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6818 Views
Days to Open: 41 days
日本东京IC与传感器封装技术展览会
Ticket : ¥300
ServiceBooth: 0571-88560061
Spectator: 0571-88683357
门票咨询
Mr. Han
金牌项目经理
Tel 0571-88683357
Mobile phone 13336023729
展位咨询
Mr. Wu
金牌项目经理
Tel 0571-88535771
Mobile phone 13867062165
Work time:Monday to Friday09:00-18:00
My
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