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SELECT15th

China Semiconductor Equipment, Materials & Core Components Expo

CSEAC

Dates
Show Hours:
Venue
Suzhou International Expo Center
Highlights
An international specialized trade show targeting the semiconductor equipment materials and core components sectors.
Standard booth
Standard booth|9 m² incl. basic setup
38000 元/9平方
Blank booth
Blank booth|From 18 m², construction not included
3800 元/平方
View Floor PriceBooth Consultation

Exhibition Data

1/1
Edition
70000㎡
Exhibition area
1300
Exhibitors
80000
Visitors

Suzhou Semiconductors Expo Details

The China Semiconductor Equipment, Materials, and Core Components Expo spans eight exhibition halls, with a total exhibition area of 70,000 square meters. It brings together more than 1,300 enterprises, covering key sectors such as semiconductor equipment, core components, critical materials, advanced packaging, and intelligent manufacturing. The event focuses on cutting-edge areas including silicon photonics, co-packaging, humanoid robotics, sensing technologies, and green factory operations, providing a pragmatic platform for technology matchmaking and industrial collaboration across the upstream and downstream segments of the supply chain.
Industry:
Semiconductors fairSuzhouSemiconductors Expo
Organizer:
China Electronics Specialized Equipment Industry Association
City:
JiangsuSuzhou
Venue:
Suzhou International Expo Center
Address:
No. 688, Suzhou Avenue East, Suzhou Industrial Park, Suzhou City

Profile

The China Semiconductor Equipment, Materials & Core Components Expo (CSEAC) has added a new exhibition hall, setting a new record for exhibition space—spanning eight halls with a total area of 70,000 square meters, and expecting over 1,300 exhibitors.

At present, the global semiconductor industry is at a critical juncture marked by technological iteration and reshaped supply–demand dynamics. The explosive growth in AI computing power has created supply–demand gaps, compounded by technological barriers and supply chain volatility. As the world’s largest semiconductor consumer market, China is shifting from simple capacity expansion toward deep industrial-chain collaboration and self-reliance. China’s 15th Five-Year Plan emphasizes seizing the historic opportunities presented by the new round of scientific and technological revolution and industrial transformation, accelerating high-level scientific and technological self-reliance, and leading the development of new-quality productive forces. It also calls for achieving decisive breakthroughs across the entire value chain in key core technologies, particularly in integrated circuits.

This year’s expo features concurrent forums that precisely address cutting-edge areas such as equipment synergy, silicon‑photonics co-packaging, green facility operations, and humanoid robot perception. These initiatives represent an immediate response to the evolving global semiconductor landscape and a proactive implementation of national strategic priorities.

The flagship forum of the China Semiconductor Equipment, Materials & Core Components Expo (CSEAC)—the Annual Semiconductor Equipment Conference of the China Electronics Specialized Equipment Industry Association—brings together representatives from industry regulatory authorities, global industry leaders, and prestigious institutions. Discussions will focus on critical issues such as the current state and strategic positioning of the semiconductor industry, international cooperation trends, and frontier technologies. The event will also unveil major industry announcements, provide insights into supportive policies, and highlight emerging industry trends.

Once again, the China Semiconductor Equipment, Materials & Core Components Expo (CSEAC) will serve as a global focal point for the semiconductor equipment, materials, and core components sectors. For every industry professional, CSEAC is not merely a venue for exhibition viewing; it is an industrial hub for assessing technology roadmaps, calibrating R&D directions, and identifying strategic partners.

CSEAC is the “barometer” event for the semiconductor equipment, materials, and core components industries. Each year, the expo gathers domestic and international companies, experts, and industry organizations along the semiconductor value chain. Through exhibitions, specialized forums, technology launches, and industry matchmaking sessions, participants explore new pathways for high-quality industry development, addressing topics such as semiconductor equipment, core components, critical materials, advanced processes, advanced packaging, smart manufacturing, and talent cultivation in industry–education partnerships.

Concurrent Events and Forums

China Semiconductor Equipment, Materials & Core Components Expo tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

Partial exhibitor directory and exhibitor list for China Semiconductor Equipment, Materials & Core Components Expo: 博纳半导体设备(浙江)有限公司, 浙江新纳陶瓷新材有限公司, 天津元象国际贸易有限公司, 常州市乐萌压力容器有限公司, 上海大族富创得科技股份有限公司, 中微半导体设备(上海)股份有限公司, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

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Highlights of the CSEAC Semiconductor Equipment Annual Conference

  • A Nationally Recognized Authority in the Semiconductor Equipment Industry: Hosted by the China Electronics Special Equipment Industry Association, this annual event ranks among the most prestigious and influential gatherings in the semiconductor equipment sector. Over thirteen editions, it has evolved into a vital bridge for collaboration and market promotion between domestic equipment and component manufacturers and end-user companies, creating tangible business opportunities for Chinese-made products to enter both domestic and international supply chains.
  • Precise Coverage Across the Entire Value Chain: The exhibition areas are meticulously organized around core domains—including semiconductor equipment, key components, critical materials, testing technologies, and ancillary services—spanning everything from wafer fabrication tools and packaging/testing equipment to high-purity photoresists and specialty gases. Seamless integration across the upstream and downstream segments effectively breaks down information silos within the industry.
  • A Global Hub for Connecting Resources: With over 1,000 exhibitors from 23 countries and regions worldwide, including more than 200 international participants, the event brings together leading domestic companies such as NAURA, AMEC, Shengmei Shanghai, and Top-Joy Technology, alongside renowned international brands like New Kaile, BOSCH, SIEMENS, and ZEISS.
  • High-Profile Forums Driving Strategic Insights: Concurrently held were one plenary forum and seventeen specialized forums, featuring over a hundred distinguished industry experts. The Chairpersons’ Forum convened dozens of semiconductor industry leaders to discuss pressing issues, while the specialized forums delved into topics such as post-Moore-era innovation, AI-driven advancements, localization of mature process technologies, multi-dimensional integration, and semiconductor equipment investment and financing.
  • A Precision Platform for Supply-Demand Matching: The “Upstream–Downstream Supply-Demand Matchmaking Session” brought together leading enterprises from wafer fabrication, packaging/testing, and equipment supply sectors, enabling face-to-face interactions with suppliers of equipment, materials, and components. This “one-on-one, point-to-point” approach facilitates efficient connections, generating concrete orders and partnership opportunities for participating companies.
  • Talent Development Through Industry-Education Integration: Nearly 30 prestigious universities, including Tsinghua, Fudan, and Zhejiang University, joined forces with over 100 corporate exhibitors to implement on-site university-enterprise collaboration initiatives. The event featured corporate HR information sessions, university research showcases, and talent-matching fairs, with listed companies such as NAURA, AMEC, and Tongfei Shares conducting live recruitment, providing an effective platform for connecting businesses with skilled professionals.
  • The Advantages of Wuxi’s Industrial Cluster: As a key birthplace of China’s integrated circuit industry, Wuxi maintains the second-largest industrial scale nationwide and has developed a complete value chain encompassing design, manufacturing, packaging/testing, equipment, materials, and supporting infrastructure. This deep-rooted industrial foundation provides robust support for exhibitors seeking precise customer engagement and regional market expansion.
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Range

  • Domestic Equipment and Materials Companies: NAURA, AMEC, Shengmei Shanghai, Top-Joy Technology, Huahai Qingke, Shanghai Microelectronics Equipment, Zhongke Feice, Kaisitong, Jingsheng Electromechanical, Shenyang Fuchuang, CETC No. 48, Sanhuan Group, New Kaile, Tongfei Shares, Xinyuan Micro, Zhi Chun Technology, Jingce Electronics, Changchuan Technology, Huafeng Measurement & Control
  • Renowned International Brands: BOSCH, SIEMENS, ZEISS, KEYENCE, Leica Microsystems, RORZE, MARPOSS, Azbil, Glint Materials, SUSS, Coherent High意, ACS Motion Control, alimex ACP Asia, US CONEC, SilcoTek, Germany’s Nomon Group, Daikin Qingyan Advanced Technology
  • Key Component and Material Brands: Beijing KeYi, Beijing Hua Zhuo Jingke, Beijing Hua Lin Jiaye, Beijing Tong Jia Hongrui, Beijing Yi Sheng Precision, Beijing Zhongke KeYi, Changchun Guanghua Microelectronics, Changzhou Mingsai Robotics, Changzhou Rongdao Precision, Dalian Jiafeng Automation, Shanghai Bitong, Shenyang KeYi, Toto Technology, Wuxi Yiwen, CETC No. 45
  • Universities and Research Institutions: Tsinghua University, Fudan University, Zhejiang University, Jiangnan University, Southeast University, China Electronics Technology Group

Review

In September 2025, the 13th China Semiconductor Equipment Annual Conference was successfully held in Wuxi, achieving milestone results.

This year’s event reached an unprecedented scale, with the exhibition area surpassing 60,000 square meters for the first time—more than a 40% increase over the previous edition. The show brought together over 1,130 exhibitors from 23 countries and regions worldwide, covering the entire semiconductor manufacturing value chain. During the three-day event, it attracted 117,000 professional visitors from around the globe, who engaged in extensive networking and business discussions. On-site purchase intentions totaled RMB 2.65 billion, underscoring the immense commercial appeal of the Wuxi Semiconductor Exhibition as one of the premier industry events in the Asia-Pacific region.

Leading domestic equipment manufacturers took center stage, drawing significant attention. AMEC unveiled six groundbreaking new products spanning etching and atomic layer deposition, highlighting its comprehensive advancements in advanced process technologies. Meanwhile, industry leaders such as NAURA, Top-Joy Technology, Shengmei Semiconductor, and Huahai Qingke showcased their latest solutions for critical processes including thin-film deposition, cleaning, and polishing. The complete exhibitor roster encompassed the full spectrum—from core manufacturing equipment and packaging/testing tools to essential materials and facility support systems—providing a vivid illustration of the breadth and depth of China’s semiconductor industry ecosystem.

This year’s conference clearly highlighted two major trends shaping the industry: the transition of domestic production from “isolated breakthroughs” toward “ecosystem-wide collaboration.” The exhibition served not only as a platform for showcasing cutting-edge equipment but also as a comprehensive review of domestically produced core components and materials, demonstrating strong synergies across the upstream and downstream segments of the supply chain. At the same time, the event focused on the future directions of “digital intelligence and advanced packaging,” with related technologies and solutions garnering widespread interest, signaling that competitive focus is shifting toward higher-value-added segments.

CSEAC 2025 was more than just a successful industry gathering—it sent a clear signal: China’s semiconductor equipment sector has established a robust industrial cluster and, through unprecedented collaborative innovation capabilities, is actively participating in the transformation and reshaping of the global supply chain.

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CSEAC 2027 Venue Map

Suzhou Semiconductors venue floor plan

CSEAC Exhibitior List

China Semiconductor Equipment, Materials & Core Components Expo Range

Is my product suitable?

Wafer fabrication stage

Single-crystal furnaceLithography toolEtcherThin-film deposition equipmentProcessing and inspection equipment

Core components and consumables

EFEMVacuum productsPrecision motion componentsOptical lensesLithography tool core components

Packaging and testing stage

Thinning equipmentDicing equipmentBonding equipmentTesting equipment

Material system

Silicon wafersPhotoresistElectronic gasesPackage substratesBonding wiresEncapsulation resins

Supporting components

Photomask-making equipmentCleanroom engineeringAutomation systems

Booth Sales

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Mr. WuGold-Medal PM

3 Years Booth Sales

2027 Suzhou Semiconductors Ticket Sales

Suzhou Semiconductors Venue

Suzhou International Expo Center
Address: No. 688, Suzhou Avenue East, Suzhou Industrial Park, Suzhou City
Suzhou International Expo Center实拍
Suzhou International Expo Center实拍
Suzhou International Expo Center实景
Suzhou International Expo Center实拍
Suzhou International Expo Center展馆图
Suzhou International Expo Center实景图
Suzhou International Expo Center实拍
Suzhou International Expo Center实景图
Suzhou International Expo Center实景图
Suzhou International Expo Center实景
Suzhou International Expo Center实拍图

Venue transport

Train

From Suzhou Railway Station: Take Metro Line 4 directly from Suzhou Railway Station, ride one stop to “Leqiao Station,” then transfer to Line 1 and continue to “Cultural Expo Center Station.”

From Suzhou North Railway Station: Take Metro Line 2 to “Guangjiannan Road Station,” then transfer to Line 1 and proceed to “Cultural Expo Center Station.”

Suzhou Semiconductors Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
38000 元/9平方
Blank booth
Blank booth|From 18 m², construction not included
3800 元/平方
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition