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China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition

CICE

Dates
Show Hours:
Venue
Highlights
An international trade platform for the semiconductor and integrated circuit industries
Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition

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Exhibition Data

1/1
Edition
30000㎡
Exhibition area
500
Exhibitors
30000
Visitors

Hefei Semiconductors Expo Details

The China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition (CICE) features 11 core exhibition zones spanning 30,000 square meters, covering the entire industry value chain—from IC design and chip manufacturing to third-generation semiconductors, materials and equipment, and packaging and testing. The event brings together cutting-edge technologies such as EDA tools and lithography machines, as well as end‑use applications including automotive electronics and AI computing power. CICE introduces an innovative service model—“pre‑exhibition matchmaking + in‑exhibition networking + post‑exhibition follow‑up”—to facilitate efficient supply‑demand alignment through business negotiations and technical exchanges, helping the semiconductor industry seize multi‑billion‑dollar collaboration opportunities in sectors like 5G and new‑energy vehicles.
Industry:
Semiconductors fairHefeiSemiconductors Expo
Organizer:
Hefei Semiconductor Exhibition Organizing Committee
City:
AnhuiHefei
Venue:
Address:
No. 3899 Jinxiu Avenue, Hefei City

Profile

The China Hefei International Semiconductor and Integrated Circuit Industry Exhibition (CICE) will be held under the theme “Winning the Chip Era, Co‑Creating the Chip Future,” offering exhibitors a global platform for business exchange.

The CICE has once again raised the bar in both scale and quality, with 30,000 square meters of exhibition space divided into 11 core zones that comprehensively cover key segments including IC design/chips, wafer fabrication, third‑generation semiconductors, semiconductor materials, equipment manufacturing, packaging and testing, as well as AI‑plus‑5G applications. From upstream core materials such as EDA tools and photoresists to high‑end manufacturing equipment like lithography machines and etching systems, and down to end‑use products ranging from automotive electronic chips and AI computing chips to SiC/GaN-based third‑generation semiconductor devices, cutting‑edge technologies and innovative breakthroughs will be showcased, providing a holistic view of the industry’s technological evolution and innovation trajectory.

In addition, the exhibition introduces an innovative full‑cycle service model—“pre‑show matching, on‑site matchmaking, and post‑show follow‑up”—featuring one‑on‑one business meetings, new‑product launch events, and technical seminars. This approach breaks down traditional trade fair barriers, facilitates efficient connections between supply and demand, and unlocks collaboration opportunities worth tens of billions of yuan.

At present, the global digital transformation is propelling the semiconductor and integrated circuit industry to become a central engine of growth. The development of 5G, artificial intelligence, new‑energy vehicles, and other sectors all relies heavily on semiconductor chips. While the global market continues to expand, it also brings with it new opportunities and challenges. As a strategic national industry, the semiconductor sector enjoys robust policy support; both the “Made in China 2025” initiative and the 14th Five‑Year Plan designate it as a priority area. Semiconductors and integrated circuits serve as the “heart” of the digital age, driving innovation and transformation across diverse fields. In recent years, the global semiconductor market has grown steadily, and emerging technologies have continued to emerge, presenting both fresh opportunities and pressing challenges for industry development.

Semiconductor technology is reshaping the world, with Anhui leading a new wave of industry advancement. The China Hefei International Semiconductor and Integrated Circuit Industry Exhibition (CICE) invites stakeholders to join this grand industry event where the brilliance of “chips” converges, using technology as a bridge and innovation as wings to jointly write a new chapter of high‑quality development for the semiconductor sector!

China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

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China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Range

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IC Design/Chip Zone

EDAIP DesignEmbedded SoftwareDigital Circuit DesignAnalog and Mixed-Signal Circuit DesignIntegrated Circuit Layout DesignAI ChipsPower Management ChipsIoT Chips5G Communication ChipsAutomotive Electronics ChipsSecurity Control ChipsAnalog-Digital Mixed-Mode RF ChipsMemory ChipsDisplay Driver Chips

Integrated Circuit Manufacturing Zone

Wafer Fabrication PlantsFoundriesAnalog Integrated CircuitsDigital Integrated CircuitsAnalog-Digital Mixed-Mode Integrated Circuits

Materials Zone

Silicon WafersSilicon DiesSingle-Crystal SiliconSilicon WafersPhotoresistChemical ReagentsElectronic GasesPolishing MaterialsPhotoresist MaterialsMetal TargetsCompound Semiconductor Materials

Third-Generation Semiconductor Zone

Silicon Carbide (SiC)Gallium Nitride (GaN)Zinc Oxide (ZnO)Diamond

Equipment Zone

Semiconductor Wafer EquipmentSemiconductor Packaging EquipmentSemiconductor Test EquipmentIC Test Instruments

Packaging and Testing Measurement Systems

Complete Packaging and Testing FacilitiesPackaging and Testing Process Line CompaniesTest Probe StationsTest MachinesSortersPackaging EquipmentPackaging SubstratesLead Frames and Bonding WiresElectronics and Communications InstrumentsElectrical Instruments and MetersEnvironmental Testing Instruments and EquipmentAnalytical InstrumentsCertification and Testing ServicesAutomation Instruments and Meters

Electronic Components Zone

ResistorsCapacitorsPotentiometersVacuum TubesHeat SinksMechanical and Electrical ComponentsConnectorsDiscrete Semiconductor DevicesElectroacoustic DevicesLaser DevicesElectronic Display DevicesOptoelectronic DevicesSensorsPower SuppliesSwitchesMicro and Special MotorsElectronic TransformersRelaysPrinted Circuit BoardsIntegrated CircuitsPiezoelectric DevicesCrystalsQuartzCeramic Magnetic MaterialsSubstrates for Printed Circuit BoardsSpecialized Materials for Electronic Functional ProcessesElectronic Adhesives (Tapes) and Related ProductsElectronic Chemicals and ComponentsMicrowave Components, Microwave Materials for Complete Devices, and Microwave RF Testing InstrumentsSpecialized Software

New-Generation Displays and Smart Terminals

OLEDAMOLEDMini/MicroLED DisplaysIn-Vehicle DisplaysMedical DisplaysEducational DisplaysWearable Displays, VR DisplaysSmart Transportation DisplaysApplication Terminal DisplaysFlexible Displays, Materials, and Equipment

Big Data and Artificial Intelligence

Big Data and AIBig Data and Intelligent ManufacturingBig Data and Smart CitiesBig Data and Health CareBig Data and Financial InnovationBig Data and E‑Commerce

Electronic Intelligent Manufacturing

SMT Technologies and EquipmentAutomotive and Consumer Electronics Assembly EquipmentLaser EquipmentWelding and Dispensing TechnologiesSpecialized Plug-In Equipment TechnologiesAOI/ATE Inspection SystemsProgramming EquipmentESD Anti-Static and Purification Equipment

Smart Factories

Factory Automation and RoboticsAGVs and Smart Warehousing3D PrintingDrive TechnologiesEnd-to-End SolutionsAutomated/Robotics Precision Components and Supporting ProductsSoftware and Development

PCB and Circuit Carrier Manufacturing

Various Types of Circuit BoardsAutomated Circuit Board Processing EquipmentCopper StripsCopper Foil

Connector and Wire Harness Processing

Various ConnectorsPlugsSockets and SwitchesWire Harnesses and Processing Equipment

Electronics and Chemical Materials

PCB Substrates and Auxiliary MaterialsFine Electronic ChemicalsOptoelectronic MaterialsSpecialized Metal Materials for Electronics

Booth Sales

吴经理

Mr. WuGold-Medal PM

3 Years Booth Sales

2027 Hefei Semiconductors Ticket Sales

Hefei Semiconductors Venue

Address: No. 3899 Jinxiu Avenue, Hefei City
Hefei Binhu International Convention and Exhibition Center实景
Hefei Binhu International Convention and Exhibition Center实拍图
Hefei Binhu International Convention and Exhibition Center实拍
Hefei Binhu International Convention and Exhibition Center展馆图
Hefei Binhu International Convention and Exhibition Center实景图

Hefei Semiconductors Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition