Verified: updated on

Hefei Semiconductorslogo

HOT

China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition

CICE

Dates
Show Hours:
Venue
Highlights
An international trade platform for the semiconductor and integrated circuit industries
Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition

0.00

Buy now

Exhibition Data

1/1
Edition
30000㎡
Exhibition area
500
Exhibitors
30000
Visitors

Hefei Semiconductors Expo Details

The China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition (CICE) features 11 core exhibition zones spanning 30,000 square meters, covering the entire industry value chain—from IC design and chip manufacturing to third-generation semiconductors, materials and equipment, and packaging and testing. The event brings together cutting-edge technologies such as EDA tools and lithography machines, as well as end‑use applications including automotive electronics and AI computing power. CICE introduces an innovative service model—“pre‑exhibition matchmaking + in‑exhibition networking + post‑exhibition follow‑up”—to facilitate efficient supply‑demand alignment through business negotiations and technical exchanges, helping the semiconductor industry seize multi‑billion‑dollar collaboration opportunities in sectors like 5G and new‑energy vehicles.
Industry:
Semiconductors fairHefeiSemiconductors Expo
Organizer:
Hefei Semiconductor Exhibition Organizing Committee
City:
AnhuiHefei
Venue:
Address:
No. 3899 Jinxiu Avenue, Hefei City

Profile

The China Hefei International Semiconductor and Integrated Circuit Industry Exhibition (CICE) will be held under the theme “Winning the Chip Era, Co‑Creating the Chip Future,” offering exhibitors a global platform for business exchange.

The CICE has once again raised the bar in both scale and quality, with 30,000 square meters of exhibition space divided into 11 core zones that comprehensively cover key segments including IC design/chips, wafer fabrication, third‑generation semiconductors, semiconductor materials, equipment manufacturing, packaging and testing, as well as AI‑plus‑5G applications. From upstream core materials such as EDA tools and photoresists to high‑end manufacturing equipment like lithography machines and etching systems, and down to end‑use products ranging from automotive electronic chips and AI computing chips to SiC/GaN-based third‑generation semiconductor devices, cutting‑edge technologies and innovative breakthroughs will be showcased, providing a holistic view of the industry’s technological evolution and innovation trajectory.

In addition, the exhibition introduces an innovative full‑cycle service model—“pre‑show matching, on‑site matchmaking, and post‑show follow‑up”—featuring one‑on‑one business meetings, new‑product launch events, and technical seminars. This approach breaks down traditional trade fair barriers, facilitates efficient connections between supply and demand, and unlocks collaboration opportunities worth tens of billions of yuan.

At present, the global digital transformation is propelling the semiconductor and integrated circuit industry to become a central engine of growth. The development of 5G, artificial intelligence, new‑energy vehicles, and other sectors all relies heavily on semiconductor chips. While the global market continues to expand, it also brings with it new opportunities and challenges. As a strategic national industry, the semiconductor sector enjoys robust policy support; both the “Made in China 2025” initiative and the 14th Five‑Year Plan designate it as a priority area. Semiconductors and integrated circuits serve as the “heart” of the digital age, driving innovation and transformation across diverse fields. In recent years, the global semiconductor market has grown steadily, and emerging technologies have continued to emerge, presenting both fresh opportunities and pressing challenges for industry development.

Semiconductor technology is reshaping the world, with Anhui leading a new wave of industry advancement. The China Hefei International Semiconductor and Integrated Circuit Industry Exhibition (CICE) invites stakeholders to join this grand industry event where the brilliance of “chips” converges, using technology as a bridge and innovation as wings to jointly write a new chapter of high‑quality development for the semiconductor sector!

China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

View more

China (Hefei) International Semiconductor and Integrated Circuit Industry Exhibition Range

IC Design/Chip Zone:
  • EDA ,
  • IP Design ,
  • Embedded Software ,
  • Digital Circuit Design ,
  • Analog and Mixed-Signal Circuit Design ,
  • Integrated Circuit Layout Design ,
  • AI Chips ,
  • Power Management Chips ,
  • IoT Chips ,
  • 5G Communication Chips ,
  • Automotive Electronics Chips ,
  • Security Control Chips ,
  • Analog-Digital Mixed-Mode RF Chips ,
  • Memory Chips ,
  • Display Driver Chips
Integrated Circuit Manufacturing Zone:
  • Wafer Fabrication Plants ,
  • Foundries ,
  • Analog Integrated Circuits ,
  • Digital Integrated Circuits ,
  • Analog-Digital Mixed-Mode Integrated Circuits
Materials Zone:
  • Silicon Wafers ,
  • Silicon Dies ,
  • Single-Crystal Silicon ,
  • Silicon Wafers ,
  • Photoresist ,
  • Chemical Reagents ,
  • Electronic Gases ,
  • Polishing Materials ,
  • Photoresist Materials ,
  • Metal Targets ,
  • Compound Semiconductor Materials
Third-Generation Semiconductor Zone:
  • Silicon Carbide (SiC) ,
  • Gallium Nitride (GaN) ,
  • Zinc Oxide (ZnO) ,
  • Diamond
Equipment Zone:
  • Semiconductor Wafer Equipment ,
  • Semiconductor Packaging Equipment ,
  • Semiconductor Test Equipment ,
  • IC Test Instruments
Packaging and Testing Measurement Systems:
  • Complete Packaging and Testing Facilities ,
  • Packaging and Testing Process Line Companies ,
  • Test Probe Stations ,
  • Test Machines ,
  • Sorters ,
  • Packaging Equipment ,
  • Packaging Substrates ,
  • Lead Frames and Bonding Wires ,
  • Electronics and Communications Instruments ,
  • Electrical Instruments and Meters ,
  • Environmental Testing Instruments and Equipment ,
  • Analytical Instruments ,
  • Certification and Testing Services ,
  • Automation Instruments and Meters
Electronic Components Zone:
  • Resistors ,
  • Capacitors ,
  • Potentiometers ,
  • Vacuum Tubes ,
  • Heat Sinks ,
  • Mechanical and Electrical Components ,
  • Connectors ,
  • Discrete Semiconductor Devices ,
  • Electroacoustic Devices ,
  • Laser Devices ,
  • Electronic Display Devices ,
  • Optoelectronic Devices ,
  • Sensors ,
  • Power Supplies ,
  • Switches ,
  • Micro and Special Motors ,
  • Electronic Transformers ,
  • Relays ,
  • Printed Circuit Boards ,
  • Integrated Circuits ,
  • Piezoelectric Devices ,
  • Crystals ,
  • Quartz ,
  • Ceramic Magnetic Materials ,
  • Substrates for Printed Circuit Boards ,
  • Specialized Materials for Electronic Functional Processes ,
  • Electronic Adhesives (Tapes) and Related Products ,
  • Electronic Chemicals and Components ,
  • Microwave Components, Microwave Materials for Complete Devices, and Microwave RF Testing Instruments ,
  • Specialized Software
New-Generation Displays and Smart Terminals:
  • OLED ,
  • AMOLED ,
  • Mini/MicroLED Displays ,
  • In-Vehicle Displays ,
  • Medical Displays ,
  • Educational Displays ,
  • Wearable Displays, VR Displays ,
  • Smart Transportation Displays ,
  • Application Terminal Displays ,
  • Flexible Displays, Materials, and Equipment
Big Data and Artificial Intelligence:
  • Big Data and AI ,
  • Big Data and Intelligent Manufacturing ,
  • Big Data and Smart Cities ,
  • Big Data and Health Care ,
  • Big Data and Financial Innovation ,
  • Big Data and E‑Commerce
Electronic Intelligent Manufacturing:
  • SMT Technologies and Equipment ,
  • Automotive and Consumer Electronics Assembly Equipment ,
  • Laser Equipment ,
  • Welding and Dispensing Technologies ,
  • Specialized Plug-In Equipment Technologies ,
  • AOI/ATE Inspection Systems ,
  • Programming Equipment ,
  • ESD Anti-Static and Purification Equipment
Smart Factories:
  • Factory Automation and Robotics ,
  • AGVs and Smart Warehousing ,
  • 3D Printing ,
  • Drive Technologies ,
  • End-to-End Solutions ,
  • Automated/Robotics Precision Components and Supporting Products ,
  • Software and Development
PCB and Circuit Carrier Manufacturing:
  • Various Types of Circuit Boards ,
  • Automated Circuit Board Processing Equipment ,
  • Copper Strips ,
  • Copper Foil
Connector and Wire Harness Processing:
  • Various Connectors ,
  • Plugs ,
  • Sockets and Switches ,
  • Wire Harnesses and Processing Equipment
Electronics and Chemical Materials:
  • PCB Substrates and Auxiliary Materials ,
  • Fine Electronic Chemicals ,
  • Optoelectronic Materials ,
  • Specialized Metal Materials for Electronics

Booth Sales

吴经理

Mr. WuGold-Medal PM

3 Years Booth Sales

2027 Hefei Semiconductors Ticket Sales

Hefei Semiconductors Venue

Address: No. 3899 Jinxiu Avenue, Hefei City
Hefei Binhu International Convention and Exhibition Center实拍
Hefei Binhu International Convention and Exhibition Center实拍
Hefei Binhu International Convention and Exhibition Center实拍图
Hefei Binhu International Convention and Exhibition Center展馆图
Hefei Binhu International Convention and Exhibition Center实拍图

Hefei Semiconductors Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition