Verified: updated on
HOT9th
Chongqing Global Semiconductor Industry Exhibition
GSIE
- Dates
- Show Hours:
- Venue
- CQEXPO
- Highlights
- The only international semiconductor trade show in the Central and Western regions.
Chongqing Global Semiconductor Industry Exhibition Same Period Exhibition
Exhibition Data
- 1/1
- Edition
- 30000㎡
- Exhibition area
- 500
- Exhibitors
- 25000
- Visitors
Chongqing City Semiconductors Expo Details
- Organizer:
- Institute of Electrical and Electronics Engineers (IEEE), Chongqing Electronic Society, Chongqing Semiconductor Association
- City:
- Chongqing
- Venue:
- CQEXPO
- Address:
- No. 66, YuLai Avenue, Yubei District, Chongqing
Profile
The Chongqing Global Semiconductor Industry Exhibition (GSIE) is the only international semiconductor trade show in the central and western regions. Co-organized by the Institute of Electrical and Electronics Engineers (IEEE), the Chongqing Electronic Society, and the Chongqing Semiconductor Association, it is a premier industry event that seamlessly integrates exhibition displays, networking and promotion, supply–demand matchmaking, and interactive experiences.
The Chongqing Global Semiconductor Industry Exhibition (GSIE) has established itself as a high‑end platform for semiconductor showcasing and dialogue, serving as a vital conduit for advancing industrial chain projects and fostering shared opportunities. As one of the most influential specialized semiconductor events in Western China, GSIE has witnessed a steady, year‑on‑year surge in both exhibition scale and participating companies, reflecting the growing interest of semiconductor firms in the dynamic Chongqing–Sichuan market. This trend is underpinned by Chongqing’s robust industrial strengths, strategic initiatives aligned with the Sichuan–Chongqing regional development agenda, and its vast market potential. (Copyright of this content belongs to Jufair; unauthorized reproduction is prohibited.)
The Chongqing Global Semiconductor Industry Exhibition (GSIE)—from targeted invitations to proactive market outreach—has prompted companies to strategically position themselves in the Chongqing–Sichuan region, seizing emerging opportunities. By participating in the exhibition and related events, businesses can comprehensively enhance their brand visibility, expand their professional networks, and strengthen their influence within the industry.
In addition to nine thematic exhibition zones, companies also have the opportunity to engage in a concurrent high‑level event—the Future Semiconductor Industry Development Conference. The conference will focus on pressing issues and cutting‑edge topics in the semiconductor sector, featuring a rich program that includes summit forums, panel discussions, supply–demand matchmaking sessions, site visits, and talent‑exchange activities. The organizing committee will invite leading academicians, distinguished experts, and prominent domestic and international industry leaders to jointly offer insights and recommendations for the future development of China’s semiconductor industry, accelerating the translation and practical application of research and technological breakthroughs.
Since its inception, the Chongqing Global Semiconductor Industry Exhibition (GSIE) has vigorously implemented an innovation‑driven development strategy centered on big data and intelligent technologies, attracting numerous internet giants such as Alibaba, Tencent, Baidu, Changhong, Meituan, ZTE, Xiaomi, OPPO, iFLYTEK, and many others.
Chongqing Global Semiconductor Industry Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for Chongqing Global Semiconductor Industry Exhibition: 宁波地博电气有限公司, 上海辰仪测量技术有限公司, 广东诺能泰自动化技术有限公司, 广东星空科技装备有限公司, 优利德科技(中国)股份有限公司, 深圳市领图电测科技股份有限公司, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
The Exhibition Value of the Chongqing Global Semiconductor Industry Expo (GSIE)
- The Largest and Most Influential Semiconductor Specialty Event in Central and Western China: The Chongqing Global Semiconductor Industry Expo (GSIE), co-organized by prestigious institutions including the Institute of Electrical and Electronics Engineers (IEEE), the Chongqing Electronic Society, and the Chongqing Semiconductor Industry Association, is the only international semiconductor trade show in the central and western regions. With the theme “New Era—Creating a ‘Chip’ Future,” the expo has been successfully held seven times and is widely recognized within the industry as a leading indicator of semiconductor development in Western China and a core platform for fostering synergy among integrated circuit industries in the Chengdu–Chongqing Twin-City Economic Circle.
- A One-Stop Showcase Covering the Entire Industry Chain: The expo encompasses every link in the semiconductor value chain, from IC design and integrated circuit manufacturing to wafer fabrication, packaging and testing, semiconductor materials, equipment production, electronic components, AI + 5G, smart power solutions, automotive electronics, and next-generation displays and intelligent terminals. Exhibitors can engage in comprehensive business matchmaking—from technology demonstrations and brand exposure to commercial negotiations—spanning everything from chip design to wafer production, advanced packaging to automotive-grade semiconductors, and third-generation semiconductor materials to applications in intelligent connected vehicles.
- Precise Access to Core Buyers in the Western Semiconductor Cluster: Sichuan and Chongqing, as strategic hinterlands and economic cores of Western China, are emerging as key destinations for the relocation of the semiconductor industry. Chongqing hosts three major integrated circuit industrial parks—the Liangjiang New Area, the Xiyong Microelectronics Park, and the High-Tech Zone—home to renowned enterprises such as CR Micro, UMC, CETC, and SK Hynix. Meanwhile, Chengdu’s High-Tech Zone attracts global giants like Intel, Texas Instruments, Huawei, and Lenovo. At the last edition, the expo drew 800 prominent companies and 35,000 professional visitors. Exhibitors had direct access to procurement decision-makers from automotive electronics leaders such as Changan Automobile and Seres, as well as end-application firms including BOE, Transsion, and Foxconn.
- Unique Strategic Value for Chinese Enterprises—A Catalyst for Seizing the Sichuan–Chongqing “Chip” High Ground: The 14th Five-Year Plan explicitly identifies integrated circuits as a national strategic priority, with projections indicating that the semiconductor industry in Sichuan and Chongqing will surpass RMB 620 billion between 2025 and 2030. GSIE serves as a critical gateway for Chinese companies to capitalize on both the 14th Five-Year Plan and the dual opportunities presented by the Chengdu–Chongqing Twin-City Economic Circle. Featuring leading players such as Huawei, CR Micro, CETC Chip Group, UMC, San’an STMicro, Xinlian, Aosong Electronics, and Xinling Microelectronics, the expo enables participating enterprises to deeply integrate into the Western semiconductor ecosystem and align with key regional industrial parks and investment promotion initiatives.
- A Specialized Hub for Automotive Electronics and Power Semiconductors: As a major automotive manufacturing hub, Chongqing is home to整车 manufacturers like Changan and Seres, generating robust demand for automotive electronics and semiconductors. The expo features a dedicated Forum on Intelligent Connected Vehicle Technology, focusing on hot topics such as automotive-grade chips, power semiconductors (IGBTs and MOSFETs), SiC modules, and smart cockpit chips. Leading power-device companies—including Aosong Electronics, Ruishi Chuangxin, and Xinling Microelectronics—will showcase their latest innovations, enabling exhibitors to establish precise connections across the Western automotive electronics supply chain.
- Deep Integration with High-End Forums and Industry Resources: Concurrent with the expo, the Future Semiconductor Industry (Chongqing) Development Summit will convene experts to discuss cutting-edge packaging and testing, intelligent connected vehicles, semiconductor supply-chain resilience, and industry–education integration. The main forum will bring together academicians, scholars, and corporate leaders to shape the future of the sector, complemented by specialized events such as the Chengdu–Chongqing Semiconductor Supply-Chain Collaboration Meeting, the Advanced Packaging and Testing Innovation Forum, and the Power Devices and Compound Semiconductor Summit. These forums provide exhibitors with timely access to critical insights on policy developments, technological trends, and market opportunities in the semiconductor industry.
- Chongqing’s Geographical and Industrial Advantages: As a national central city and the operational hub of the New International Land–Sea Trade Corridor, Chongqing boasts nationally designated development and opening-up platforms, including the Liangjiang New Area. Leveraging its strong foundation in the electronic information industry—home to the world’s largest laptop production base, the largest mobile phone manufacturing base in Western China, and an emerging integrated circuit cluster—GSIE offers exhibitors a strategic foothold for accessing both the Western market and markets along the Belt and Road Initiative.
Range
- IC Design and Chip Companies: Huawei, CETC Chip Technology Group, UNISOC, Pingtouge (Chengdu), Chongqing Wuqi Technology, Southwest Integrated Circuit Design (Chongqing), Xinlian Integrated Circuit (Chongqing), HuaDa Jiutian (Chengdu), BYD Semiconductor (Chengdu), Zhenxin Technology (Chengdu), Xinglai Technology, VeriSilicon Microelectronics (Chengdu), Shanghai Anlu Technology Chengdu Branch
- Wafer Fabrication and IDM Companies: CR Microelectronics (Chongqing), Chongqing Wanguo Semiconductor, Chongqing San’an Semiconductor, STMicroelectronics, Texas Instruments Semiconductor (Chengdu), Intel Chengdu
- Packaging, Testing, and Power Devices: United Microelectronics Center (Chongqing), Silpanda Microelectronics (Chongqing), Autus Technology (Chongqing), Yuxin (Chengdu), Sichuan Fulehua Semiconductor, Xinling Microelectronics, Ruishi Chuangxin, Pingwei Industrial, Yuntong Technology
- Semiconductor Materials Companies: Chongqing Chaosi Semiconductor, Chongqing Zhenbao Technology, Chongqing Xinhui Materials, Chongqing Graphene Research Institute, Nansha Wafer
- Semiconductor Equipment Companies: Shanghai Microelectronics Equipment (Group), Aosong Semiconductor, KEYENCE, Senmeixieer, Bo Dian, German ESHA, Tiniu Technology, CETC No. 2, Xinyidong, Ri Lian, Zichen Laser, Guona, Yuhan Precision Machinery, Yikede, Xiandelii, Chuangzhixinlian, Jingchuang, Qinghe Wafer, Futai Purification, Qisheng Precision, Beijing Electronic Measurement Equipment, Zhicheng, Xinhui Lian Group, Shiyuan Technology, Taijida Electronics, Siling Robotics, Meilu Detection, Jinshang Intelligent Manufacturing, Bode Mule, Abulan Technology, Yitang Technology, Baiguang Electronics, Zhanrong Automation, Aiweishi, Mengxun Electronics, Jiadehe, Sunjing Group, Zhongzhi Detection, Lingtu Electrical Measurement
- Automotive Electronics and End-Use Applications: Chongqing Changan Automobile, Seres Group, Deep Blue Automobile, United Automotive Electronics, BOE, Chongqing Transsion Technology, Foxconn Technology Group, Inventec (Chongqing), Vivo Mobile Communications (Chongqing), Gree Electric Appliances (Chongqing)
- Research Institutes and Universities: China Academy of Engineering Physics, relevant research institutes under the China Electronics Technology Group, Xi’an Jiaotong University, Chongqing University, Chongqing Microelectronics Industry Technology Research Institute of University of Electronic Science and Technology, Harbin Institute of Technology, University of Electronic Science and Technology
Review
The 7th Global Semiconductor Industry and Electronic Technology Expo (Chongqing) 2025 was successfully held from May 8 to 10 at the Chongqing International Expo Center. Co-organized by the Sichuan Provincial Electronics Society, the Chongqing Municipal Electronics Society, the Chongqing Semiconductor Industry Association, and the Chongqing Power Supply Society, the event was themed “Innovation-Driven, Collaborative Development” and represented the most significant annual technical exchange and business‑matching platform for the semiconductor industry in China’s central and western regions.
With an exhibition area of 40,000 square meters, the show brought together 800 exhibiting companies, covering hot‑topic fields such as integrated circuit design, manufacturing, packaging and testing, AI + 5G, smart power supplies, and energy‑storage technologies. The exhibitor lineup included renowned names like Huawei, Aosong Electronics, Xinling Microelectronics, United Micro, CR Micro, Ruishi Chuangxin, Shanghai Microelectronics Equipment, relevant units of CETC, Pingwei Industrial, Yuntong Technology, KEYENCE, NIKKISO, Yuejiang Robotics, Hikvision Ruiying, Mutailai, and hundreds of other leading brands. A total of 35,000 professional visitors from across the country attended to explore opportunities and engage in business discussions, collectively charting new prospects for the semiconductor industry.
The expo featured dedicated thematic zones for IC design, integrated circuit manufacturing, packaging and testing, semiconductor materials, equipment manufacturing, electronic components, AI + 5G, and smart power supplies, providing comprehensive coverage of the entire semiconductor and electronics value chain. Among the highlights were cutting‑edge environmental technologies, including an AI‑driven energy‑optimization solution for digital kiln control systems and waste‑slag recycling equipment, offering practical pathways toward a greener industry transformation.
A concurrent Future Semiconductor Industry (Chongqing) Development Summit Forum was also held, comprising a plenary session and nine parallel sub‑forums. The plenary session was chaired by Luo Jiangtao, Vice President of the Chongqing Municipal Electronics Society, with opening remarks delivered by Yang Xiaobo, President of the Sichuan Provincial Electronics Society, and Wang Zhikuan, Vice President of the Chongqing Semiconductor Industry Association. Yang Xiaobo emphasized, “The semiconductor industry is akin to the ‘neurons’ of technological innovation—connecting the future vision of artificial intelligence and the Internet of Everything while driving the pulse of new‑type productive forces in the Chengdu–Chongqing region.”
The summit focused on pressing industry issues. Zhu Tao, Dean of the School of Optoelectronic Engineering at Chongqing University, presented a report titled “Narrow‑Linewidth Lasers and Optical Sensing under Physical Constraints: Pathways to Intelligent Empowerment in Next‑Generation Semiconductor Manufacturing”; Ai Xiaoping, Semiconductor Electronics Solutions Architect at Huawei Technologies, shared insights on “Huawei’s Digital Foundation Accelerating Industry Intelligence”; Chen Zhiyong, General Manager of Xinling Microelectronics, discussed “Specialized Process Technologies for Power Semiconductor Chips”; and Li Jianfeng, Deputy General Manager of Beijing Electronic Measurement Equipment, outlined “The Quality‑Guardian Campaign for Power Semiconductors.”
The Chengdu–Chongqing Semiconductor Industry Chain and Supply Chain Cooperation and Matchmaking Meeting yielded substantial results. During the event, the “Chengdu–Chongqing Integrated Circuit Industry Development Blue Book” was officially released, providing a systematic framework for technological breakthroughs, capital attraction, and talent aggregation in the two cities. Representatives from Huawei, Ruishi Chuangxin, Pingwei Industrial, and other enterprises shared their latest advancements in areas such as intelligent connected vehicles and advanced packaging and testing; meanwhile, universities including Harbin Institute of Technology and University of Electronic Science and Technology highlighted industry‑university collaboration, exploring innovative approaches to align talent development with industry needs.
Attendees agreed that, as the Chengdu–Chongqing Twin‑City Economic Circle continues to deepen, the region is rapidly emerging as a key hub for the relocation and expansion of the semiconductor industry. As the most influential specialized semiconductor expo in China’s central and western regions, GSIE has become a strategic platform for companies to showcase cutting‑edge technologies, connect with customers, gain market insights, and secure a foothold in the western “chip” frontier. The next edition of GSIE is scheduled to take place from May 13 to 15, 2026, at the Chongqing International Expo Center.
GSIE Exhibitior List
Chongqing Global Semiconductor Industry Exhibition Range
- Semiconductor Design ,
- Manufacturing ,
- Packaging and Testing ,
- Integrated Circuits ,
- Embedded Chip Manufacturers
- Silicon Wafers ,
- Single-Crystal Silicon ,
- Silicon Wafers ,
- Silicon-Germanium Materials ,
- SOI Materials ,
- Silicon Materials for Solar Cells ,
- Compound Semiconductor Materials ,
- Electronic Gases ,
- Specialty Chemical Gases ,
- Sputtering Targets ,
- CMP Polishing Materials ,
- Packaging Materials ,
- Quartz Products ,
- Graphite Products ,
- Anti-Static Materials ,
- Nanomaterials
- Semiconductor Packaging Equipment ,
- Semiconductor Diffusion Equipment ,
- Semiconductor Welding Equipment ,
- Semiconductor Cleaning Equipment ,
- Semiconductor Test Equipment ,
- Semiconductor Cooling Equipment ,
- Semiconductor Oxidation Equipment ,
- Semiconductor Production and Processing Machinery and Equipment ,
- Semiconductor Production Test Instruments and Equipment ,
- Single-Crystal Furnaces ,
- Oxidation Furnaces ,
- Ion Implantation Equipment ,
- PVD ,
- CVD and Lithography Machines ,
- Etching Machines ,
- Chamfering Machines ,
- Thermal Processing ,
- Coating Equipment
- Discrete Semiconductor Devices ,
- Conventional Electronics ,
- Power Devices ,
- Sensor Devices ,
- Lead Frames
- EDA ,
- Semiconductors ,
- Integrated Circuit Applications and Solutions ,
- Device Products and Application Technologies ,
- Applications of ICs and Commercial Information Terminals
- LPC Optical Splitter Wafers ,
- Optoelectronic Integrated Chips ,
- Electron Sources ,
- LED Chips ,
- LED Devices ,
- LED Packaging and Testing Equipment
- IC Products and Application Technologies ,
- IC Testing Methods and Instruments ,
- IC Design and Design Tools ,
- IC Manufacturing and Packaging
- Resistors ,
- Capacitors ,
- Crystals ,
- Diodes/Transistors ,
- Potentiometers ,
- Connectors ,
- Relays ,
- Switching Components
Booth Sales
Mr. WuGold-Medal PM
3 Years Booth Sales
2027 Chongqing City Semiconductors Ticket Sales
Mr. HanGold-Medal PM
3 Years Booth Sales
Ms. LiuGold-Medal PM
3 Years Booth Sales
Chongqing City Semiconductors Venue
Chongqing City Semiconductors Booth Price
Process
- 1.Submit the business license of the company
- 2.Submit product picture and name
- 3.Receive exhibition presentation documents and booth drawings
- 4.Submit booth application form/Sign booth contract
- 5.Pay the contract booth deposit
- 6.Prepare for exhibition