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Shanghai International Semiconductor Technology Conference and Exhibition
SIA
- Dates
- Show Hours:
- Highlights
- A prestigious specialized brand event for the semiconductor industry in East China and across the country.
Shanghai International Semiconductor Technology Conference and Exhibition Same Period Exhibition
Exhibition Data
- 1/1
- Edition
- 40000㎡
- Exhibition area
- 600
- Exhibitors
- 50000
- Visitors
Shanghai Semiconductors Expo Details
- Organizer:
- SIA Organizing Committee
- City:
- Shanghai
- Venue:
- Shanghai New International Expo Centre
- Address:
- No. 2345 Longyang Road, Pudong New Area, Shanghai
Profile
The Shanghai International Semiconductor Technology Conference & Exhibition (SIA) is a prestigious, specialized flagship event for the semiconductor industry in East China and across the nation. This year’s edition is expected to cover an exhibition space of 40,000 square meters, host more than 600 exhibitors, and attract over 50,000 visitors.
The Shanghai International Semiconductor Technology Conference & Exhibition (SIA) focuses on bringing together innovative products, cutting-edge technologies, comprehensive solutions, and emerging business collaboration models within the semiconductor sector. It provides a one-stop platform for brand promotion, product showcasing, and cross‑industry dialogue, fostering seamless communication and integration across the entire value chain.
Driven by supportive policies and robust market dynamics—particularly the rapid growth of domestic industries such as 5G communications, new‑energy vehicles, industrial internet, big data, and photovoltaics—and under the ongoing advancement of the “carbon peak and carbon neutrality” green‑low‑carbon strategy, the third‑generation semiconductor market is steadily gaining traction, with its scale continuously expanding.
As a leading semiconductor industry event renowned for both its scale and influence, the Shanghai International Semiconductor Technology Conference & Exhibition (SIA) aligns with prevailing market trends, offering domestic and international players a unique opportunity to enhance brand visibility and expand their market presence. By serving as a vital conduit for disseminating market insights and facilitating the exchange of advanced technologies, SIA helps chart the course of industry development. Leveraging an internationally oriented platform, it invites stakeholders to jointly explore and unlock the vast potential of the semiconductor market. Let us join forces and create shared opportunities for mutual success!
Shanghai International Semiconductor Technology Conference and Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Shanghai International Semiconductor Technology Conference and Exhibition Range
- Packaging equipment ,
- Diffusion equipment ,
- Soldering equipment ,
- Cleaning equipment ,
- Testing equipment ,
- Refrigeration equipment ,
- Oxidation equipment ,
- Thinning machine ,
- Dicing machine ,
- Mounting machine ,
- Single-crystal furnace ,
- Oxidation furnace ,
- Grinding machine ,
- Heat-treatment equipment ,
- Lithography machine ,
- Etching machine ,
- Polishing machine ,
- Chamfering machine ,
- Ion-implantation equipment ,
- CVD/PVD equipment ,
- Photoresist coating/development machine ,
- Front-end testing equipment ,
- Wet-process equipment ,
- Thermal processing ,
- Coating equipment ,
- Single-wafer deposition system ,
- Die attach machine ,
- Plasma cleaning equipment ,
- Cutting machine ,
- Wafer mounting machine ,
- Bonding machine ,
- Wire bonding machine ,
- Molding machine ,
- Reflow soldering machine ,
- Wave-soldering machine ,
- Bending equipment ,
- Sorting machine ,
- Robotic automation ,
- Machine vision ,
- Other materials and electronics-specific equipment ,
- Coupling machine ,
- Carrier tape forming machine ,
- Inspection equipment ,
- Constant-temperature and constant-humidity test chamber ,
- Sensors ,
- Packaging molds ,
- Test fixtures ,
- Precision slide table ,
- Stepper motor ,
- Valves ,
- Probe station ,
- Cleanroom equipment ,
- Water treatment
- IC and related electronic product design ,
- IC products and application technologies ,
- IC testing methods and testing instruments ,
- IC design and design tools ,
- IC manufacturing and packaging ,
- EDA ,
- IP design ,
- Embedded software ,
- Digital circuit design ,
- Analog and mixed-signal circuit design ,
- Integrated circuit layout design ,
- IDM ,
- Fabless foundry
- Wafer fabrication ,
- SiP advanced packaging ,
- OSATs ,
- EMS ,
- OEMs ,
- IDM ,
- Silicon wafers and IC packaging substrates ,
- Printed circuit boards ,
- Packaging substrates, equipment, assembly, and testing ,
- Packaging design ,
- Testing ,
- Equipment, applications, manufacturing, and packaging/testing ,
- MCU
- Wafer fabrication plant ,
- Wafer foundry ,
- Analog integrated circuits ,
- Digital integrated circuits ,
- Mixed-mode integrated circuit manufacturing ,
- Integrated circuit end products
- Test probe station ,
- Probe card ,
- Testing machine ,
- Sorting machine ,
- Packaging equipment ,
- Packaging substrate ,
- Lead frame bonding wire ,
- Lead bonding ,
- Burn-in testing ,
- Automated testing ,
- Laser cutting ,
- Grinding fluid ,
- Dicing fluid ,
- Sealing film (adhesive) high-temperature tape ,
- Laminated substrate ,
- Mounting adhesive ,
- Loading plate ,
- Wire bonding flow control ,
- Quartz graphite ,
- Silicon carbide
- Third-generation silicon carbide SiC ,
- Gallium nitride GaN ,
- Wafer ,
- Substrate ,
- Packaging ,
- Testing ,
- Light-emitting diode LED ,
- Laser LD ,
- Ultraviolet detector ,
- Power electronics devices ,
- Diodes ,
- MOSFET ,
- JFET ,
- BJT ,
- IGBT ,
- GTO ,
- ETO ,
- SBD ,
- HEMT ,
- MMIC
- Silicon wafers and silicon-based materials ,
- Silicon wafers ,
- Silicon chips ,
- Single-crystal silicon ,
- Germanium-silicon materials ,
- S01 materials ,
- Silicon materials for solar cells and compound semiconductor materials ,
- Quartz products ,
- Graphite products ,
- Anti-static materials ,
- Encapsulation materials ,
- Ceramic substrates ,
- Chip bonding materials ,
- Photoresist materials ,
- Wet electronic chemicals ,
- Sputtering targets ,
- Dicing ,
- Grinding ,
- Polishing ,
- Thin films
- Resistors ,
- Capacitors ,
- Potentiometers ,
- Electron tubes ,
- Radiators ,
- Electromechanical components ,
- Connectors ,
- Discrete semiconductor devices/IGBTs ,
- Electroacoustic devices ,
- Laser devices ,
- Electronic display devices ,
- Optoelectronic devices ,
- Sensors ,
- Power supplies ,
- Switches ,
- Micro-special motors ,
- Electronic transformers ,
- Relays ,
- Integrated circuits ,
- Piezoelectricity ,
- Crystals ,
- Quartz ,
- Special materials for electronic functional processes ,
- Electronic adhesives (tape) products ,
- Specialized 5G core electronic components ,
- Components ,
- Power management ,
- Storage devices ,
- Cables ,
- Connector devices ,
- Crystal oscillators ,
- Magnetic components ,
- Filtering components ,
- PCB boards ,
- Motor fans ,
- Display devices ,
- Transistors ,
- Switches and component materials and equipment
Booth Sales
Mr. WuGold-Medal PM
3 Years Booth Sales
2027 Shanghai Semiconductors Ticket Sales
Mr. HanGold-Medal PM
3 Years Booth Sales
Ms. LiuGold-Medal PM
3 Years Booth Sales
Shanghai Semiconductors Venue
Shanghai Semiconductors Booth Price
Process
- 1.Submit the business license of the company
- 2.Submit product picture and name
- 3.Receive exhibition presentation documents and booth drawings
- 4.Submit booth application form/Sign booth contract
- 5.Pay the contract booth deposit
- 6.Prepare for exhibition