

Shenzhen Information & Communication Exhibition (CIOE)
Shenzhen Information & Communication Exhibition (CIOE) Profile
The Shenzhen Information & Communication Exhibition (CIOE) is a highly influential professional exhibition for communication technologies in the Asia-Pacific region. The event will centrally showcase new products, technologies, trends, and applications, aiming to create a professional platform integrating business negotiation, international exchange, and brand promotion for communication chip manufacturers, component suppliers, equipment vendors, engineering contractors, and operators.
Held concurrently with the China International Optoelectronic Exposition (CIOE), the exhibition closely follows market developments, utilizes segmented audience data for precise marketing and resource matching, and showcases cutting-edge intelligent manufacturing technologies and innovative comprehensive solutions. It covers segments of the optoelectronic industry chain, including optical communications, lasers, infrared, precision optics, optoelectronic innovation, military-civilian integration, optoelectronic sensing, and data centers.
As a professional exhibition covering the entire information and communication industry chain, the Shenzhen Information & Communication Exhibition (CIOE) has become the preferred platform for numerous enterprises for market expansion and brand promotion. It also provides industry professionals with a one-stop professional platform for business, technical, and academic exchanges to discover new technologies and products and gain market insights.
Exhibitor List
Shenzhen Information & Communication Exhibition (CIOE) Range
Optical Communication Chips & Materials: DFB & EML chips, PIN & APD chips, high-speed modulator chips, tunable laser chips, VCSEL chips, pump laser chips, PLC, AWG, TIA, LD Driver, CDR chips, silicon photonics integration, compound materials & crystals
Optical Communication Components & Modules: Optical transmitter sub-assemblies (TOSA), optical receiver sub-assemblies (ROSA), optical transceiver sub-assemblies, transceiver modules, optical amplifiers, optical pump lasers, optical repeaters, photonic integrated circuits (PICs), optical splitter modules, optical wavelength division multiplexers (WDM), optical demultiplexers, fiber optic connectors, optical isolators, fiber optic couplers, optical splitters, optical circulators, wavelength converters, etc.
Optical Fibers & Cables / Fiber Sensing Systems: Optical preforms, single-mode fibers, multi-mode fibers, plastic optical fibers, large-core fibers, indoor cables, outdoor cables, fiber splice closures, fiber joint boxes, fiber distribution boxes, fiber cross-connect cabinets, patch panels, mechanical splice connectors, fiber optic hydrophones, fiber optic gyroscopes, fiber optic hydraulic sensors, distributed fiber optic temperature sensing systems, fiber optic gas sensors, fiber optic stress sensors, etc.
Optical Testing Instruments & Equipment: Laser/detector chip testing systems, insertion loss testing systems, Optical Time Domain Reflectometers (OTDR), PON optical power meters, LIV testing systems, burn-in power supplies, ellipsometers, spectrometers, bit error rate testers (BERT), eye diagram analyzers, optical variable attenuators, fiber end-face inspection microscopes, coupling test power supplies, adjustable DC power supplies, single/dual wavelength light sources, DWDM light sources, etc.
Optical Communication System Equipment: SDH optoelectronic transmission equipment, Ethernet equipment, optical connection equipment, optical broadband access (EPON, GPON, NG-PON) equipment, OLT equipment, GPON SBU equipment, MDU equipment, XGS-PON smart home gateway equipment, data conversion equipment, optical amplifiers, optical multiplexers, media converters, interface converters, Fibre Channel cards, ICT system equipment, IP Ethernet transmission products
Production System Equipment: Automatic coupling stations, LD automatic eutectic bonding machines, PD automatic eutectic bonding machines, automatic wire bonders, cap sealing machines, helium mass spectrometer leak detectors, high/low temperature cycling chambers, high-temperature burn-in ovens, fiber polishing machines, etc.
Broadcasting & Communication Equipment: Analog optical transmitter sub-assemblies, analog optical receiver sub-assemblies, laser pump sources, analog EDFAs, optical receiver front-end modems, optical transmitters, optical receivers, optical workstations, broadband access equipment
Cloud Data Centers: Ethernet switches, ToR/Leaf switches, optical storage, media converters, servers, hot-swappable AC power modules, server fiber NICs, communication systems, system integration/development, system maintenance & monitoring, HVAC & fresh air systems, fire & security systems, micro-module data centers, etc. (Copyright of this content belongs to Juzhan. Reproduction without permission is prohibited.)
Wireless Communications: Small cells, base station antennas, RF components, RF modules, RF filters, RF power amplifiers, RF switches, high-frequency semiconductors, EMC electromagnetic shielding materials, LCP circuit boards, MPI circuit boards, mobile terminal devices, FSO (Free Space Optics) equipment
Operations & Services: Operations & Services
Shenzhen Information & Communication Exhibition (CIOE) Booth Sales



Shenzhen Information & Communication Exhibition (CIOE) Ticket Sales


Shenzhen Information & Communication Exhibition (CIOE) Venue
Shenzhen Information & Communication Exhibition (CIOE) Booth price

Standard booth Configuration

Blank booth Configuration
Shenzhen Information & Communication Exhibition (CIOE) Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Cooperation


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